Patents by Inventor Hiroshi Oka

Hiroshi Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134582
    Abstract: An image processing device includes an image processing unit, a UI unit, a VPN processing unit, and a housing. The image processing unit includes a printer and/or a scanner. The UI unit is the target of an input action performed by the user. The VPN processing unit connects to a VPN using authentication information obtained through the UI unit. The image processing unit, the UT unit, and the VPN processing unit are provided to the housing.
    Type: Application
    Filed: August 19, 2021
    Publication date: April 25, 2024
    Inventors: Hiroshi OKA, Shigeki TAKAYA, Hirofumi SUZUKI, Kouichi MARUTA
  • Publication number: 20120083460
    Abstract: Disclosed is a method for improving the solubility of isoquercitrin in water. Also disclosed is a readily water-soluble isoquercitrin composition which has improved solubility in water due to the method. Specifically disclosed is a method for preparing an isoquercitrin inclusion product, which comprises including isoquercitrin in ?-cyclodextrin in the proportion of 2 to 10 mol of ?-cyclodextrin to 1 mol of isoquercitrin.
    Type: Application
    Filed: March 24, 2010
    Publication date: April 5, 2012
    Applicant: SAN EI GEN F.F.I., INC.
    Inventors: Kazuhiro Emura, Hiroshi Oka, Hisashi Tanaka
  • Publication number: 20120015090
    Abstract: Disclosed is a method for improving the solubility of myricitrin in water. Also disclosed is a readily water-soluble myricitrin composition which has improved solubility in water due to the method. Specifically disclosed is a method for preparing a myricitrin inclusion product, which comprises including myricitrin in ?-cyclodextrin in the proportion of 1 to 7 mol of ?-cyclodextrin to 1 mol of myricitrin.
    Type: Application
    Filed: March 24, 2010
    Publication date: January 19, 2012
    Applicant: SAN-EI GEN F.F.I., INC.
    Inventors: Kazuhiro Emura, Hiroshi Oka, Hisashi Tanaka
  • Publication number: 20110217387
    Abstract: A pharmaceutical composition for the treatment of fibromyalgia, which includes pilocarpine or a pharmacologically acceptable salt thereof. The pharmaceutical composition can be used as a novel therapeutic agent for fibromyalgia.
    Type: Application
    Filed: May 15, 2009
    Publication date: September 8, 2011
    Applicant: AXIS, INC.
    Inventors: Kusuki Nishioka, Hiroshi Oka, Rieko Nohara
  • Patent number: 7879877
    Abstract: Novel pharmaceutical composition for accelerating salivation and for prophylaxis and/or treatment of xerostomia, which comprises as an active ingredient a carbostyril compound of the formula (1), wherein R is a halogen atom, and the substitution position of the subsistuent on said carbostyril nucleus is the 3- or 4-position, and the bond between the 3- or 4-positions of the carbostyril nucleus is either a single bond or a double bond, or a pharmaceutically acceptable salt thereof. The pharmaceutical composition of the present invention exhibits an accelerating activity of salivation, and is useful in the prophylaxis or treatment of Xerostomia or hyposalivation.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: February 1, 2011
    Assignees: Otsuka Pharmaceutical Co., Ltd., St. Marianna University School of Medicine
    Inventors: Hisashi Nagamoto, Masayuki Kohashi, Hiroshi Oka
  • Publication number: 20080275315
    Abstract: A major object of this invention is to provide a remote diagnosis apparatus, a remote diagnosis system, a user terminal, a program, a diagnosis program, and a storage for easily diagnosing a pigmentary deposition portion. A user of the system picks up the skin having benign nevus pigmentosus that might be melanoma through a dermoscope using a portable telephone with a camera to which the dermoscope is attached by means of an adapter, accesses to the Internet using an Internet connection function of the portable telephone, and sends the picked up skin image to the remote diagnosis apparatus. After receiving the skin image, the remote diagnosis apparatus uses the melanoma diagnosis program to examine the skin image for melanoma and a disease stage of melanoma if there is melanoma and then sends a result to the user.
    Type: Application
    Filed: January 11, 2005
    Publication date: November 6, 2008
    Inventors: Hiroshi Oka, Masaru Tanaka, Toshiyuki Tanaka, Hitoshi Iyatomi, Masafumi Hagiwara, Masao Yamamoto
  • Patent number: 7392706
    Abstract: A sensor substrate 1 having on its lower surface a surface acoustic wave element 2 for detecting pressure is mounted on a supporting substrate 6 through a sealing member 4 surrounding a sensor section 2. A sealing space S is formed by the sensor substrate 1, the supporting substrate 6, and the sealing member 4, and the surface acoustic wave element 2 for detecting pressure is sealed hermetically in the sealing space S. Reliability can be enhanced by protecting the surface acoustic wave element 2 from the external environment.
