Abstract: A semiconductor laminated module comprises a plurality of unit packages in which semiconductor chips are bonded to base substrates with a first adhesive, a second adhesive to form a laminated body by bonding the plurality of unit packages to each other, a third adhesive formed to cover an upper surface of the semiconductor chips and having substantially the same thermal expansion coefficient as that of the first adhesive, and an uppermost substrate bonded to uppermost one of the unit packages with the second adhesive.

Abstract: A semiconductor laminated module comprises a plurality of unit packages in which semiconductor chips are bonded to base substrates with a first adhesive, a second adhesive to form a laminated body by bonding the plurality of unit packages to each other, a third adhesive formed to cover an upper surface of the semiconductor chips and having substantially the same thermal expansion coefficient as that of the first adhesive, and an uppermost substrate bonded to uppermost one of the unit packages with the second adhesive.

Abstract: An IC chip and overhang portions are stuck to tape by an adhesive agent layer having elasticity. A plurality of solder balls are attached to the tape. By soldering the solder balls to a printed board, a semiconductor device is mounted. In the case where a temperature cycle has been caused, thermal stress occurs between the IC chip and the printed board or between the hangover portion and the printed board because of a difference in coefficient of thermal expansion between the IC chip or the hangover portion and the printed board. However, this thermal stress is absorbed by the elasticity of the adhesive agent layer. As a result, little thermal stress is applied to solder balls. Even if the above described temperature cycle is repeated, therefore, the solder balls are electrically connected to the printed board stably over a long period of time. In addition, the area of the tape is widened by the area of the hangover portions.