Patents by Inventor Hiroshi Sameshima

Hiroshi Sameshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8313252
    Abstract: In a package (5) formed by a supporting portion (5a) for supporting a light emitting portion (7) or a light receiving portion (9) for emitting or receiving an optical signal, and a lid (5b) for covering the supporting portion (5a); the supporting portion (5a) or the lid (5b) includes a light guide mounting surface (22) for supporting at least one end including an incident/exit port of the optical signal in a film light guide (4) for optically coupling with the light emitting portion (7) or the light receiving portion (9) and transmitting the optical signal; and a length (D) in a Z-direction serving as a perpendicular direction with respect to the light guide mounting surface (22) from the light guide mounting surface (22) of the supporting portion (5a) or the lid (5b) to the lid (5b) or the supporting portion (5a) facing the light guide mounting surface (22) is longer than a length (d) in the Z-direction in a region of the film light guide (4) supported by the light guide mounting surface (22).
    Type: Grant
    Filed: August 6, 2008
    Date of Patent: November 20, 2012
    Assignee: OMRON Corporation
    Inventors: Hiroshi Sameshima, Naru Yasuda, Hayami Hosokawa
  • Patent number: 8168940
    Abstract: A light transmission module includes a light transmission path for transmitting light, an optical element including a light emitting and receiving surface for optically coupling with the light transmitted by the light transmission path, and being formed with a light emitting and receiving point having a function of photoelectric conversion and an electrode pad on the light emitting and receiving surface. The light transmission module further includes a substrate mounted with the optical element and an electrical wiring and an electrical connecting member for electrically connecting the electrode pad and the electrical wiring. The substrate includes a wiring exposed surface where the electrical wiring is exposed. The electrical connecting member is made of solidified object of a liquid conductive material arranged to contact the electrical wiring, which is exposed at the wiring exposed surface, and the electrode pad.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: May 1, 2012
    Assignee: OMRON Corporation
    Inventors: Junichi Tanaka, Hiroshi Sameshima, Naru Yasuda
  • Publication number: 20120020609
    Abstract: An optical wiring mounted on an electronic device has a light transmission path for transmitting an optical signal. A function layer that reduces friction generated when coming in contact with a structural body in the electronic device to lower than when the light transmission path comes in contact with the structural body, and that bends according to deformation of the light transmission path, is arranged.
    Type: Application
    Filed: September 3, 2008
    Publication date: January 26, 2012
    Applicant: OMRON CORPORATION
    Inventors: Masaaki Kasai, Hayami Hosokawa, Naru Yasuda, Hiroshi Sameshima, Yoshitaka Tatara, Naoki Yoshitake
  • Patent number: 8087834
    Abstract: A connection member (21), which electrically connects a package (14) on which an optical element that converts an electric signal to an optical signal or converts an optical signal to an electric signal and at least one end portion including an incident/releasing port for an optical signal of an optical waveguide (11) that is optically coupled with the optical element to transmit the optical signal are mounted, and a second substrate (2) to each other, is provided with a holding unit having elasticity, which holds the package (14), and a connection unit that is connected to the substrate (2).
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: January 3, 2012
    Assignee: OMRON Corporation
    Inventors: Junichi Tanaka, Akihiko Sano, Toshiaki Okuno, Yoshihisa Ishida, Akira Enami, Hiroshi Sameshima, Naru Yasuda, Hayami Hosokawa
  • Patent number: 8052337
    Abstract: An optical module (1) including a light receiving/emitting element (3) for transmitting or receiving an optical signal, an optical waveguide (2) having a core part made of a material with translucency and a clad part made of a material having an index of refraction different from an index of refraction of the core part for optically coupling with the light receiving/emitting element (3) and transmitting the optical signal, and a package (5) for accommodating at least one end including an entrance/exit port (2c) of the optical signal in the optical waveguide (2) and the light receiving/emitting element (3); wherein a surface on a side facing a bottom plate mounted with the light receiving/emitting element (3) in the package (5) at the end of the optical waveguide (2) accommodated in the package (5) is configured by a first region including a portion projected into a space inside the package (5), and a second region different from the first region; and the package (5) includes a supporting part (5a) for support
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: November 8, 2011
    Assignee: OMRON Corporation
    Inventors: Hiroshi Sameshima, Takayoshi Koike, Naru Yasuda, Hayami Hosokawa, Hiroto Nozawa
  • Publication number: 20110217005
    Abstract: A light transmission module includes a reinforcement component for reinforcing a substrate. The reinforcement component is arranged on a surface mounted with the optical element of the substrate. The reinforcement component includes at least two structural portions longer than a maximum length portion of the optical element when seen from a direction perpendicular to the substrate surface. The two structural portions are arranged facing each other with a region, where at least the optical element is arranged, in between when seen from the direction perpendicular to the substrate surface.