    Type: Grant
    Filed: November 26, 2004
    Date of Patent: July 1, 2008
    Assignee: Kyocera Corporation
    Inventors: Kazuhisa Momose, Kaoru Matsuo, Shinichi Shimokihara, Hisayuki Inoue, Masashi Kamada, Hiroshi Tachioka, Kouichi Maruta, Hiroshi Oka
  • Patent number: 7242100
    Abstract: A method for manufacturing a semiconductor device with plural semiconductor chips is provided. The method includes the step of attaching a second semiconductor chip to a first surface of a supporting member in a manner such that a third set of electrodes are wirelessly connected to the supporting member at positions outwardly from an opening of the supporting member. The method also includes the step of mounting a first semiconductor chip to the second semiconductor chip in a manner such that the main surfaces of the first and second semiconductor chips face each other while a first set of electrodes of the first semiconductor chip are wirelessly connected to a second set of electrodes in the opening of the supporting member.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: July 10, 2007
    Assignee: Rohm Co., Ltd.
    Inventor: Hiroshi Oka
  • Publication number: 20070112026
    Abstract: Novel pharmaceutical composition for accelerating salivation and for prophylaxis and/or treatment of xerostornia, which comprises as an active ingredient a carbostyril compound of the formula (1), wherein R is a halogen atom, and the substitution position of the subsistuent on said carbostyril nucleus is the 3- or 4-position, and the bond between the 3- or 4-positions of the carbostyril nucleus is either a single bond or a double bond, or a pharmaceutically acceptable salt thereof. The pharmaceutical composition of the present invention exhibits an accelcrating activity of salivation, and is useful in the prophylaxis or treatment of Xerostomia or hyposalivation.
    Type: Application
    Filed: July 7, 2004
    Publication date: May 17, 2007
    Inventors: Hisashi Nagamoto, Masayuki Kohashi, Hiroshi Oka
  • Publication number: 20050153480
    Abstract: A semiconductor device comprises a plurality of semiconductor chips stacked in the direction of thickness. Each of the semiconductor chips includes an upper surface formed with electrodes. The semiconductor device further comprises a plurality of terminal portions disposed beside these semiconductor chips, and a plural pieces of wire for electrical connection from the electrodes to respective terminal portions. Each of the terminal portions is at an elevation lower than the highest electrodes, and higher than the lowest electrodes.
    Type: Application
    Filed: January 10, 2005
    Publication date: July 14, 2005
    Applicant: ROHM CO., LTD.
    Inventor: Hiroshi Oka
  • Patent number: 6861760
    Abstract: A semiconductor device comprises a plurality of semiconductor chips stacked in the direction of thickness. Each of the semiconductor chips includes an upper surface formed with electrodes. The semiconductor device further comprises a plurality of terminal portions disposed beside these semiconductor chips, and a plural pieces of wire for electrical connection from the electrodes to respective terminal portions. Each of the terminal portions is at an elevation lower than the highest electrodes, and higher than the lowest electrodes.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: March 1, 2005
    Assignee: Rohm Co., Ltd.
    Inventors: Hiroshi Oka, Masaaki Hiromitsu
  • Patent number: 6460858
    Abstract: The compression ring 21 is mounted on the seal ring 20 at the end thereof. The compression ring 21 has the outer circumference projections 30 that are fixed in the groove 40 extending in the axial direction at the inner surface of the flange 22 . With this construction, the compression ring 21 can move in the axial direction and is stopped in the rotational direction. The compression ring 21 is pressed by the springs 23. Thus the compression ring 21 works as a stopper to stop the rotation of the seal ring 20 and as a spring receiver.
    Type: Grant
    Filed: August 1, 2000
    Date of Patent: October 8, 2002
    Assignee: Tanken Seal Seiko Co., Ltd.
    Inventors: Munenari Kitajima, Masayuki Toyoshima, Hiroshi Oka
  • Patent number: 6441495
    Abstract: A semiconductor device comprises a plurality of semiconductor chips stacked in the direction of thickness. Each of the semiconductor chips includes an upper or lower surface formed with electrodes. The semiconductor device further comprises a plurality of terminal portions disposed beside these semiconductor chips, and a plural pieces of wire for electrical connection from the electrodes to respective terminal portions. Each of the terminal portions is at an elevation lower than the highest electrodes, and higher than the lowest electrodes.
