Patents by Inventor Hiroshi Okada

Hiroshi Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240100635
    Abstract: A core material has a core 12; a solder layer 16 made of a (Sn—Bi)-based solder alloy provided on an outer side of the core 12; and a Sn layer 20 provided on an outer side of the solder layer 16. The core contains metal or a resin. When a concentration ratio of Bi contained in the solder layer 16 is a concentration ratio (%)=a measured value of Bi (% by mass)/a target Bi content (% by mass), or a concentration ratio (%)=an average value of measured values of Bi (% by mass)/a target Bi content (% by mass), the concentration ratio is 91.4% to 106.7%. The thickness of the Sn layer 20 is 0.215% or more and 36% or less of the thickness of the solder layer 16.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Shigeki Kondoh, Masato Tsuchiya, Hiroki Sudo, Hiroshi Okada, Daisuke Souma
  • Patent number: 11872656
    Abstract: A core material has a core 12; a solder layer 16 made of a (Sn—Bi)-based solder alloy provided on an outer side of the core 12; and a Sn layer 20 provided on an outer side of the solder layer 16. The core contains metal or a resin. When a concentration ratio of Bi contained in the solder layer 16 is a concentration ratio (%)=a measured value of Bi (% by mass)/a target Bi content (% by mass), or a concentration ratio (%)=an average value of measured values of Bi (% by mass)/a target Bi content (% by mass), the concentration ratio is 91.4% to 106.7%. The thickness of the Sn layer 20 is 0.215% or more and 36% or less of the thickness of the solder layer 16.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: January 16, 2024
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Shigeki Kondoh, Masato Tsuchiya, Hiroki Sudo, Hiroshi Okada, Daisuke Souma
  • Patent number: 11823507
    Abstract: [Object] To provide a recording device capable of acquiring information on behavior of a moving body with high accuracy by using a simple configuration. [Solution] Provided is the recording device including: a sensing unit configured to output data obtained through sensing; a reception unit configured to receive a wireless signal from a signal transmission device provided in a moving body; a recording control unit configured to control start and stop of recording of the data output from the sensing unit, in response to the wireless signal received by the reception unit from the signal transmission device; and a transmission unit configured to transmit the data recorded under the control of the recoding control unit, to an external device.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: November 21, 2023
    Assignee: SONY CORPORATION
    Inventors: Kenji Arashima, Hiroshi Okada, Yukihiro Kobayashi
  • Publication number: 20230269910
    Abstract: A vapor chamber including a container having a cavity portion formed inside, and including a first surface and a second surface opposing the first surface, a working fluid sealed in the cavity portion, and a vapor flow path through which the working fluid in a gas phase flows, the vapor flow path being provided in the cavity portion, wherein a container inner surface area increasing unit including a protruding part is formed on an inner surface of the first surface, and a first wick structure is provided on a surface of the protruding part.
    Type: Application
    Filed: April 27, 2023
    Publication date: August 24, 2023
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Kenya KAWABATA, Yoshikatsu INAGAKI, Hirofumi AOKI, Hiroshi OKADA, Yosuke WATANABE, Hideaki KAWABATA
  • Publication number: 20230177910
    Abstract: The present technology pertains to an information processing apparatus, an information processing method, a beverage container, a beverage server, and an electronic device that make it possible to more simply provide a beverage using a beverage container. Provided is an information processing apparatus equipped with a processing unit that generates purchase information including a purchase condition pertaining to purchase of a beverage and a container identifier identifying a beverage container, and, on the basis of the generated purchase information, performs processing for providing the beverage using the beverage container. For example, the present technology can be applied to a beverage platform that enables an end user to purchase a beverage using a beverage container such as a reusable cup or a reusable bottle.
    Type: Application
    Filed: March 16, 2021
    Publication date: June 8, 2023
    Inventors: MASAHIRO SUEYOSHI, HIROSHI OKADA, HISANORI ARAI
  • Publication number: 20230129147
    Abstract: Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0?Ag×Cu×Ni/P?25, 0.500?Sn×P?0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.
