Patents by Inventor Hiroshi Segi

Hiroshi Segi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6753603
    Abstract: Electronic equipment comprises a wiring board, an electronic component mounted on the wiring board and having a heat dissipation portion on a surface thereof, and an insulating heat dissipation plate thermally connected to the electronic component, wherein the heat dissipation portion is directly connected to the heat dissipation plate via a heat conductive bonding material that includes metal. The heat dissipation plate is a ceramic plate having at least one land for connecting the electronic component thereto, or a resin plate containing highly heat conductive material. By directly connecting the insulating heat dissipation plate to an electronic component generating heat, an insulating plate between the heat dissipation plate and the electronic component is not required.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: June 22, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Segi, Toshiyuki Taniguchi, Takaharu Murakami
  • Publication number: 20030057885
    Abstract: Electronic equipment comprising a wiring board, electronic component mounted on the wiring board and having a heat dissipation portion on the surface thereof, and an insulating heat dissipation plate thermally connected to the electronic component, wherein the heat dissipation portion is directly connected to the heat dissipation plate with heat conductive bonding materials. The heat dissipation plate is a ceramic plate having at least one land for connecting electronic component or a resin plate containing highly heat conductive material. By directly connecting the insulating heat dissipation plate to electronic component generating heat, an insulating plate between the heat dissipation plate and the electronic component used in a conventional method becomes not required. Consequently, it is possible to enhance a heat dissipation effect of electronic component in electronic equipment.
    Type: Application
    Filed: August 20, 2002
    Publication date: March 27, 2003
    Inventors: Hiroshi Segi, Toshiyuki Taniguchi, Takaharu Murakami
  • Patent number: 6076718
    Abstract: A film conveying apparatus includes a conveying mechanism and a speed control mechanism. The conveying mechanism includes a plurality of lower rollers arranged in a lateral direction perpendicular to a film conveyed direction. The lower roller is equipped with a motor to variably control its speed. A plurality of upper rollers is disposed to correspond to the lower rollers so as to sandwich the continuous film with the lower rollers. The roller-speed control mechanism controls a rotation speed of each lower roller so that the film is conveyed at a desired speed in a desired direction.
    Type: Grant
    Filed: July 25, 1995
    Date of Patent: June 20, 2000
    Assignees: Central Glass Company, Limited, Toray Engineering Co., Ltd.
    Inventors: Naohiko Matsuda, Hiroshi Segi, Masami Nishitani, Shozo Takami, Akira Fukuchi