Patents by Inventor Hiroshi Ohuchi

Hiroshi Ohuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for soldering electronic components to printed circuit boards
    Patent number: 6575352
    Abstract: An automated soldering apparatus includes a conveyor for transporting a printed circuit board along a predetermined path, a fluxer located below the conveyor for coating the circuit board and the electronic components with flux, and a preheater located downstream of the fluxer for heating the circuit board and the electronic components to a predetermined temperature. A molten solder bath is provided downstream of the preheater for applying a molten solder to selected areas of the circuit board. A cooling assembly is arranged downstream of and adjacent to the molten solder bath. The cooling assembly is operable to cool the applied molten solder at a rate of approximately as high as 1.0° C. per second until the molten solder reaches its solidus temperature.
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: June 10, 2003
    Assignee: Senju Metal Industry, Co., Ltd.
    Inventors: Kazushi Takahashi, Hiroshi Ohuchi
  • Apparatus and method for soldering electronic components to printed circuit boards
    Publication number: 20020011511
    Abstract: An automated soldering apparatus includes a conveyor for transporting a printed circuit board along a predetermined path, a fluxer located below the conveyor for coating the circuit board and the electronic components with flux, and a preheater located downstream of the fluxer for heating the circuit board and the electronic components to a predetermined temperature. A molten solder bath is provided downstream of the preheater for applying a molten solder to selected areas of the circuit board. A cooling assembly is arranged downstream of and adjacent to the molten solder bath. The cooling assembly is operable to cool the applied molten solder at a rate of approximately as high as 1.0° C. per second until the molten solder reaches its solidus temperature.
    Type: Application
    Filed: July 24, 2001
    Publication date: January 31, 2002
    Inventors: Kazushi Takahashi, Hiroshi Ohuchi