Patents by Inventor Hiroshi Oshibe

Hiroshi Oshibe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating apparatus
    Patent number: 7828944
    Abstract: An electroplating apparatus includes: a wafer holder that is detachable from an engaging hole of a cathode holder and capable of moving in a up and down direction; a spring contact type cathode electrode that is fixed to an electrode housing recess on a top surface of the wafer holder and presses against a backside of a wafer placed on the wafer holder; and a suction pad that is fixed to a pad housing recess on a top surface of the wafer holder and suctions the backside of the wafer placed on the wafer holder.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: November 9, 2010
    Assignee: Tosetz Inc.
    Inventors: Atsushi Nagashima, Hiroshi Oshibe
  • ELECTROPLATING APPARATUS
    Publication number: 20080017503
    Abstract: An electroplating apparatus includes: a wafer holder that is detachable from an engaging hole of a cathode holder and capable of moving in a up and down direction; a spring contact type cathode electrode that is fixed to an electrode housing recess on a top surface of the wafer holder and presses against a backside of a wafer placed on the wafer holder; and a suction pad that is fixed to a pad housing recess on a top surface of the wafer holder and suctions the backside of the wafer placed on the wafer holder.
    Type: Application
    Filed: July 18, 2007
    Publication date: January 24, 2008
    Inventors: Atsushi Nagashima, Hiroshi Oshibe