Abstract: A polishing pad has a polishing layer that is formed of a polyurethane foam having fine cells. The polyurethane foam is a reaction cured body of a chain extender and an isocyanate-terminated prepolymer which is obtained by reacting a prepolymer starting material composition that contains an isocyanate component, a high molecular weight polyol and an aliphatic diol. The high molecular weight polyol contains a polyalkylene glycol A that has a peak of the molecular weight distribution within the range of 200 to 300 and a polyalkylene glycol B that has a peak of the molecular weight distribution within the range of 800 to 1200.

Abstract: It is an object of the invention to provide a tank for use in making high-quality, air void-less, polishing pads, to provide a method for producing a polishing pad using the tank, and to provide a polishing pad obtained by such a production method. A tank for holding a resin composition, the tank comprising two or more body components and joint parts, wherein the two or more body components are joined by the joint parts to form a frame-shaped body, at least one of the joint parts includes an opening and closing member that joins adjacent ones of the body components in such a way that the adjacent body components can swing open, and at least another one of the joint parts includes a joint member that joins adjacent ones of the body components in such a way that the adjacent body components can swing about the joint member.

Abstract: A polishing pad has a polishing layer that is formed of a polyurethane foam having fine cells. The polyurethane foam is a reaction cured body of a chain extender and an isocyanate-terminated prepolymer which is obtained by reacting a prepolymer starting material composition that contains an isocyanate component, a high molecular weight polyol and an aliphatic diol. The high molecular weight polyol contains a polyalkylene glycol A that has a peak of the molecular weight distribution within the range of 200 to 300 and a polyalkylene glycol B that has a peak of the molecular weight distribution within the range of 800 to 1200.

Abstract: It is an object of the invention to provide a tank for use in making high-quality, air void-less, polishing pads, to provide a method for producing a polishing pad using the tank, and to provide a polishing pad obtained by such a production method. A tank for holding a resin composition, the tank comprising two or more body components and joint parts, wherein the two or more body components are joined by the joint parts to form a frame-shaped body, at least one of the joint parts includes an opening and closing member that joins adjacent ones of the body components in such a way that the adjacent body components can swing open, and at least another one of the joint parts includes a joint member that joins adjacent ones of the body components in such a way that the adjacent body components can swing about the joint member.

Abstract: A method for manufacturing a polishing pad made from a polyurethane resin foam having very uniform, fine cells therein and a polishing pad obtained by that method provides a polishing pad having better polishing characteristics (especially, in planarization) while providing improved dressability while maintaining the planarization characteristics and polishing speed of a conventional polishing pad. The polyurethane resin foam is a cured product obtained by reacting an isocyanate-terminated prepolymer with an aromatic polyamine chain extender having a melting point of 70° C. or lower, for example.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: A production method comprising the step of charging prepolymer, a foaming agent and an active hydrogen-containing compound in specified amounts into a tank and foaming/mixing them for a specified time by a mixer, and the subsequent step of pouring the mixture liquid into a metal mold.

Abstract: A polyurethane composition containing solid beads dispersed therein, is formed of a microcellular polyurethane foam, and the composition has a storage modulus of elasticity at 40° C. of 270 MPa or more as measured by means of a dynamic elasticity measuring device. Another polyurethane composition of this invention contains solid beads dispersed therein, that are capable of swelling with or are soluble in an aqueous medium. The former composition has excellent flattening capability, and the latter composition can provide a polished surface which combines good flatness and good uniformity and can also reduce scratches on the surface.