    Type: Grant
    Filed: October 5, 1998
    Date of Patent: August 27, 2002
    Assignee: Rohm Co., Ltd.
    Inventors: Hiroshi Oka, Masaaki Hiromitsu
  • Publication number: 20020109237
    Abstract: A semiconductor device comprises a plurality of semiconductor chips stacked in the direction of thickness. Each of the semiconductor chips includes an upper surface formed with electrodes. The semiconductor device further comprises a plurality of terminal portions disposed beside these semiconductor chips, and a plural pieces of wire for electrical connection from the electrodes to respective terminal portions. Each of the terminal portions is at an elevation lower than the highest electrodes, and higher than the lowest electrodes.
    Type: Application
    Filed: April 11, 2002
    Publication date: August 15, 2002
    Applicant: ROHM CO., LTD.
    Inventor: Hiroshi Oka
  • Patent number: 6413797
    Abstract: A semiconductor device includes a semiconductor chip having a main surface formed with an electrode pad, a package containing the semiconductor chip, a component element connected with the electrode pad within the package, a gold bump formed on the electrode pad, and a gold connecting member. The gold connecting member has an end bonded to the gold bump, and the other end bonded to the component.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: July 2, 2002
    Assignee: Rohm Co., Ltd.
    Inventors: Hiroshi Oka, Masaaki Hiromitsu
  • Publication number: 20010014374
    Abstract: An electrode used for plasma treatment includes a conductive support and an insulator provided on the upper surface of the support. The upper surface of the support is divided into a first portion upon which a semiconductor substrate to be treated is mounted, and a second portion around the first portion. The insulator covers at least a part of the second portion of the upper surface of the support.
    Type: Application
    Filed: February 8, 2001
    Publication date: August 16, 2001
    Inventors: Nobuhisa Kumamoto, Takahiro Arakawa, Hiroshi Oka, Toshiyuki Hosoi
  • Publication number: 20010002726
    Abstract: A semiconductor device includes a semiconductor chip having a main surface formed with an electrode pad, a package containing the semiconductor chip, a component element connected with the electrode pad within the package, a gold bump formed on the electrode pad, and a gold connecting member. The gold connecting member has an end bonded to the gold bump, and the other end bonded to the component.
    Type: Application
    Filed: December 15, 2000
    Publication date: June 7, 2001
    Applicant: Rohm Co. Ltd.
    Inventors: Hiroshi Oka, Masaaki Hiromitsu
  • Publication number: 20010000157
    Abstract: A semiconductor device is provided which includes an upper semiconductor chip and a lower semiconductor chip attached to the upper semiconductor chip. The upper semiconductor chip is formed with a first connection pad, while the lower semiconductor chip is formed with a second connection pad. The semiconductor device also includes a deformable stud bump made of gold and arranged between the first and the second connection pads. The deformable stud bump includes an upwardly pointed portion before it is pressed and deformed by the first connection pad of the upper semiconductor chip. The pointed portion serves to break through an oxide film formed on the first connection pad of the upper semiconductor chip. The semiconductor device further includes an adhesive resin layer applied between the upper and lower semiconductor chips.
    Type: Application
    Filed: December 4, 2000
    Publication date: April 5, 2001
    Applicant: ROHM CO., LTD.
    Inventors: Hiroshi Oka, Masaaki Hiromitsu
  • Patent number: 5886161
    Abstract: The process for producing an alkylglycoside, wherein the amount of coarse sugar particles in alkylglycoside can be reduced without reducing reaction yield, is provided.The process for producing an alkylglycoside comprises,a) mixing a hydrated solid sugar with a higher alcohol;b) dehydrating the mixture at a reduced pressure at a temperature of lower than a melting point of the hydrated solid sugar until a water content of the solid sugar becomes not more than 0.5% by weight;c) heating the mixture to 90.degree.-140.degree. C. so that the proportion of particles having a particle diameter of 0.3 mm or more may be not more than 0.1% by weight of the solid sugar in the mixture at the end of this step;d) reacting the mixture with an acid catalyst added thereto at a temperature of 90.degree.-140.degree. C. at a pressure of 5-100 mmHg; ande) neutralizing the acid catalyst contained in the product mixture with an alkali after the reaction has been completed.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: March 23, 1999
    Assignee: Kao Corporation
    Inventors: Hiroshi Oka, Kenichi Tachi
  • Patent number: D689865
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: September 17, 2013
    Assignee: Canon Denshi Kabushiki Kaisha
    Inventors: Teruhiko Kitamura, Masaki Namiki, Shinobu Kato, Minoru Sashida, Hiroshi Oka, Asako Chiba