Patents by Inventor Hiroshi Okabe

Hiroshi Okabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8249544
    Abstract: A directional coupler with a high coupling per unit area and small variations in characteristic at manufacturing capable of achieving a high directivity easily and an RF circuit module provided with the directional coupler are achieved. A main-line is provided on a front surface of a multi-layer substrate, a ground plane is provided on a back surface of the multi-layer substrate. On an inner layer immediately under the main-line, two lines in parallel with the main-line are provided, and one line is provided on a layer closer to the ground plane than the two lines. By connecting the two lines and the one line with vias, a sub-line with a shape of a winding of a loop is formed. In the sub-line, a main component of a vector vertically penetrating the loop is horizontal with respect to the ground plane.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: August 21, 2012
    Assignee: Renesas Electronics Corporation
    Inventor: Hiroshi Okabe
  • Publication number: 20120139659
    Abstract: High-frequency couplers and coupling techniques are described utilizing artificial composite right/left-handed transmission line (CRLH-TL). Three specific forms of couplers are described; (1) a coupled-line backward coupler is described with arbitrary tight/loose coupling and broad bandwidth; (2) a compact enhanced-bandwidth hybrid ring coupler is described with increased bandwidth and decreased size; and (3) a dual-band branch-line coupler that is not limited to a harmonic relation between the bands. These variations are preferably implemented in a microstrip fabrication process and may use lumped-element components. The couplers and coupling techniques are directed at increasing the utility while decreasing the size of high-frequency couplers, and are suitable for use with separate coupler or couplers integrated within integrated devices.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 7, 2012
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Tatsuo Itoh, Christophe Caloz, I-Hsiang Lin, Hiroshi Okabe
  • Publication number: 20120022633
    Abstract: Disclosed herein are representative embodiments of methods, apparatus, and systems used to deliver a prosthetic heart valve to a deficient valve. In one embodiment, for instance, a support structure and an expandable prosthetic valve are advanced through the aortic arch of a patient using a delivery system. The support structure is delivered to a position on or adjacent to the surface of the outflow side of the aortic valve (the support structure defining a support-structure interior). The expandable prosthetic valve is delivered into the aortic valve and into the support-structure interior. The expandable prosthetic heart valve is expanded while the expandable prosthetic heart valve is in the support-structure interior and while the support structure is at the position on or adjacent to the surface of the outflow side of the aortic valve, thereby causing one or more native leaflets of the aortic valve to be frictionally secured between the support structure and the expanded prosthetic heart valve.
    Type: Application
    Filed: July 22, 2011
    Publication date: January 26, 2012
    Inventors: Christopher Olson, Glen T. Rabito, Dustin P. Armer, Minh Ma, Devin Marr, Mark Huang, Hiroshi Okabe, Kevin Stewart, Alison S. Curtis, Philip P. Corso, JR.
  • Patent number: 8081048
    Abstract: A technique for realizing module size reduction while enhancing the anti-ESD characteristic of a low frequency band circuit without the need to add such an element as an ESD filter. In a diplexer included in a high-frequency power amplifier module, a composite grounding inductor with respect to an antenna terminal is formed of three inductors including a series inductor contained in a lowpass filter. Since an ESD signal contains main components thereof belonging to a frequency band of the order of a few hundreds of MHz or lower, the ESD signal is allowed to pass through a lowpass filter with little to no attenuation. Under this condition, a function for ESD filtering from the antenna terminal to an antenna switch circuit is provided by using the composite grounding inductor mentioned above and an electrostatic capacitor element, thereby suppressing passage of the ESD signal to the antenna switch circuit.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: December 20, 2011
    Assignee: Renesas Electronics Corporation
    Inventor: Hiroshi Okabe
  • Patent number: 8072289
    Abstract: High-frequency couplers and coupling techniques are described utilizing artificial composite right/left-handed transmission line (CRLH-TL). Three specific forms of couplers are described; (1) a coupled-line backward coupler is described with arbitrary tight/loose coupling and broad bandwidth; (2) a compact enhanced-bandwidth hybrid ring coupler is described with increased bandwidth and decreased size; and (3) a dual-band branch-line coupler that is not limited to a harmonic relation between the bands. These variations are preferably implemented in a microstrip fabrication process and may use lumped-element components. The couplers and coupling techniques are directed at increasing the utility while decreasing the size of high-frequency couplers, and are suitable for use with separate coupler or couplers integrated within integrated devices.
