Patents by Inventor Hiroshi Otake
Hiroshi Otake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11214369Abstract: There is provided a system including: a control device mounted on an aircraft and configured to control the aircraft, the aircraft having a battery, and a wireless device configured to use power stored in the battery to provide a wireless communication service to a user terminal; and a module that is physically attachable to and detachable from the control device, in which the control device has a housing that includes a module attachment and detachment unit, and an electrical connection unit configured to electrically connect the module to the battery when the module is attached to the module attachment and detachment unit, and the module has, a power receiving unit configured to receive power from the battery, and a communication processing unit configured to use the power received by the power receiving unit to communicate with the wireless device.Type: GrantFiled: March 18, 2021Date of Patent: January 4, 2022Assignee: HAPSMobile Inc.Inventors: Tatsushi Tsutsui, Koji Kusunoki, Akihiro Baba, Naoyoshi Hashimoto, Osamu Kamimura, Nobuyuki Uetsuki, Hiroshi Otake, Ayako Sato, Chie Hirosawa
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Patent number: 8409355Abstract: Embodiments of process kits for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, a process kit for a semiconductor process chamber may include an annular body being substantially horizontal and having an inner and an outer edge, and an upper and a lower surface; an inner lip disposed proximate the inner edge and extending vertically from the upper surface; and an outer lip disposed proximate the outer edge and on the lower surface, and having a shape conforming to a surface of the substrate support pedestal. In some embodiments, a process kit for a semiconductor process chamber my include an annular body having an inner and an outer edge, and having an upper and lower surface, the upper surface disposed at a downward angle of between about 5-65 degrees in an radially outward direction from the inner edge toward the outer edge.Type: GrantFiled: April 24, 2008Date of Patent: April 2, 2013Assignee: Applied Materials, Inc.Inventors: Muhammad M. Rasheed, Teruki Iwashita, Hiroshi Otake, Yuki Koga, Kazutoshi Maehara, Xinglong Chen, Sudhir Gondhalekar, Dmitry Lubomirsky
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Publication number: 20090266299Abstract: Embodiments of process kits for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, a process kit for a semiconductor process chamber may include an annular body being substantially horizontal and having an inner and an outer edge, and an upper and a lower surface; an inner lip disposed proximate the inner edge and extending vertically from the upper surface; and an outer lip disposed proximate the outer edge and on the lower surface, and having a shape conforming to a surface of the substrate support pedestal. In some embodiments, a process kit for a semiconductor process chamber my include an annular body having an inner and an outer edge, and having an upper and lower surface, the upper surface disposed at a downward angle of between about 5-65 degrees in an radially outward direction from the inner edge toward the outer edge.Type: ApplicationFiled: April 24, 2008Publication date: October 29, 2009Applicant: APPLIED MATERIALS, INC.Inventors: MUHAMMAD M. RASHEED, TERUKI IWASHITA, HIROSHI OTAKE, YUKI KOGA, KAZUTOSHI MAEHARA, XINGLONG CHEN, SUDHIR GONDHALEKAR, DMITRY LUBOMIRSKY
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Publication number: 20080305170Abstract: The present invention provides a method for producing a powder containing an oil-soluble substance, from which substantially no oil-soluble substances are eluted upon application of pressure, heat, or water. The present invention relates to a method for producing a powder containing an oil-soluble substance, which comprises, dispersing an oil-soluble substance and a calcium component in an aqueous solution in the presence of a surfactant, and then drying the thus obtained liquid mixture.Type: ApplicationFiled: March 16, 2005Publication date: December 11, 2008Applicant: KITII CORPORATIONInventors: Masaaki Nakahara, Akihiko Kurosaki, Hiroshi Otake, Hitoshi Kanai, Hiroshi Yokokawa, Kiyoshi Kumabe, Hiroyuki Yanaka
