Patents by Inventor Hiroshi Okamura

Hiroshi Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050219738
    Abstract: A disk device has a motor provided on a bottom wall of a case. A PCB is located opposite an outer surface of the bottom wall of the case, and an insulation sheet is sandwiched between the outer surface of the bottom wall and the PCB. The insulation sheet has a sheet body formed of an insulator and located opposite the outer surface of the bottom wall and a plurality of damping members provided independently of one another on the sheet body. The damping members include a first damping member situated near the motor and abutting against the PCB and a second damping member abutting against an electronic component mounted on the PCB.
    Type: Application
    Filed: March 17, 2005
    Publication date: October 6, 2005
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yukio Iida, Jun Nishida, Akio Toda, Hiroshi Okamura
  • Patent number: 6914738
    Abstract: A main controller controls the current in an overshoot part included in the write current supplied from a write driver to a head in accordance with write data via an overshoot controller in accordance with the temperature detected by a temperature sensor.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: July 5, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Seishiro Fujiwara, Hiroshi Okamura, Hiromi Sakata
  • Publication number: 20050121786
    Abstract: A semiconductor device comprises a semiconductor substrate and an interlayer interconnection structure provided on the semiconductor substrate. The interlayer interconnection structure includes a porous insulation film and a conductive part of a conductive material containing a metal as a major component. A volume occupation ratio of pores of a diameter greater than 0.6 nanometers is less than 30% in the porous insulation film.
    Type: Application
    Filed: November 3, 2004
    Publication date: June 9, 2005
    Applicant: Semiconductor Leading Edge Technologies, Inc.
    Inventors: Akira Furuya, Nobuyuki Ohtsuka, Shinichi Ogawa, Hiroshi Okamura
  • Patent number: 6852198
    Abstract: Disclosed is a resin composition for water-resistant and moisture-proof paper comprising 40 to 75 parts by weight of a polyolefin (A), 25 to 60 parts by weight of a tackifier (B) and 0 to 20 parts by weight of a compatibilizing agent (C), the total of (A), (B) and (C) being 100 parts by weight, and further blending 20 to 300 parts by weight of an inorganic filler (D) to 100 parts by weight of the sum of (A), (B) and (C). According to the present invention, the water-resistant and moisture-proof paper is provided at low cost which is disaggregated with ease by a pulper and recycled as paper materials.
    Type: Grant
    Filed: July 6, 2000
    Date of Patent: February 8, 2005
    Assignee: Goyo Paper Working Co., Ltd.
    Inventors: Yukinobu Yamazaki, Michinori Nakamoto, Hiroshi Okamura, Takeshi Yoshida, Hiroshi Kawahara
  • Publication number: 20040259381
    Abstract: In a method for manufacturing a semiconductor device, an insulating film having pores is formed on a substrate, and an opening is formed in the insulating film. Thereafter, a material gas supplying Si or C is supplied to the insulating film. Thereby, deficient elements, such as Si or C, are supplied to the insulating film. Thereafter, in the opening, including a barrier metal, is filled with a conductive member to form a wiring structure.
    Type: Application
    Filed: June 16, 2004
    Publication date: December 23, 2004
    Applicant: Semiconductor Leading Edge Technologies, Inc.
    Inventors: Nobuyuki Ohtsuka, Akira Furuya, Shinichi Ogawa, Hiroshi Okamura
  • Publication number: 20040241883
    Abstract: It is intended to provide a support showing a high immobilization efficiency on which a physiologically active substance can be immobilized at a high density; a method of efficiently analyzing a biological component by using the immobilization support; and a kit for the analysis. A support for immobilizing a physiologically active substance which comprises a support having a carbon, metallic or a semi-metallic carbon compound layer carrying the physiologically active substance formed on the surface thereof; a process for producing the support for immobilizing a physiologically active substance characterized by bringing a support having a carbon, metallic or a semi-metallic carbon compound layer having functional group into contact with the physiologically active substance; a method of analyzing a component in a sample by using the support: and a kit for analyzing a component in a sample which contains the above support.
