Abstract: A work coordinate generation device includes a shape register section configured to register shape information about a shape of a work region optically defined on a target which is a work target of a work robot; a first recognition section configured to acquire first image data; a first coordinate generation section configured to generate a first work coordinate which represents the work region of the first target based on a result of recognition of the first recognition section; a second recognition section configured to acquire second image data; and a second coordinate generation section configured to generate a second work coordinate which represents the work region of the second target based on the first work coordinate and a result of recognition of the second recognition section.

Abstract: A component mounter images suction states of components picked up by a suction nozzle, processes images of the suction states of the components to recognize the suction state of the component, and stores the images in a storage device with linking production information related to the components. An inspection machine images a mounted state of each component on a board, processes an image of mounted state of each component to recognize the mounted state of each component, and inspects whether a mounting error occurred for each component based on the recognition result. The inspection machine determines that a mounting error occurred for any of the components the image of the mounted state of the component for which a mounting error was determined to have occurred and a searched image of the suction state of the component are displayed on the display monitor in a comparative manner.

Abstract: An abnormality of a gear is more appropriately predicted. An abnormality prediction device of the present disclosure is used in a feeding device including a driving section, a gear connected to the driving section, and a detection section configured to detect a position of a medium fed in accordance with driving of the gear, and intermittently feeding the medium. The abnormality prediction device acquires detection information regarding a feed amount of the medium based on the position of the medium detected over time by the detection section, decomposes the acquired detection information into a trend component regarding a moving average of the gear, a cycle component based on a cycle of the gear, and a random component obtained by excluding the trend component and the cycle component, obtains an abnormality level of the gear based on the cycle component obtained by the decomposition, and outputs the obtained abnormality level.

Abstract: A work coordinate generation device includes a shape register section configured to register shape information about a shape of a work region optically defined on a target which is a work target of a work robot; a first recognition section configured to acquire first image data; a first coordinate generation section configured to generate a first work coordinate which represents the work region of the first target based on a result of recognition of the first recognition section; a second recognition section configured to acquire second image data; and a second coordinate generation section configured to generate a second work coordinate which represents the work region of the second target based on the first work coordinate and a result of recognition of the second recognition section.

Abstract: A management device for a board work machine includes a storage device storing version information in which a current version of software executed by a constitutive device of a board work machine in a production process is associated individually with the multiple constitutive devices and a version designation section configured to designate a version of the software which is to be applied to the production process based on a type of the production process and the version information.

Abstract: An anomaly detection device of a machine tool includes a time series data acquisition section for acquiring target time series data that is the time series data of a moving load in the Z-axis direction of a cutting tool of the machine tool during a drilling process, an evaluation value derivation section for deriving an evaluation value indicating a degree of similarity between at least a part of the acquired target time series data and at least a part of reference time series data that is time series data of the moving load that can be regarded as normal using singular spectrum transformation, and an anomaly determination section for determining the presence or absence of an anomaly of the machine tool based on the derived evaluation value.

Abstract: Component mounting system 1 includes electronic component mounting device 10, control device 100, image processing device 110, and storage device 115. Electronic component mounting device 10 includes mounting head 26, supply device 28, and component camera 90. Electronic component mounting device 10 holds a supplied electronic component with mounting head 26, and images the held electronic component with component camera 90. Controller 102 performs image processing on captured image data with image processing device 110 to determine the acceptability and position of the electronic component (S6). Controller 102 monitors the start and end of the storage period (S10, S13) based on the magnitude relationship between the error rate calculated from the determination result information in the error rate calculation process (S8) and the reference error rate (S9). If the image data captured with component camera 90 is stored within the storage period, controller 102 stores the image data in storage device 115 (S11).

Abstract: An apparatus for performing work on a substrate includes an image processing device acquiring multiple images captured at different positions by performing imaging multiple times after a camera has been moved by a moving device such that a reference mark of a circuit board is within a range inside a field of view of the camera, creating a super resolution image using multi-frame super resolution processing, and recognizing the reference mark. The image processing device performs candidate region search processing of processing the image captured initially to search for a region within the image including a portion that has a possibility of being the reference mark as a candidate region after completion of the initial imaging, performs multi-frame super resolution processing on the candidate region after completion of final image capturing, creates a super resolution image of the candidate region, and recognizes the reference mark.

Abstract: A data management device includes a data management section and a priority setting section. The data management section acquires data related to board work with at least one piece of additional information regarding the board work, and stores the acquired data in a storage device in which a maximum storage amount is set for each additional information. The priority setting section sets a storage priority that is a priority for continuing storage of the acquired data stored in the storage device. The data management section stores the acquired data in the storage device, and deletes the acquired data stored in the storage device in order from the acquired data having a low storage priority set by the priority setting section when the maximum storage amount for at least one piece of the additional information is exceeded.

Abstract: A coordinate data generation device is used in a component mounter configured to perform processing for mounting electronic components on boards of different dimensions by imaging the board that is controlled to be conveyed and stopped at a target position and performing the mounting of the electronic components after correcting for a deviation between a stopping position of the board identified from an image captured by the imaging and a target position, and specifies an imaging region for imaging the board stopped at the stopping position.