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Publication number: 20070160674Abstract: The present invention provides a method for producing a powder containing an oil-soluble substance, fromn which substantially no oil-soluble substances are eluted upon application of pressure, heat, or water. The present invention relates to a method for producing a powder containing an oil-soluble substance, which comprises, dispersing an oil-soluble substance and a calcium component in an aqueous solution in the presence of a surfactant, and then drying the thus obtained liquid mixture.Type: ApplicationFiled: March 16, 2005Publication date: July 12, 2007Applicant: KITII CORPORATIONInventors: Masaaki Nakahara, Akihiko Kurosaki, Hiroshi Otake, Hitoshi Kanai, Hiroshi Yokokawa, Kiyoshi Kumabe, Hiroyuki Yanaka
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Patent number: 5090338Abstract: Incineration flyash is treated by reducing the organic chlorine compounds contained in the flyash. A cylindrical body equipped with a rotating shaft having a screw conveyor and agitating blades for conveying and agitating the flyash is filled to at least a 75 vol % charge so that contact of the flyash with oxygen is made as small as possible. The flyash is subjected to agitation and heat-treatment at 300.degree. C. or higher. The cylindrical body has a feeding port for the waste incineration flyash and a discharging port for the discharge of the treated flyash. The screw conveyor is at the introducing part and has a pitch that is successively reduced toward the agitating part for charging the flyash in the agitating part at a greater vol. % than that which occurs in the introducing part.Type: GrantFiled: November 21, 1990Date of Patent: February 25, 1992Assignee: Mitsui Engineering & Shipbuilding Co., Ltd.Inventors: Yasuaki Harada, Gentaro Takasuka, Tatuo Kato, Yoshimichi Hanai, Hiroshi Kamei, Kazuya Yamada, Hiroshi Otake, Mazumi Itaya
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Patent number: 4755784Abstract: A leadless chip inductor having metallic terminal plates and a coil element fixed to the metallic terminal plates, the metallic terminal plates being partially enclosed, together with the coil element, by a resin molded cover, the portions of the metallic terminal plates exposed to the outside of the molded outer cover being bent along the edge of the molded cover so as to form terminals for connection to an external circuit. The mechanical and electrical connection between the metallic terminal plates and the lead lines led from the coil is achieved by brazing or welding the lead lines to the undersides of a narrow strip-shaped tabs which is projected from each metallic terminal plate. With this arrangement, the coil lead lines are securely connected to the metallic terminal plates.Type: GrantFiled: June 30, 1986Date of Patent: July 5, 1988Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Mikio Taoka, Hiromasa Yamamoto, Hiroshi Otake, Hironori Arima
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Patent number: 4453144Abstract: An LC composite component comprising a coaxial bobbin, a plurality of collars thereon defining winding grooves therebetween, coils wound in the winding grooves, each collar having a concave recess therein, open at a top end thereof, terminal pins projecting upwardly from the opposite ends of the concave recess, a leadless tip type capacitor having upwardly projecting electrodes accommodated in the concave recess and the coils and the capacitor electrodes being connected with each other by the terminal pins, the capacitor electrodes being connected to the terminal pins so as to stably and firmly secure the capacitor at the open end of the concave recess of each collar.Type: GrantFiled: January 27, 1982Date of Patent: June 5, 1984Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Tamura, Yoshiaki Otani, Hiroshi Otake, Masami Yamamura
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Patent number: 4074210Abstract: A distribution type delay line particularly adapted for use in a color television receiver and for mass production is disclosed. A bobbin with several axially spaced flanges defining several winding or coil slots therebetween is combined with a circuit of series-connected grounding electrode windings or coils each wound in each slot and each consisting of a predetermined number of turns of insulated wire and/or a circuit of series-connected shield windings each wound in each slot and each consisting of a predetermined number of turns of insulated wire, and a circuit of series-connected signal windings each wound in each slot outwardly and/or inwardly of the grounding electrode and/or shield windings and each consisting of a predetermined number of turns of insulated wire, the grounding electrode and shield windings being wound in the opposite directions so that the magnetic fluxes induced thereacross may be cancelled by each other.Type: GrantFiled: August 4, 1976Date of Patent: February 14, 1978Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Otake, Saburo Koresawa, Kozo Hashimoto