Patents by Inventor Hiroshi Ootsuki

Hiroshi Ootsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7664311
    Abstract: There is provided a component mounting inspecting apparatus which can automatically set a solder bridge inspection region (an inspection point) and output an optimum inspection result of a solder bridge. The component mounting board inspecting apparatus for inspecting a solder bridge of an electronic circuit board, in which a plurality of electrode pads are formed at predetermined spaced intervals and cream solder is applied on the electrode pads, includes a mechanism for automatically determining a distance between adjacent electrode pads and a mechanism for automatically setting a solder bridge inspection point if the distance between the adjacent electrode pads is equal to or shorter than a threshold value.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: February 16, 2010
    Assignee: Sony Corporation
    Inventors: Hiroshi Yamasaki, Hiroshi Ootsuki, Yutaka Igarashi
  • Publication number: 20050196996
    Abstract: There is provided a component mounting inspecting apparatus which can automatically set a solder bridge inspection region (an inspection point), and output an optimum inspection result of a solder bridge. The component mounting board inspecting apparatus for inspecting a solder bridge of an electronic circuit board, in which a plurality of electrode pads are formed at predetermined spaced intervals, and cream solder is applied on the electrode pads, includes mechanism for automatically determining a distance between adjacent electrode pads; and mechanism for automatically setting a solder bridge inspection point if the distance between the adjacent electrode pads is equal or shorter than a threshold value.
    Type: Application
    Filed: January 24, 2005
    Publication date: September 8, 2005
    Applicant: Sony Corporation
    Inventors: Hiroshi Yamasaki, Hiroshi Ootsuki, Yutaka Igarashi