Abstract: A transfer state inspection system including a camera configured to capture a transfer state of a transfer material of any of solder, flux, conductive paste, or adhesive transferred to multiple terminals on a lower surface of an electronic component; an image processing section configured to process an image captured by the camera to recognize the transfer state of the transfer material such that the transfer state inspection system inspects the transfer state of the transfer material based on a recognition result of the image processing section; an inspection target specifying section configured to specify whether inspection is necessary for at least a portion of the terminals among the multiple terminals on the lower surface of the electronic component via an operation from an operator or a production program; and an inspection executing section configured to not inspect the transfer state of the transfer material for terminals specified as unnecessary.

Abstract: A component mounter images suction states of components picked up by a suction nozzle, processes images of the suction states of the components to recognize the suction state of the component, and stores the images in a storage device with linking production information related to the components. An inspection machine images a mounted state of each component on a board, processes an image of mounted state of each component to recognize the mounted state of each component, and inspects whether a mounting error occurred for each component based on the recognition result. The inspection machine determines that a mounting error occurred for any of the components the image of the mounted state of the component for which a mounting error was determined to have occurred and a searched image of the suction state of the component are displayed on the display monitor in a comparative manner.

Abstract: A component mounting machine including a camera configured to capture an image of a component held by a suction nozzle; and an image processing section configured to process the image captured by the camera, recognize the shape of the component, and measure shape data of the component; wherein, when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value, the deviation amount of the measurement value of the shape data of the component is compared to a retry determination that is larger than the allowance value, and if the deviation amount of the measurement value of the shape data of the component exceeds the retry determination value, the component is determined to be abnormal and is discarded to a specified discard location.

Abstract: Component mounting system 1 includes electronic component mounting device 10, control device 100, image processing device 110, and storage device 115. Electronic component mounting device 10 includes mounting head 26, supply device 28, and component camera 90. Electronic component mounting device 10 holds a supplied electronic component with mounting head 26, and images the held electronic component with component camera 90. Controller 102 performs image processing on captured image data with image processing device 110 to determine the acceptability and position of the electronic component (S6). Controller 102 monitors the start and end of the storage period (S10, S13) based on the magnitude relationship between the error rate calculated from the determination result information in the error rate calculation process (S8) and the reference error rate (S9). If the image data captured with component camera 90 is stored within the storage period, controller 102 stores the image data in storage device 115 (S11).

Abstract: A management device for a board work machine includes a storage device storing version information in which a current version of software executed by a constitutive device of a board work machine in a production process is associated individually with the multiple constitutive devices and a version designation section configured to designate a version of the software which is to be applied to the production process based on a type of the production process and the version information.

Abstract: A system for creating component shape data for image processing to be used when performing image recognition of a component to be mounted by a component mounter, the system including: a display section; a wire frame drawing section configured to draw a wire frame on top of the component image, and to move a position of a side of the wide frame in accordance with a drag operation of an operator; a minimum unit specifying section configured to specify a minimum unit for when measuring the shape data of the measurement target portion surrounded by the wire frame; and a component shape data creation section configured to create the component shape data for image processing by measuring with an accuracy using the minimum unit specified by the minimum unit specifying section for the shape data of the measurement target portion surrounded by the wire frame.

Abstract: A component picked up by a suction nozzle of a component mounting machine is imaged by a camera, the captured image is processed by an image recognition system to recognize the component, the image is determined to be normal or abnormal based on the recognition result, and in addition to classifying the image as a normal image or an abnormal image and storing the image in a storage device, component mounting boards, unloaded from a component mounting machine, are inspected with an inspection device. A stored image reclassification computer acquires the inspection result from the inspection device, reclassifies the normal image stored in the storage device, based on the inspection result, as an image whose determination as a normal image is suspect or as an image whose determination as a normal image is not suspect, and then stores the normal image in the storage device.

Abstract: A mounting device provided with: a collecting section configured to move a component for which imaging conditions are defined as a range including multiple values to an arrangement position in a state with multiple of the components collected; an imaging section configured to image the multiple components held by the collecting section; and a control section configured to, when the collecting section is holding the multiple components that include imaging conditions with ranges that are not the same, cause the imaging section to image the multiple components using imaging conditions with a shared value among the ranges defined for the multiple components held by the collecting section.

Abstract: Component mounting system 1 includes electronic component mounting device 10, control device 100, image processing device 110, memory device 115, and display 120. Electronic component mounting device 10 includes mounting head 26, supply device 28, and component camera 90, and is configured to use mounting head 26 to pick up an electronic component supplied by supply device 28 and to image the held electronic component using component camera 90. When saving the captured image data on memory device 115, it is determined whether a condition for using a first format is satisfied (S1, S2). When the conditions for using the first format are satisfied (S2: yes), the captured image data is saved on memory device 115 in the first format that is a lossless compression format (S5). When conditions for using the first format are not satisfied (S2: no), the captured image data is saved on memory device 115 in the second format, which is a lossy compression format.

Abstract: A transfer state inspection system including a camera configured to capture a transfer state of a transfer material of any of solder, flux, conductive paste, or adhesive transferred to multiple terminals on a lower surface of an electronic component; an image processing section configured to process an image captured by the camera to recognize the transfer state of the transfer material such that the transfer state inspection system inspects the transfer state of the transfer material based on a recognition result of the image processing section; an inspection target specifying section configured to specify whether inspection is necessary for at least a portion of the terminals among the multiple terminals on the lower surface of the electronic component via an operation from an operator or a production program; and an inspection executing section configured to not inspect the transfer state of the transfer material for terminals specified as unnecessary.