    Type: Grant
    Filed: May 16, 2008
    Date of Patent: December 6, 2011
    Assignee: The Regents of the University of California
    Inventors: Tatsuo Itoh, Christophe Caloz, I-Hsiang Lin, Hiroshi Okabe
  • Patent number: 8048011
    Abstract: An ultrasonic handpiece for use in operations comprises an oscillation source and a casing unit. The oscillation source has an ultrasonic transducer formed by plural piezoelectric layers layered one on another to form a substantially rod shape having both ends in an axial direction. A radially expanded flange is attached one end of the ultrasonic transducer. The casing unit has a cylindrical casing formed to contain the oscillation source therein, formed to have a blocking layer formed to have a predetermined length in, the axial direction, and positioned to cover both the flange and at least a first piezoelectric layer of the ultrasonic transducer in the axial direction. The casing unit also has a holder holding the oscillation source within the casing using the flange. The blocking layer is in charge of blocking (reducing or preventing) vibration and heat from being transmitted to the outer surface of the casing.
    Type: Grant
    Filed: October 18, 2004
    Date of Patent: November 1, 2011
    Assignee: Olympus Corporation
    Inventor: Hiroshi Okabe
  • Publication number: 20110248389
    Abstract: An upper module board on which an integrated chip component with a low upper temperature limit is mounted and a lower module board on which a heat-generating semiconductor chip, a single chip component and an integrated chip component are mounted are electrically and mechanically connected via a plurality of conductive connecting members, and these are sealed together with mold resin. In such a circumstance, a shield layer made up of a stacked film of a Cu plating film and a Ni plating film is formed on side surfaces of the upper and lower module boards and surfaces (upper and side surfaces) of the mold resin, thereby realizing the electromagnetic wave shield structure.
    Type: Application
    Filed: March 17, 2011
    Publication date: October 13, 2011
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Chiko YORITA, Tsutomu HARA, Hiroshi OKABE, Tomonori TANOUE, Yuji SHIRAI
  • Publication number: 20110090023
    Abstract: High-frequency couplers and coupling techniques are described utilizing artificial composite right/left-handed transmission line (CRLH-TL). Three specific forms of couplers are described; (1) a coupled-line backward coupler is described with arbitrary tight/loose coupling and broad bandwidth; (2) a compact enhanced-bandwidth hybrid ring coupler is described with increased bandwidth and decreased size; and (3) a dual-band branch-line coupler that is not limited to a harmonic relation between the bands. These variations are preferably implemented in a microstrip fabrication process and may use lumped-element components. The couplers and coupling techniques are directed at increasing the utility while decreasing the size of high-frequency couplers, and are suitable for use with separate coupler or couplers integrated within integrated devices.
    Type: Application
    Filed: May 16, 2008
    Publication date: April 21, 2011
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Tatsuo Itoh, Christophe Caloz, I-Hsiang Lin, Hiroshi Okabe
  • Patent number: 7905881
    Abstract: A surgical instrument has a first grasping member, a second grasping member which is provided to the first grasping member to open and close to the first grasping member, and grasps a living tissue between them, an ultrasonic coagulation-cutting unit which includes an ultrasonic vibrating portion provided in one of the first and second grasping members and connected to an ultrasonic transducer to generate ultrasonic vibration, and a pressing portion provided in the other of the first and second grasping members, and facing the ultrasonic vibrating portion, the pressing portion and the ultrasonic vibrating portion pressing the living tissue between them, and a high-frequency coagulation unit which includes a first electrode provided in the first grasping member, and a second electrode provided in the second grasping member, the first electrode and the second electrodes facing each other to coagulate the living tissue.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: March 15, 2011
    Assignee: Olympus Medical Systems Corp.
    Inventors: Shinya Masuda, Taro Miyazawa, Kazunori Taniguchi, Hiroshi Okabe
  • Publication number: 20100230789
    Abstract: A technology is provided which allows a reduction in the size of a semiconductor device without degrading an electromagnetic shielding effect and reliability against reflow heating. After a plurality of components are mounted over a component mounting surface of a module substrate, a resin is formed so as to cover the mounted components. Further, over surfaces (upper and side surfaces) of the resin, a shield layer including a laminated film of a Cu plating film and an Ni plating film is formed. In the shield layer, a plurality of microchannel cracks are formed randomly along grain boundaries and in a net-like configuration without being coupled to each other in a straight line, and form a plurality of paths extending from the resin to a surface of the shield layer by the microchannel cracks.
