Abstract: A method for manufacturing an electronic device according to one embodiment includes forming a first electrode layer, forming a device functional portion, and forming a second electrode layer. At least one of the first electrode layer, one or a plurality of functional layers of the device functional portion, and the second electrode layer is formed by coating a base substrate containing a substrate with ink containing a material of the at least one layer from an inkjet printing device 24. The inkjet printing device includes an ink supply unit 30, an inkjet head 28, a flow path 38 of the ink, a drive unit 40, and a diaphragm type pressure adjusting mechanism 42 which is arranged between the drive unit and the inkjet head on the flow path. The ink satisfies at least one of a surface tension of 15 mN/m to 25 mN/m and a specific gravity of 1.5 or more.

Abstract: A method for manufacturing an organic EL panel capable of reducing uneven emission luminance (uneven light emission) is disclosed. A method for manufacturing an organic EL panel according to an embodiment of the invention is a method for manufacturing an organic EL panel including a functional layer including at least a light emitting layer containing an organic material, including a coating step of forming a functional layer by horizontally conveying a base material (110) having flexibility using a roll-to-roll process and coating a coating solution containing an organic material onto the base material (110) using an inkjet applicator (30) disposed above the base material (110), wherein in the coating step, the base material (110) is floated by air using an air floating stage (20) disposed below the base material (110) and the coating solution is coated onto the base material (110).

Abstract: A method for manufacturing an organic EL panel capable of reducing uneven emission luminance (uneven light emission) is disclosed. A method for manufacturing an organic EL panel according to an embodiment of the invention is a method for manufacturing an organic EL panel including a functional layer including at least a light emitting layer containing an organic material, including a coating step of forming a functional layer by horizontally conveying a base material (110) having flexibility using a roll-to-roll process and coating a coating solution containing an organic material onto the base material (110) using an inkjet applicator (30) disposed above the base material (110), wherein in the coating step, the base material (110) is floated by air using an air floating stage (20) disposed below the base material (110) and the coating solution is coated onto the base material (110).

Abstract: A manufacturing method for forming a region into which impurity ions are implanted, and an electrode is coupled to the region, in a self-aligned manner. An oxide film is formed on an n-type semiconductor layer composed of a silicon carbide semiconductor, and then the oxide film on regions in which source and drain regions are to be formed is removed by etching. Impurity ions are implanted into an exposed semiconductor layer and heat treatment is performed for activating the implanted impurity ions. A metal film to serve as ohmic electrodes is formed on the entire surface, and then the oxide film is removed by etching to thereby form a source electrode and a drain electrode. Leaving a part of the oxide film on regions on which source and drain electrodes are to be formed can prevent the oxide film from being deformed during the heat treatment for activation.

Abstract: A manufacturing method for forming a region into which impurity ions are implanted, and an electrode is coupled to the region, in a self-aligned manner. An oxide film is formed on an n-type semiconductor layer composed of a silicon carbide semiconductor, and then the oxide film on regions in which source and drain regions are to be formed is removed by etching. Impurity ions are implanted into an exposed semiconductor layer and heat treatment is performed for activating the implanted impurity ions. A metal film to serve as ohmic electrodes is formed on the entire surface, and then the oxide film is removed by etching to thereby form a source electrode and a drain electrode. Leaving a part of the oxide film on regions on which source and drain electrodes are to be formed can prevent the oxide film from being deformed during the heat treatment for activation.