Patents by Inventor Hiroshi Osakada
Hiroshi Osakada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11271434Abstract: A rectenna device includes an antenna (210), a first rectifier (31) to rectify a radio frequency wave input in the antenna (210), an antenna (220), a second rectifier (32) to rectify a radio frequency wave input in the antenna (220), and a capacitive coupler (5) to form an open circuit in response to direct current and to form a short circuit in response to a fundamental wave. The first rectifier (31) includes a ground (GND) conductor (410) to be a reference potential, and the second rectifier (32) includes a GND conductor (420) to be a reference potential. The GND conductor (410) and the GND conductor (420) are connected with the capacitive coupler (5) in between. The first rectifier (31) and the second rectifier (32) are connected in series.Type: GrantFiled: September 11, 2019Date of Patent: March 8, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Toshiyuki Tanaka, Tomohiro Takahashi, Masashi Wada, Hiroshi Osakada, Yukihiro Homma
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Publication number: 20220014045Abstract: A rectenna device includes an antenna (210), a first rectifier (31) to rectify a radio frequency wave input in the antenna (210), an antenna (220), a second rectifier (32) to rectify a radio frequency wave input in the antenna (220), and a capacitive coupler (5) to form an open circuit in response to direct current and to form a short circuit in response to a fundamental wave. The first rectifier (31) includes a ground (GND) conductor (410) to be a reference potential, and the second rectifier (32) includes a GND conductor (420) to be a reference potential. The GND conductor (410) and the GND conductor (420) are connected with the capacitive coupler (5) in between. The first rectifier (31) and the second rectifier (32) are connected in series.Type: ApplicationFiled: September 11, 2019Publication date: January 13, 2022Applicant: Mitsubishi Electric CorporationInventors: Toshiyuki TANAKA, Tomohiro TAKAHASHI, Masashi WADA, Hiroshi OSAKADA, Yukihiro HOMMA
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Patent number: 7671707Abstract: A bandstop filter where variation in characteristics is suppressed to minimum and which realizes an increased production yield. The physical length of a line joint portion between a main line and an oscillator can be enlarged by providing an impedance non-continuous structure portion in a strip conductor of the oscillator. In comparison to the case where the impedance non-continuous structure portion is not provided, the width of a joint slit required to obtain an equal joint amount can be enlarged. When the joint slit width is enlarged, variation in filter characteristics caused by pattern accuracy can be reduced because of the enlarged joint slip width, thus improving a filter yield. This means that pattern accuracy requirement for production is loosened. Freedom in selecting a dielectric substrate is increased, which also provides an advantage that a filter can be produced using a less expensive dielectric substrate with not very high pattern accuracy.Type: GrantFiled: July 30, 2003Date of Patent: March 2, 2010Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Tetsu Ohwada, Hiroshi Osakada, Hideyuki Oh-Hashi
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Publication number: 20060250199Abstract: A bandstop filter where variation in characteristics is suppressed to minimum and which realizes an increased production yield. The physical length of a line joint portion between a main line and an oscillator can be enlarged by providing an impedance non-continuous structure portion in a strip conductor of the oscillator. In comparison to the case where the impedance non-continuous structure portion is not provided, the width of a joint slit required to obtain an equal joint amount can be enlarged. When the joint slit width is enlarged, variation in filter characteristics caused by pattern accuracy can be reduced because of the enlarged joint slip width, thus improving a filter yield. This means that pattern accuracy requirement for production is loosened. Freedom in selecting a dielectric substrate is increased, which also provides an advantage that a filter can be produced using a less expensive dielectric substrate with not very high pattern accuracy.Type: ApplicationFiled: July 30, 2003Publication date: November 9, 2006Inventors: Tetsu Ohwada, Hiroshi Osakada, Hideyuki Oh-Hashi
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Patent number: 6977620Abstract: High frequency packages have a plurality of apertures (notches) as antennas, and each of these apertures possesses a specific resonance frequency that may exist within the frequency bandwidth used in the high frequency packages in a high frequency band. Thus, the resonance frequency produced within the package is shifted outside the frequency bandwidth. A high frequency package is provided with a metal frame disposed on a metal bottom plate and having apertures for connecting with external terminals, dielectrics being disposed on the bottom metal plate, and on which a high frequency transmission line and a plurality of input and output terminals are formed, microwave circuitry being contained in the metal frame, and a metal lid, wherein the frequency of the aperture's resonance arising from electromagnetic field between the metal frame and the metal bottom plate, is shifted outside the frequency bandwidth by diminishing and optimizing the width of the aperture.Type: GrantFiled: April 15, 2004Date of Patent: December 20, 2005Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Hideki Asao, Hiroshi Osakada, Hideyuki Oohashi, Kyouko Shinozaki, Kenji Tatano
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Publication number: 20050104792Abstract: High frequency packages have a plurality of apertures (notches) as antennas, and each of these apertures possesses a specific resonance frequency that may exist within the frequency bandwidth used in the high frequency packages in a high frequency band. Thus, the resonance frequency produced within the package is shifted outside the frequency bandwidth. A high frequency package is provided with a metal frame disposed on a metal bottom plate and having apertures for connecting with external terminals, dielectrics being disposed on the bottom metal plate, and on which a high frequency transmission line and a plurality of input and output terminals are formed, microwave circuitry being contained in the metal frame, and a metal lid, wherein the frequency of the aperture's resonance arising from electromagnetic field between the metal frame and the metal bottom plate, is shifted outside the frequency bandwidth by diminishing and optimizing the width of the aperture.Type: ApplicationFiled: April 15, 2004Publication date: May 19, 2005Applicant: MITSUBISHI DENKI KABUSHIKIInventors: Hideki Asao, Hiroshi Osakada, Hideyuki Oohashi, Kyouko Shinozaki, Kenji Tatano