Patents by Inventor Hiroshi Ozaku

Hiroshi Ozaku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100230789
    Abstract: A technology is provided which allows a reduction in the size of a semiconductor device without degrading an electromagnetic shielding effect and reliability against reflow heating. After a plurality of components are mounted over a component mounting surface of a module substrate, a resin is formed so as to cover the mounted components. Further, over surfaces (upper and side surfaces) of the resin, a shield layer including a laminated film of a Cu plating film and an Ni plating film is formed. In the shield layer, a plurality of microchannel cracks are formed randomly along grain boundaries and in a net-like configuration without being coupled to each other in a straight line, and form a plurality of paths extending from the resin to a surface of the shield layer by the microchannel cracks.
    Type: Application
    Filed: March 15, 2010
    Publication date: September 16, 2010
    Inventors: Chiko Yorita, Yuji Shirai, Hirokazu Nakajima, Hiroshi Ozaku, Tomonori Tanoue, Hiroshi Okabe, Tsutomu Hara