Patents by Inventor Hiroshi Ohmi

Hiroshi Ohmi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8691403
    Abstract: A method for anodizing aluminum, wherein an object (29) made of aluminum or an aluminum alloy is anodized in an electrolytic solution (25), and thereby an anodized aluminum film is formed on a surface of the object (29), is provided. The electrolytic solution (25) is comprised of at least one acid selected from organic acids having two or more carboxylic groups, moves at an average speed of 15 cm/sec or less along at least an outer surface of the object (29). The anodization is performed under conditions that a temperature of the outer surface of the object (29) is 80° C. or less, and current density is in a range from 10 to 170 A/dm2.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: April 8, 2014
    Assignee: Denso Corporation
    Inventors: Seiji Amakusa, Tetsuyoshi Naito, Norihiro Tateiwa, Takanobu Iwade, Hiroshi Ohmi, Shinji Kurano, Koichi Yokoyama
  • Publication number: 20110203933
    Abstract: A method for anodizing aluminum, wherein an object (29) made of aluminum or an aluminum alloy is anodized in an electrolytic solution (25), and thereby an anodized aluminum film is formed on a surface of the object (29), is provided. The electrolytic solution (25) is comprised of at least one acid selected from organic acids having two or more carboxylic groups, moves at an average speed of 15 cm/sec or less along at least an outer surface of the object (29). The anodization is performed under conditions that a temperature of the outer surface of the object (29) is 80° C. or less, and current density is in a range from 10 to 170 A/dm2.
    Type: Application
    Filed: December 23, 2009
    Publication date: August 25, 2011
    Applicant: DENSO CORPORATION
    Inventors: Seiji Amakusa, Tetsuyoshi Naito, Norihiro Tateiwa, Takanobu Iwade, Hiroshi Ohmi, Shinji Kurano, Koichi Yokoyama
  • Patent number: 6379755
    Abstract: An electroless plating reaction catalyst is imparted to a substrate and then the catalyst is deactivated or removed at desired locations by irradiating with an energy beam to form groove portions in the substrate.
    Type: Grant
    Filed: February 25, 1993
    Date of Patent: April 30, 2002
    Assignee: Denso Corporation
    Inventors: Hiroshi Ohmi, Hiroshi Shimizu
  • Publication number: 20010048979
    Abstract: The present invention enables selective plating of a substrate by use of the method of removing or deactivating by an argon laser beam L an electroless plating reaction catalyst imparted to the substrate.
    Type: Application
    Filed: February 25, 1993
    Publication date: December 6, 2001
    Inventors: HIROSHI OHMI, HIROSHI SHIMIZU
  • Patent number: 4497693
    Abstract: A method and apparatus for plating an article having a portion that needs no plating at a high speed including as main components a chuck for chucking the article at the portion above stated and a shield cover for enclosing the chuck, maintaining a space therebetween. The space indicated above works to prevent an electrolyte from raising its level, thus keeping said portion out of said the electrolyte.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: February 5, 1985
    Assignee: Nippondenso Co., Ltd.
    Inventors: Ken Ogura, Nobuhiko Yamada, Hiroshi Ohmi