    Type: Application
    Filed: March 15, 2010
    Publication date: September 16, 2010
    Inventors: Chiko Yorita, Yuji Shirai, Hirokazu Nakajima, Hiroshi Ozaku, Tomonori Tanoue, Hiroshi Okabe, Tsutomu Hara
  • Patent number: 7782451
    Abstract: A target surface of a target object including portions having different curvatures is inspected by using an illuminating device and a camera that are fixed, a supporting device for supporting the target object such that its position and orientation are variable. The position and orientation of the target object are controlled as its image is obtained for a plurality of times. The position and orientation of the target object are controlled such that the image of any point on the target surface will be included in at least one of the images obtained by the camera.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: August 24, 2010
    Assignee: OMRON Corporation
    Inventors: Toshihiko Matsumoto, Hiroshi Okabe, Takashi Kinoshita, Yoshihiro Kanetani
  • Patent number: 7739992
    Abstract: A starting system for a small-sized engine is described which achieves downsizing, light-weight, and cost reduction of the system, prevents entry of dust or foreign substances at the time of assembly, and achieves easy assembly of a motor. The starting system for a small-sized engine includes a recoil starting system and a motor starting system integrated in a starter case, in which the motor starting system has a configuration in which a pinion is mounted on an output shaft of a reducer motor by an one-way clutch of a needle bearing and the pinion is engaged with a starting gear 6 of an engine, and the starter case has a configuration in which an inner lid is secured to a crankcase of the engine together by a screw and the inner lid has a joint portion with respect to the crankcase and a mounting seat for the reducer motor on the outside thereof.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: June 22, 2010
    Assignee: Starting Industrial Co., Ltd.
    Inventor: Hiroshi Okabe
  • Patent number: 7682366
    Abstract: An ultrasonic lithotripter comprising a first transmission probe which has a hollow portion in the form of a through hole and transmits ultrasonic vibration and a superfine second transmission probe which can be passed through the hollow portion of the first transmission probe. An object of manipulation is held by means of the second transmission probe as it is manipulated by means of the first transmission probe.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: March 23, 2010
    Assignee: Olympus Corporation
    Inventors: Tomohisa Sakurai, Koji Shimomura, Shinji Hatta, Naomi Sekino, Hiroshi Okabe, Hiroo Ono, Tsuruo Hatori, Takeaki Nakamura
  • Patent number: 7675384
    Abstract: High-frequency couplers and coupling techniques are described utilizing artificial composite right/left-handed transmission line (CRLH-TL). Three specific forms of couplers are described; (1) a coupled-line backward coupler is described with arbitrary tight/loose coupling and broad bandwidth; (2) a compact enhanced-bandwidth hybrid ring coupler is described with increased bandwidth and decreased size; and (3) a dual-band branch-line coupler that is not limited to a harmonic relation between the bands. These variations are preferably implemented in a microstrip fabrication process and may use lumped-element components. The couplers and coupling techniques are directed at increasing the utility while decreasing the size of high-frequency couplers, and are suitable for use with separate coupler or couplers integrated within integrated devices.
    Type: Grant
    Filed: May 16, 2008
    Date of Patent: March 9, 2010
    Assignee: The Regents of the University of California
    Inventors: Tatsuo Itoh, Christophe Caloz, I-Hsiang Lin, Hiroshi Okabe
  • Publication number: 20100052813
    Abstract: A technique for realizing module size reduction while enhancing the anti-ESD characteristic of a low frequency band circuit without the need to add such an element as an ESD filter. In a diplexer included in a high-frequency power amplifier module, a composite grounding inductor with respect to an antenna terminal is formed of three inductors including a series inductor contained in a lowpass filter. Since an ESD signal contains main components thereof belonging to a frequency band of the order of a few hundreds of MHz or lower, the ESD signal is allowed to pass through a lowpass filter almost intactly. Under this condition, a function for ESD filtering from the antenna terminal to an antenna switch circuit is provided by using the composite grounding inductor mentioned above and an electrostatic capacitor element, thereby suppressing passage of the ESD signal to the antenna switch circuit.