    Type: Application
    Filed: December 19, 2008
    Publication date: September 8, 2011
    Applicant: OMRON CORPORATION
    Inventors: Yusuke Nakagawa, Hiroshi Sameshima, Takayoshi Koike, Naru Yasuda
  • Publication number: 20110186717
    Abstract: A light transmission module includes a light transmission path for transmitting light, an optical element including a light emitting and receiving surface for optically coupling with the light transmitted by the light transmission path, and being formed with a light emitting and receiving point having a function of photoelectric conversion and an electrode pad on the light emitting and receiving surface. The light transmission module further includes a substrate mounted with the optical element and an electrical wiring and an electrical connecting member for electrically connecting the electrode pad and the electrical wiring. The substrate includes a wiring exposed surface where the electrical wiring is exposed. The electrical connecting member is made of solidified object of a liquid conductive material arranged to contact the electrical wiring, which is exposed at the wiring exposed surface, and the electrode pad.
    Type: Application
    Filed: December 24, 2008
    Publication date: August 4, 2011
    Applicant: OMRON CORPORATION
    Inventors: Junichi Tanaka, Hiroshi Sameshima, Naru Yasuda
  • Publication number: 20110123147
    Abstract: An optical transmission module has an optical wiring for transmitting light, and an optical element for irradiating a light incidence plane of the optical wiring with light and a control circuit component for driving light emission of the optical element based on an externally input electric signal, or an optical element for receiving light emitted from a light emitting surface of the optical wiring and converting to an electric signal and a control circuit component for amplifying the electric signal output from the optical element and outputting to the outside. A plurality of boards overlapped and stacked so as to form a step with each other is arranged. A first board stacked at one end in a stacking direction of the plurality of boards is mounted with the optical wiring and the optical element so as to sandwich both surfaces in the stacking direction, and a board surface on the first board side of a second board stacked at another end is mounted with the control circuit component.
    Type: Application
    Filed: September 14, 2009
    Publication date: May 26, 2011
    Applicant: OMRON CORPORATION
    Inventors: Hiroshi Sameshima, Naru Yasuda
  • Patent number: 7865046
    Abstract: A connection member electrically connects an optical element configured to convert an electric signal to an optical signal or to convert an optical signal to an electric signal, a first substrate including an incident/releasing port of an optical transmission path for an optical signal at least one end portion thereof, and a second substrate to each other. The optical transmission path is optically coupled with the optical element to transmit the optical the connection. The connection member includes a connection unit connected to the second substrate and a holding unit having elasticity and holding the first substrate. The holding unit is provided with an electrode at a connecting position to the first substrate, and the holding unit holds the first substrate by connecting the first substrate to the electrode.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: January 4, 2011
    Assignee: OMRON Corporation
    Inventors: Junichi Tanaka, Akihiko Sano, Toshiaki Okuno, Yoshihisa Ishida, Akira Enami, Hiroshi Sameshima, Naru Yasuda, Hayami Hosokawa
  • Publication number: 20100221016
    Abstract: A light transmission module has a light transmission path for transmitting light, an optical element including a light emitting and receiving surface for emitting or receiving an optical signal transmitted by the light transmission path, and having a light emitting and receiving point with a function of photoelectric conversion and an electrode pad formed on the light emitting and receiving surface, a substrate mounted with the optical element and an electrical wiring, a bonding wiring for electrically connecting the electrode pad and the electrical wiring, and a sealing portion for sealing the optical element. The electrical wiring and the electrode pad are reverse wire-bonded by the bonding wiring.