    Type: Application
    Filed: March 10, 2021
    Publication date: April 27, 2023
    Inventors: Yuuki Iijima, Hiroshi Okada, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei, Takahiro Matsufuji
  • Publication number: 20220407009
    Abstract: To provide an n-type dopant capable of providing high charge mobility and controlling the Fermi level. To provide an organic semiconductor layer having high charge mobility, no crystal distortion, no dopant diffusion even at high temperatures, and having a controlled Fermi level. To provide an organic semiconductor devices such as an organic semiconductor solar cells with high power conversion efficiency. An n-type organic semiconductor layer, in which ionic atom encapsulated fullerene neutral substance is doped in a layer made of fullerene. The n-type semiconductor layer is an electron transport layer. N-type dopant including ionic atom encapsulated fullerene neutral substance doped in an organic semiconductor layer.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 22, 2022
    Inventors: Yutaka MATSUO, Hiroshi UENO, Il JEON, Hiroshi OKADA
  • Patent number: 11495566
    Abstract: A core material has a core; a solder layer provided outside the core and being a solder alloy containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and a Sn layer provided outside the solder layer. The solder layer has a thickness of 1 ?m or more on one side. The Sn layer has a thickness of 0.1 ?m or more on one side. A thickness of the Sn layer is 0.215% or more and 36% or less of the thickness of the solder layer.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: November 8, 2022
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Shigeki Kondoh, Masato Tsuchiya, Hiroyuki Iwamoto, Hiroshi Okada, Daisuke Souma
  • Patent number: 11478869
    Abstract: A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: October 25, 2022
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takahiro Hattori, Hiroki Sudo, Hiroshi Okada, Daisuke Souma
  • Publication number: 20220212294
    Abstract: A core material has a core 12; a solder layer 16 made of a (Sn—Bi)-based solder alloy provided on an outer side of the core 12; and a Sn layer 20 provided on an outer side of the solder layer 16. The core contains metal or a resin. When a concentration ratio of Bi contained in the solder layer 16 is a concentration ratio (%)=a measured value of Bi (% by mass)/a target Bi content (% by mass), or a concentration ratio (%)=an average value of measured values of Bi (% by mass)/a target Bi content (% by mass), the concentration ratio is 91.4% to 106.7%. The thickness of the Sn layer 20 is 0.215% or more and 36% or less of the thickness of the solder layer 16.
    Type: Application
    Filed: September 30, 2020
    Publication date: July 7, 2022
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Shigeki KONDOH, Masato TSUCHIYA, Hiroki SUDO, Hiroshi OKADA, Daisuke SOUMA
  • Patent number: 11358514
    Abstract: There is provided a mobile object including an imaging unit configured to capture a perimeter of the mobile object, a speaker configured to be capable of controlling directivity, a determination unit configured to determine whether the mobile object is in a driving mode, and a speaker control unit configured to control the speaker in the driving mode in a manner that predetermined audio is output toward a warning target that is recognized based on a captured image captured by the imaging unit, and to control the speaker in a non-driving mode in a manner that the predetermined audio is output in a non-directional way.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: June 14, 2022
    Assignee: SONY CORPORATION
    Inventors: Yoichiro Sako, Hiroshi Okada, Kazuhiro Watanabe, Kazuyuki Sakoda, Hirofumi Yuchi, Kohei Asada
  • Patent number: 11344976
    Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: May 31, 2022
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa, Hiroshi Takahashi, Hiroshi Kawanago, Satoshi Yokota, Osamu Munekata
  • Publication number: 20220077093
    Abstract: A core material has a core; a solder layer provided outside the core and being a solder alloy containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and a Sn layer provided outside the solder layer. The solder layer has a thickness of 1 ?m or more on one side. The Sn layer has a thickness of 0.1 ?m or more on one side. A thickness of the Sn layer is 0.215% or more and 36% or less of the thickness of the solder layer.
