Abstract: By incorporating an epoxy resin and aluminum hydroxide into a resin composition, it is possible to achieve a resin composition for use in a release film, which retains high bond strength after a build-up layer is cured, and which has excellent peel strength after being subjected to heating treatment for releasing.

Abstract: The present invention relates to resin compositions that are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being roughened by an oxidizing agent.

Abstract: Thermosetting resin compositions which comprise: (A) at least one modified linear polyimide resin obtained by reacting a bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetracarboxylic acid anhydride, and (B) at least one thermosetting resin selected from the group consisting of an epoxy resin, a bismaleimide resin, a cyanate ester resin, a bis-allyl-nadi-imide resin, a vinylbenzyl ether resin, a benzooxazine resin, a polymer of bismaleimide and diamine, and mixtures thereof, are useful as insulating materials for a flexible circuit boards and can readily have a conductor layer with excellent adhesion strength formed thereon by plating.

Abstract: Metallized polyimide films for use as a substrate, in which a conductive layer is adhered to a polyimide film at high peel strength, may be prepared in a relatively small number of steps without using a special material by treating an inorganic filler-containing polyimide film with an alkaline permanganate solution, and subjecting the treated surface to electroless copper plating, or successive electroless copper plating and electrolytic copper plating. Preferably, a potassium permanganate solution or a sodium permanganate solution is used as the alkaline permanganate solution.

Abstract: Metallized polyamideimide films for use as a substrate, in which a conductive layer is adhered to a polyamideimide film at high peel strength, may be prepared in a relatively small number of steps without using a special material by treating an inorganic filler-containing polyamideimide film with an alkaline permanganate solution, and subjecting the treated surface to electroless copper plating, or successive electroless copper plating and electrolytic copper plating. Preferably, a potassium permanganate solution or a sodium permanganate solution is used as the alkaline permanganate solution.

Abstract: Resin compositions, which contain: (a) a heat-resistant resin which is soluble in organic solvents wherein the heat-resistant resin is one or more heat-resistant resin(s) selected from the group consisting of a polyimide resin, a polyamide-imide resin, a polyamide resin, a polyether imide resin, a polybenzoxazol resin, a polybenzimidazole resin, copolymers thereof, and mixtures thereof; (b) a thermosetting resin; (c) a filler; and (d) resin having a polybutadiene structure and/or a polysiloxane structure, wherein: the heat-resistant resin (a) and the thermosetting resin (b) are present in a weight ratio of heat-resistant resin (a) to thermosetting resin (b) of from 100:1 to 1:1; the heat-resistant resin (a), thermosetting resin (b), and filler (c) are present in relative amounts such that weight ratio of the total amount of heat-resistant resin (a) and thermosetting resin (b) to filler (c) by weight is from 100:1 to 3:2; the resin having a polybutadiene structure and/or a polysiloxane structure (d) is present

Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.

Abstract: Herein are disclosed a curable resin composition for overcoat of flexible circuit which comprises a hydrogenated polybutadiene polyol with a number-average molecular weight of 1,000-8,000 and having 2-10 hydroxyl groups per molecule (Polyol A), and a polybutadiene polyblock isocyanate (Isocyanate X), and other similar curable resin compositions, which can be an overcaoting agent which can give a coat film involving no such trouble that the coat film gets overhardened and the curling is increased.

Abstract: Herein is desclosed a curable resin composition comprising at least one polyol selected from the group consisting of Polyol A, including polybutadiene polyol (Polyol Aa), Polyol B, including polybutadiene polyol (Polyol Ba) and polyester polyol (Polyol Bb), and Polyol C, and at least one polyblock isocyanate selected form the group consisting of polyblock isocyanate (Isocyanate X), including polybutadiene polyblock isocyanate (Isocyanate Xa), which is excellent in warp property, i.e., provides a low shrinkage, upon curing, and the cured products of which are particularly excellent in flexibility and excellent in such properties chemical resistance, heat resistance, electric insulation, bending resistance and adherence, and which is, therefore, suitable for overcoat of flexible circuit.

Abstract: A novel modified polyimide resin having a polybutadiene sheleton and obtainable by reacting the following three (3) kinds of compounds, i.e., a bifunctional hydroxyl-terminal polybutadiene having a number average molecular weight of 800 to 5,000, a tetrabasic acid dianhydride, and a diisocyanate compound, imparts reduced shrinkage upon setting to a thermosetting resin composition comprising the same and also imparts heat resistance and pliability and the like to a hardened mass or article of such thermosetting resin composition. Therefore, such thermosetting resin composition is an excellent resin composition capable of fully satisfying the requirements with regard to the characteristics of an overcoat agent for a wiring circuit which should be pliable, such as a flexible wiring circuit substrate, a film carrier and the like.

Abstract: Disclosed herein is a one-part polythiol-type epoxy resin composition having an excellent low-temperature quick curability and a good storage stability (shelf stability), which can be prepared by using, as essential components, (1) an epoxy resin having two or more epoxy groups per one molecule, (2) a thiol compound having two or more thiol groups per one molecule, (3) a solid dispersion-type latent curing accelerator and (4) a borate ester compound.

Abstract: Herein is desclosed a curable resin composition comprising at least one polyol selected from the group consisting of Polyol A, including polybutadiene polyol (Polyol Aa), Polyol B, including polybutadiene polyol (Polyol Ba) and polyester polyol (Polyol Bb), and Polyol C, and at least one polyblock isocyanate selected form the group consisting of polyblock isocyanate (Isocyanate X), including polybutadiene polyblock isocyanate (Isocyanate Xa), which is excellent in warp property, i.e., provides a low shrinkage, upon curing, and the cured products of which are particularly excellent in flexibility and excellent in such properties chemical resistance, heat resistance, electric insulation, bending resistance and adherence, and which is, therefore, suitable for overcoat of flexible circuit.