    Type: Application
    Filed: June 15, 2004
    Publication date: December 2, 2004
    Inventors: Michifumi Tanga, Hiroshi Okamura, Kenichi Takagi, Makoto Amano, Tatsuo Kurosawa
  • Publication number: 20040153868
    Abstract: A service receiving device (1) is provided for a production facility (151, 108, 108a, 108b, 100) such as a component mounting apparatus on the user side, whereas a service providing device (2) is provided for the manufacturer side providing the production facility. These service receiving device (1) and service providing device (2) communicate with each other in a mutual manner or from a necessary side to the other side through various communication systems including the Internet line owing to a software (161, 161a), so that a service relating to response to a trouble or production including the productivity or the quality maintenance is derived or transmitted according to need.
    Type: Application
    Filed: July 10, 2003
    Publication date: August 5, 2004
    Inventors: Satoshi Nonaka, Hitoshi Nakamura, Yoshiyuki Hattori, Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
  • Publication number: 20040132031
    Abstract: It is intended to provide supports for hybridization useful in the fields of molecular biology, biochemistry and the like whereby DNA can be efficiently clarified without injuring the terminal parts of the DNA. A support having an oligonucleotide, a cDNA or a gDNA immobilized thereon which is produced by chemically modifying a support, immobilizing the oligonucleotide, cDNA or gDNA hybridized therewith and then dehybridizing it to thereby give a support for immobilizing a nucleotide having an oligonucleotide boded thereto.
    Type: Application
    Filed: October 29, 2003
    Publication date: July 8, 2004
    Inventors: Hiroshi Okamura, Michifumi Tanga, Kaoru Yamakawa, Mitsuyoshi Ohba, Kenichi Takagi
  • Publication number: 20040035787
    Abstract: For the purpose of providing a particulate support capable of adsorbing a target substance highly specifically at a high density and at greatly elevated recovery efficiency, and a process of separation/purification or extraction. The particulate support is made of a carbonaceous material and/or a carbide and is for use in the separation/purification or extraction of substances related to biological organisms, while the process of separation/purification or extraction of substances related to biological organisms is conducted using the particulate support.
    Type: Application
    Filed: September 2, 2003
    Publication date: February 26, 2004
    Inventors: Michifumi Tanga, Hiroshi Okamura, Kenichi Takagi, Kimitsuna Watanabe, Tsutomu Suzuki, Kojiro Takahashi
  • Publication number: 20040014080
    Abstract: For the purpose of overcoming a conventional art problem of spot detachment during the process of gene analysis (for example, hybridization) by strongly immobilizing biological material samples such as DNA or protein via covalent bonding on a substrate, the invention provides a solid support with a surface-treated layer of hafnium carbide, niob carbide, silicone carbide, tantalum carbide, thorium carbide, titanium carbide, uranium carbide, tungsten carbide or zirconium carbide as formed on the surface thereof so as to enable the immobilization of oligonucleotide or DNA fragment on the surface thereof; a solid support immobilizing oligonucleotide or DNA fragment on the film of the surface-treated layer; and a method for analyzing gene by immobilizing gene on the surface of such solid support.
    Type: Application
    Filed: August 6, 2003
    Publication date: January 22, 2004
    Inventors: Michifumi Tanga, Hironao Okayama, Hiroshi Okamura, Keigo Ehara, Kenichi Takagi
  • Publication number: 20030223143
    Abstract: A main controller controls the current in an overshoot part included in the write current supplied from a write driver to a head in accordance with write data via an overshoot controller in accordance with the temperature detected by a temperature sensor.