    Type: Application
    Filed: February 23, 2010
    Publication date: September 2, 2010
    Applicant: OMRON CORPORATION
    Inventors: Junichi Tanaka, Hiroshi Sameshima, Naru Yasuda, Hayami Hosokawa
  • Publication number: 20100202732
    Abstract: In a package (5) formed by a supporting portion (5a) for supporting a light emitting portion (7) or a light receiving portion (9) for emitting or receiving an optical signal, and a lid (5b) for covering the supporting portion (5a); the supporting portion (5a) or the lid (5b) includes a light guide mounting surface (22) for supporting at least one end including an incident/exit port of the optical signal in a film light guide (4) for optically coupling with the light emitting portion (7) or the light receiving portion (9) and transmitting the optical signal; and a length (D) in a Z-direction serving as a perpendicular direction with respect to the light guide mounting surface (22) from the light guide mounting surface (22) of the supporting portion (5a) or the lid (5b) to the lid (5b) or the supporting portion (5a) facing the light guide mounting surface (22) is longer than a length (d) in the Z-direction in a region of the film light guide (4) supported by the light guide mounting surface (22).
    Type: Application
    Filed: August 6, 2008
    Publication date: August 12, 2010
    Applicant: OMRON CORPORATION
    Inventors: Hiroshi Sameshima, Naru Yasuda, Hayami Hosokawa
  • Publication number: 20100054672
    Abstract: A connection member (21), which electrically connects a package (14) on which an optical element that converts an electric signal to an optical signal or converts an optical signal to an electric signal and at least one end portion including an incident/releasing port for an optical signal of an optical waveguide (11) that is optically coupled with the optical element to transmit the optical signal are mounted, and a second substrate (2) to each other, is provided with a holding unit having elasticity, which holds the package (14), and a connection unit that is connected to the substrate (2).
    Type: Application
    Filed: September 28, 2009
    Publication date: March 4, 2010
    Applicant: OMRON CORPORATION
    Inventors: Junichi Tanaka, Akihiko Sano, Toshiaki Okuno, Yoshihisa Ishida, Akira Enami, Hiroshi Sameshima, Naru Yasuda, Hayami Hosokawa
  • Publication number: 20090202199
    Abstract: An optical module (1) including a light receiving/emitting element (3) for transmitting or receiving an optical signal, an optical waveguide (2) having a core part made of a material with translucency and a clad part made of a material having an index of refraction different from an index of refraction of the core part for optically coupling with the light receiving/emitting element (3) and transmitting the optical signal, and a package (5) for accommodating at least one end including an entrance/exit port (2c) of the optical signal in the optical waveguide (2) and the light receiving/emitting element (3); wherein a surface on a side facing a bottom plate mounted with the light receiving/emitting element (3) in the package (5) at the end of the optical waveguide (2) accommodated in the package (5) is configured by a first region including a portion projected into a space inside the package (5), and a second region different from the first region; and the package (5) includes a supporting part (5a) for support
    Type: Application
    Filed: December 28, 2006
    Publication date: August 13, 2009
    Applicant: OMRON CORPORATION
    Inventors: Hiroshi Sameshima, Takayoshi Koike, Naru Yasuda, Hayami Hosokawa, Hiroto Nozawa
  • Publication number: 20090175579
    Abstract: A connection member electrically connects an optical element configured to convert an electric signal to an optical signal or to convert an optical signal to an electric signal, a first substrate including an incident/releasing port of an optical transmission path for an optical signal at least one end portion thereof, and a second substrate to each other. The optical transmission path is optically coupled with the optical element to transmit the optical the connection. The connection member includes a connection unit connected to the second substrate and a holding unit having elasticity and holding the first substrate. The holding unit is provided with an electrode at a connecting position to the first substrate, and the holding unit holds the first substrate by connecting the first substrate to the electrode.
    Type: Application
    Filed: April 13, 2007
    Publication date: July 9, 2009
    Applicant: OMRON CORPORATION
    Inventors: Junichi Tanaka, Akihiko Sano, Toshiaki Okuno, Yoshihisa Ishida, Akira Enami, Hiroshi Sameshima, Naru Yasuda, Hayami Hosokawa
  • Patent number: D605127
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: December 1, 2009
    Assignee: Omron Corporation
    Inventors: Naru Yasuda, Hiroto Nozawa, Hiroshi Sameshima, Akira Enami, Yoshihisa Ishida