    Type: Application
    Filed: September 10, 2021
    Publication date: March 10, 2022
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Shigeki KONDOH, Masato TSUCHIYA, Hiroyuki IWAMOTO, Hiroshi OKADA, Daisuke SOUMA
  • Publication number: 20210387276
    Abstract: A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 16, 2021
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takahiro HATTORI, Hiroki SUDO, Hiroshi OKADA, Daisuke SOUMA
  • Patent number: 11181185
    Abstract: An eccentric oscillating speed reducer includes an input rotor, a first rotor, a second rotor, a planetary rotor, a flow passage, a contact portion and a radial relief groove. The flow passage includes an axial gap located between the planetary rotor and a contact member. The flow passage conducts a lubricant oil that is forced to flow by a centrifugal force. The contact portion is placed in a drive force transmission path from the planetary rotor to the second rotor. The contact portion includes: a planetary rotor end surface of the planetary rotor located on a side where the second rotor is placed; and a second rotor end surface of the second rotor, which is opposed to the planetary rotor end surface. The radial relief groove forms a portion of the flow passage and extends through a radial width of the planetary rotor end surface.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: November 23, 2021
    Assignee: DENSO CORPORATION
    Inventors: Yukihiro Honda, Hiroshi Okada
  • Publication number: 20210327244
    Abstract: An assistance control method for an assistance system that assists monitoring a monitoring object person includes: an acquisition step of acquiring, from among a plurality of terminal devices, a notification destination terminal device which is a terminal device of a notification destination to be notified of an abnormality of the monitoring object person and is determined in accordance with an abnormal state of the monitoring object person determined by a central processing device; an abnormality notification step of notifying, of the abnormality of the monitoring object person, the notification destination terminal device acquired in the acquisition step; and an information transmission step of transmitting monitoring object person information to the notification destination terminal device from the central processing device in accordance with a transmission request for the monitoring object person information from the notification destination terminal device that has been notified of abnormality of the mon
    Type: Application
    Filed: December 6, 2017
    Publication date: October 21, 2021
    Inventors: Masashi NISHIKADO, Atsuhiro NODA, Hiroshi OKADA, Ken Kitamara
  • Publication number: 20210095930
    Abstract: The vapor chamber includes a container having a hollow cavity and formed of one plate-shaped member and another plate-shaped member facing the one plate-shaped member that are layered on each other, a working fluid enclosed in the cavity, and a wick structure provided in the cavity. The wick structure includes a first wick part extending from a heat receiving part to a heat discharge part and having a first wick member using a linear member, and a second wick part provided to the heat receiving part and having a second wick member using a linear member. An average diameter the linear member of the second wick member is smaller than an average diameter of the linear member of the first wick member or an aperture dimension of the second wick member is smaller than an aperture dimension of the first wick member.
    Type: Application
    Filed: November 24, 2020
    Publication date: April 1, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu Inagaki, Hirofumi Aoki, Daiki Takemura, Hiroshi Okada, Kazuaki Aotani
  • Publication number: 20210022265
    Abstract: The present disclosure provides a cooling device that can exhibit excellent cooling characteristics while avoiding increase in size of the device, and a cooling system using the cooling device. The cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant sealed in an inside of the container, and a condensation tube through which a secondary refrigerant flows, and which penetrates through a gaseous phase portion inside of the container.
    Type: Application
    Filed: October 1, 2020
    Publication date: January 21, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu INAGAKI, Hirofumi AOKI, Hiroshi OKADA, Kenya KAWABATA, Tomoaki TORATANI
  • Publication number: 20200410789
    Abstract: [Object] To provide a recording device capable of acquiring information on behavior of a moving body with high accuracy by using a simple configuration. [Solution] Provided is the recording device including: a sensing unit configured to output data obtained through sensing; a reception unit configured to receive a wireless signal from a signal transmission device provided in a moving body; a recording control unit configured to control start and stop of recording of the data output from the sensing unit, in response to the wireless signal received by the reception unit from the signal transmission device; and a transmission unit configured to transmit the data recorded under the control of the recoding control unit, to an external device.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 31, 2020
    Inventors: KENJI ARASHIMA, HIROSHI OKADA, YUKIHIRO KOBAYASHI
  • Publication number: 20200376607
    Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.
    Type: Application
    Filed: November 21, 2018
    Publication date: December 3, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.,
    Inventors: Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa, Hiroshi Takahashi, Hiroshi Kawanago, Satoshi Yokota, Osamu Munekata