    Type: Application
    Filed: April 25, 2003
    Publication date: December 4, 2003
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Seishiro Fujiwara, Hiroshi Okamura, Hiromi Sakata
  • Publication number: 20030190633
    Abstract: A support for fixing a nucleotide which contributes to the efficient clarification of DNA without damaging the terminal parts of the DNA and, therefore, is useful in the fields of biology, biochemistry and the like. This support for fixing a nucleotide is a chemically modified substrate on which oligonucleotide are immobilized characterized in that the oligonucleotide have a restriction enzyme cleavage site. This support is produced by chemically modifying the substrate, immobilizing a single-stranded oligonucleotide thereon, then hybridizing the single-stranded oligonucleotide with another single-stranded oligonucleotide having a base sequence complementary thereto, and ligating an oligonucleotide having a restriction enzyme site at the end thereof.
    Type: Application
    Filed: November 25, 2002
    Publication date: October 9, 2003
    Inventors: Michifumi Tanga, Hiroshi Okamura, Kenichi Takagi, Kojiro Takahashi
  • Publication number: 20020191634
    Abstract: A site diversity method, a digital satellite broadcast receiving method and a digital satellite broadcast receiver are provided which can make a difference of data output timing between a main station and a subsidiary station at the time of site exchange as small as possible and can perform re-synchronization as soon as possible. In the site diversity method for digital satellite broadcast, when a site exchange execution designation signal is received, the site is exchanged during a period of a TMCC information field of a predetermined specific frame of a super frame determined when the execution designation signal is received. On the receiver side, information of broadcast is continuously received by detecting a TMCC information field in a specific frame during a period of which field the site was exchanged and by establishing re-synchronization by using a super frame sync pattern W2 or W3 after the detected TMCC information field.
    Type: Application
    Filed: June 17, 2002
    Publication date: December 19, 2002
    Inventors: Hiroshi Okamura, Tomokazu Nakajima, Takanori Fujii, Susumu Nishijima, Masaki Miyamoto, Kenichi Shiraishi, Akihiro Horii, Shoji Matsuda
  • Patent number: 6376367
    Abstract: A semiconductor device having good electrical properties, and a method of manufacturing this semiconductor device by forming an insulation layer on a first wiring layer and then, in this insulation layer, simultaneously forming a second wiring layer and a contact layer for connecting the first wiring layer and the second wiring layer. A first mask having an opening over a wiring trench in which the second wiring layer will be formed is formed on the insulation layer. A second mask having an opening for a through-hole where the contact layer is to be formed is then formed over the insulation layer and first mask. The insulation layer is then etched using the second mask as a mask. Then the insulation layer is again etched using the first mask as a mask to form wiring trench and through-hole. The wiring trench and through-hole are then filled with a conductive material to form the second wiring layer and contact layer.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: April 23, 2002
    Assignee: Seiko Epson Corporation
    Inventor: Hiroshi Okamura
  • Patent number: 6350674
    Abstract: A semiconductor device having good electrical properties, and a method of manufacturing this semiconductor device by forming an insulation layer on a first wiring layer and then, simultaneously forming in this insulation layer a second wiring layer and a contact layer for connecting the first wiring layer and the second wiring layer. A positive resist layer having an opening over an area where a through-hole is to be formed is first formed on the insulation layer. A negative resist layer having an opening over an area where a wiring trench is to be formed is then formed on the positive resist layer. The insulation layer, positive resist layer, and negative resist layer are then simultaneously etched to form a wiring trench and through-hole that are automatically aligned with each other. The wiring trench and through-hole are then filled with a conductive material to form a second wiring layer and contact layer.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: February 26, 2002
    Assignee: Seiko Epson Corporation
    Inventor: Hiroshi Okamura
  • Patent number: 6045860
    Abstract: A process for manufacturing a copper tube with a tinned inner surface by circulating a substitution-type electroless tin plating solution inside the copper tube. The process is characterized by comprising a first plating step wherein the rate of deposition of a tin film is adjusted so that the total copper ion concentration in the plating solution, immediately after flowing from the copper tube, after having been circulated inside the tube divided by the tin (II) ion concentration in this plating solution is 0.8 or less, and a second plating step wherein plating is carried out at a plating solution temperature higher than the plating solution temperature in the first plating step. A plating solution comprising 0.05-0.3 mol/l of Sn.sup.2 ion, 0.5-2.0 mol/l of thiourea, 0.5-2.0 mol/l of sulfuric acid, 0.05-2.0 mol/l of alkyl benzene sulfonic acid, and 0.5-5.0 g/l of a nonionic surface active agent is preferably used.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: April 4, 2000
    Assignee: Sumitomo Light Metal Industries, Ltd.
