Patents by Inventor Hiroshi Seida

Hiroshi Seida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid discharge head and method for manufacturing the same
    Patent number: 8287100
    Abstract: In order to hermetically seal more surely a gap between a back surface of a liquid discharge substrate and a front surface of a support member, and an electrode portion etc., without adversely affecting discharge performance, a liquid discharge head includes a first sealing resin coated on a portion between the liquid supply port and the pad on the support surface so as to surround a tip end portion at the liquid supply port of the support member and a second sealing resin for sealing a gap between the support member and the liquid discharge substrate, and a peripheral part of the liquid supply port.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: October 16, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroshi Seida, Riichi Saito
  • LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20100271438
    Abstract: The present invention provides, in order to hermetically seal more surely a gap between a back surface of a liquid discharge substrate and a front surface of a support member, and an electrode portion etc. without adversely affecting discharge performance, wherein a liquid discharge head includes, first sealing resin coated on a portion between the liquid supply port and the pad on the support surface so as to surround a tip end portion at the liquid supply port of the support member and second sealing resin for sealing a gap between the support member and the liquid discharge substrate, and a peripheral part of the liquid supply port.
    Type: Application
    Filed: July 7, 2010
    Publication date: October 28, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Hiroshi Seida, Riichi Saito
  • Liquid discharge head and method for manufacturing the same
    Patent number: 7794058
    Abstract: In order to hermetically seal more surely a gap between a back surface of a liquid discharge substrate and a front surface of a support member, and an electrode portion etc., without adversely affecting discharge performance, a liquid discharge head includes a first sealing resin coated on a portion between the liquid supply port and the pad on the support surface so as to surround a tip end portion at the liquid supply port of the support member and a second sealing resin for sealing a gap between the support member and the liquid discharge substrate, and a peripheral part of the liquid supply port.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: September 14, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroshi Seida, Riichi Saito
  • LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20070285477
    Abstract: The present invention provides, in order to hermetically seal more surely a gap between a back surface of a liquid discharge substrate and a front surface of a support member, and an electrode portion etc. without adversely affecting discharge performance, wherein a liquid discharge head includes, first sealing resin coated on a portion between the liquid supply port and the pad on the support surface so as to surround a tip end portion at the liquid supply port of the support member and second sealing resin for sealing a gap between the support member and the liquid discharge substrate, and a peripheral part of the liquid supply port.
    Type: Application
    Filed: May 21, 2007
    Publication date: December 13, 2007
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Hiroshi SEIDA, Riichi Saito