Abstract: A method for manufacturing a polishing pad made from a polyurethane resin foam having very uniform, fine cells therein and a polishing pad obtained by that method provides a polishing pad having better polishing characteristics (especially, in planarization) while providing improved dressability while maintaining the planarization characteristics and polishing speed of a conventional polishing pad. The polyurethane resin foam is a cured product obtained by reacting an isocyanate-terminated prepolymer with an aromatic polyamine chain extender having a melting point of 70° C. or lower, for example.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: A process for producing a finely cellular polyurethane foam by mixing a first ingredient comprising an isocyanate compound and a second ingredient comprising a compound containing an active hydrogen group, characterized by comprising adding a nonionic silicone surfactant containing no hydroxyl group to at least one of the first ingredient and the second ingredient in an amount of 0.1 to 5 wt %, excluding 5 wt %, based on the total amount of the first ingredient and the second ingredient, subsequently agitating the surfactant containing ingredient together with an unreactive gas, which has no reactivity to isocyanate group or active hydrogen group, to disperse the unreactive gas as fine bubbles to prepare a bubble dispersion and then mixing the bubble dispersion with the remaining ingredient to cure the resultant mixture and forming finely cellular structure into the resultant polyurethane foam by the fine bubbles of the bubble dispersion.

Abstract: A production method comprising the step of charging prepolymer, a foaming agent and an active hydrogen-containing compound in specified amounts into a tank and foaming/mixing them for a specified time by a mixer, and the subsequent step of pouring the mixture liquid into a metal mold.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: A process for producing a finely cellular polyurethane foam by mixing a first ingredient comprising an isocyanate compound and a second ingredient comprising a compound containing an active hydrogen group, characterized by comprising adding a nonionic silicone surfactant containing no hydroxyl group to at least one of the first ingredient and the second ingredient in an amount of 0.1 to 5 wt %, excluding 5 wt %, based on the total amount of the first ingredient and the second ingredient, subsequently agitating the surfactant containing ingredient together with an unreactive gas, which has no reactivity to isocyanate group or active hydrogen group, to disperse the unreactive gas as fine bubbles to prepare a bubble dispersion and then mixing the bubble dispersion with the remaining ingredient to cure the resultant mixture and forming finely cellular structure into the resultant polyurethane foam by the fine bubbles of the bubble dispersion.

Abstract: A process for producing a finely cellular polyurethane foam by mixing a first ingredient comprising an isocyanate compound and a second ingredient comprising a compound containing an active hydrogen group, characterized by comprising adding a nonionic silicone surfactant containing no hydroxyl group to at least one of the first ingredient and the second ingredient in an amount of 0.1 to 5 wt %, excluding 5 wt %, based on the total amount of the first ingredient and the second ingredient, subsequently agitating the surfactant containing ingredient together with an unreactive gas, which has no reactivity to isocyanate group or active hydrogen group, to disperse the unreactive gas as fine bubbles to prepare a bubble dispersion and then mixing the bubble dispersion with the remaining ingredient to cure the resultant mixture and forming finely cellular structure into the resultant polyurethane foam by the fine bubbles of the bubble dispersion.

Abstract: A polyurethane composition containing solid beads dispersed therein, characterized in that the polyurethane is a microcellular polyurethane foam and the composition has a storage modulus of elasticity at 40° C. of 270 MPa or more as measured by means of a dynamic elasticity measuring device: and a polyurethane composition containing solid beads dispersed therein, characterized in that the solid beads are capable of swelling with or being soluble in an aqueous medium. The former composition has excellent flattening capability, and the latter composition can provide a polished surface which combines good flatness and good uniformity and can also reduce scratches on the surface.

Abstract: A process for producing a finely cellular polyurethane foam by mixing a first ingredient comprisi an isocyanate compound and a second ingredient comprising a compound containing an active hydrogen group, characterized by comprising adding a nonionic silicone surfactant containing no hydroxyl group to at least one of the first ingredient and the second ingredient in an amount of 0.1 to 5 wt %, excluding 5 wt %, based on the total amount of the first ingredient and the second ingredient, subsequently agitating the surfactant containing ingredient together with an unreactive gas to disperse the unreactive gas as fine bubbles to prepare a bubble dispersion and then mixing the bubble dispersion with the remaining ingredient to cure the resultant mixture.