    Inventors: Junichi Ito, Tetsuro Atsumi, Makoto Yonemitsu, Yoshihiro Nishimoto, Hiroshi Okamura
  • Patent number: 6018428
    Abstract: The invention provides a method for effectively removing the cause of a thermal asperity (TA) phenomenon occurring at an MR head incorporated in a disk storage system. If a read error occurs in data read by the MR head, a CPU executes a usual read retry operation. If the read error is not removed by the usual read retry operation, the CPU presumes that the read error is caused by the thermal asperity phenomenon occurring at the MR head. Then, the CPU controls the MR head to move to a CSS zone on the disk, thereby executing a TA removal operation so as to remove a fine particle such as dust attached to the MR head. In the TA removal operation, the rotational speed of the disk is reduced so that the MR head can be brought into contact with the disk in the CSS zone.
    Type: Grant
    Filed: June 29, 1998
    Date of Patent: January 25, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Hiroshi Okamura
  • Patent number: 5831781
    Abstract: The feature of the present invention lies in the point that a flying height variation of a head is checked by use of a read signal sent from the head so as to easily detect the flying height out of an allowable range, so that the generation of an abnormal data writing/reading operation is prevented in advance with result that data writing/reading operation can be surely realized in an interior of a HDD. There is provided a system in which a read signal obtained when data recorded in a disk 1 is read by a head 2 is input, and the flying height variation of the head is checked by use of a DC voltage of a gain control signal of an AGC circuit of a data reading processing circuit for executing a predetermined data reading processing. A CPU 11 converts a DC voltage level of the gain control signal of the AGC circuit to digital data by an A/D converter so as to check the flying height variation of the head.
    Type: Grant
    Filed: February 5, 1996
    Date of Patent: November 3, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Hiroshi Okamura
  • Patent number: 5808825
    Abstract: The invention provides a method for effectively removing the cause of a thermal asperity (TA) phenomenon occurring at an MR head incorporated in a disk storage system. If a read error occurs in data read by the MR head, a CPU executes a usual read retry operation. If the read error is not removed by the usual read retry operation, the CPU presumes that the read error is caused by the thermal asperity phenomenon occurring at the MR head. Then, the CPU controls the MR head to move to a CSS zone on the disk, thereby executing a TA removal operation so as to remove a fine particle such as dust attached to the MR head. In the TA removal operation, the rotational speed of the disk is reduced so that the MR head can be brought into contact with the disk in the CSS zone.
    Type: Grant
    Filed: August 1, 1996
    Date of Patent: September 15, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Hiroshi Okamura
  • Patent number: 5684651
    Abstract: Servo data respectively recorded in the peripheral and innermost tracks of a magnetic disk at low and high densities in synchronism with a predetermined write period are read back and binarized by the magnetic head as flux reversal patterns. In this case, on the basis of a table stored in the EEPROM in advance, the filter characteristic of a characteristic variable type low-pass filter is variably set to be a characteristic defined by a low cutoff frequency fc and a small boost amount in the peripheral zone and to be a characteristic defined by a high cutoff frequency and a boost amount, which is large on a high-frequency side, on the central zone. The peak waveforms of a servo signal in the central side are raised to be sharpened, and a qualification level in a pulse decoder is variably set to be high in the outermost tracks and to be low in the innermost tracks.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: November 4, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koji Yaegashi, Hiroshi Okamura