Patents by Inventor Hiroshi Okoshi

Hiroshi Okoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode
    Patent number: 9496468
    Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: November 15, 2016
    Assignee: KANEKA CORPORATION
    Inventors: Tadashi Kokubo, Katsuya Ouchi, Takahisa Iwahara, Kazuhiko Hirabayashi, Hiroshi Okoshi, Tomokazu Tozawa, Shuhei Ozaki
  • Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode
    Patent number: 9178120
    Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: November 3, 2015
    Assignee: KANEKA CORPORATION
    Inventors: Tadashi Kokubo, Katsuya Ouchi, Takahisa Iwahara, Kazuhiko Hirabayashi, Hiroshi Okoshi, Tomokazu Tozawa, Shuhei Ozaki
  • CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION TABLET, MOLDED BODY, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR COMPONENT AND LIGHT EMITTING DIODE
    Publication number: 20150188008
    Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.
    Type: Application
    Filed: March 10, 2015
    Publication date: July 2, 2015
    Applicant: KANEKA CORPORATION
    Inventors: Tadashi Kokubo, Katsuya Ouchi, Takahisa Iwahara, Kazuhiko Hirabayashi, Hiroshi Okoshi, Tomokazu Tozawa, Shuhei Ozaki
  • CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION TABLET, MOLDED BODY, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR COMPONENT AND LIGHT EMITTING DIODE
    Publication number: 20130082369
    Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.
    Type: Application
    Filed: March 30, 2011
    Publication date: April 4, 2013
    Applicant: KANEKA CORPORATION
    Inventors: Tadashi Kokubo, Katsuya Ouchi, Takahisa Iwahara, Kazuhiko Hirabayashi, Hiroshi Okoshi, Tomokazu Tozawa, Shuhei Ozaki