    Type: Application
    Filed: May 29, 2009
    Publication date: March 4, 2010
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventor: Hiroshi OKABE
  • Patent number: 7667555
    Abstract: High-frequency couplers and coupling techniques are described utilizing artificial composite right/left-handed transmission line (CRLH-TL). Three specific forms of couplers are described; (1) a coupled-line backward coupler is described with arbitrary tight/loose coupling and broad bandwidth; (2) a compact enhanced-bandwidth hybrid ring coupler is described with increased bandwidth and decreased size; and (3) a dual-band branch-line coupler that is not limited to a harmonic relation between the bands. These variations are preferably implemented in a microstrip fabrication process and may use lumped-element components. The couplers and coupling techniques are directed at increasing the utility while decreasing the size of high-frequency couplers, and are suitable for use with separate coupler or couplers integrated within integrated devices.
    Type: Grant
    Filed: May 16, 2008
    Date of Patent: February 23, 2010
    Assignee: The Regents of the University of California
    Inventors: Tatsuo Itoh, Christophe Caloz, I-Hsiang Lin, Hiroshi Okabe
  • Patent number: 7656030
    Abstract: Heating elements different in heat generating timing are laminated in a stacked state, and the heating element close to a wiring substrate is allowed to function as a heat diffusion plate for another heating element.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: February 2, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Yasuo Osone, Kenya Kawano, Chiko Yorita, Yu Hasegawa, Yuji Shirai, Naotaka Tanaka, Seiichi Tomoi, Hiroshi Okabe
  • Publication number: 20100012338
    Abstract: According to an aspect of the present invention, there is provided a portable bush cutter including: a pole; a working part that is provided at one end of the pole; an engine part that drives the working part and that is provided at the other end of the pole; a drive shaft that connects the working part and the engine part; a maneuvering handle that is provided on an intermediate portion of the pole along a length direction thereof; and a vibration isolating member that is interposed between the maneuvering handle and the pole.
    Type: Application
    Filed: June 24, 2009
    Publication date: January 21, 2010
    Inventors: Hiroshi Okabe, Takehiko Nishimura
  • Patent number: 7645245
    Abstract: An endoscopic lithotripsy probe apparatus includes a probe, ultrasonic-vibration source, mechanical shock generation source, and switch-mechanism. The ultrasonic-vibration source is detachably attached to the probe to transmit an ultrasonic-vibration to the probe in a state in which the proximal end of the probe is connected to the ultrasonic-vibration source. The mechanical shock generation source, which is disposed on the side of the proximal end of the probe, applies a force to the ultrasonic-vibration source in a state in which the ultrasonic-vibration source is detached from the proximal end of the probe, and allows the ultrasonic-vibration source to collide with the proximal end of the probe so that a mechanical shock is applied to the probe. The switch-mechanism switches a state in which the ultrasonic-vibration from the ultrasonic-vibration source is transmitted to the probe and a state in which the mechanical shock from the mechanical shock generation source is transmitted.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: January 12, 2010
    Assignee: Olympus Corporation
    Inventors: Naomi Sekino, Tsuruo Hatori, Koji Shimomura, Hiroshi Okabe, Shinji Hatta, Hiroo Ono, Tomohisa Sakurai, Takeaki Nakamura
  • Patent number: 7623236
    Abstract: To effectively reduce a measurement error in a parameter indicating a state of spectroscopic polarization generated by variations in retardation of a retarder due to a temperature change or other factors, while holding a variety of properties of a channeled spectroscopic polarimeter. By noting that reference phase functions ?1(?) and ?2(?) are obtained by solving an equation from each vibration component contained in a channeled spectrum P(?), the reference phase functions ?1(?) and ?2(?) are calibrated concurrently with measurement of spectrometric Stokes parameters S0(?), S1(?), S2(?), and S3(?).
    Type: Grant
    Filed: January 11, 2006
    Date of Patent: November 24, 2009
    Assignees: National University Corporation Hokkaido University, OMRON Corporation
    Inventors: Kazuhiko Oka, Atsushi Taniguchi, Hiroshi Okabe