Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

Abstract: Various methods of cleaning a substrate are provided. In one aspect, method of cleaning a substrate, comprising: holding and rotating a substrate by a substrate holder; and supplying a chemical liquid to a chemical liquid nozzle and supplying two fluids to a two-fluid nozzle while moving the chemical-liquid nozzle and the two-fluid nozzle radially outwardly from the center to the periphery of the substrate, wherein the distance of the chemical-liquid nozzle from a rotating axis of the substrate holder is longer than the distance of the two-fluid nozzle from the rotating axis of the substrate holder while the chemical-liquid nozzle and the two-fluid nozzle are moved radially outwardly from the rotating axis of the substrate holder.

Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

Abstract: Various methods of cleaning a substrate are provided. In one aspect, method of cleaning a substrate, comprising: holding and rotating a substrate by a substrate holder; and supplying a chemical liquid to a chemical liquid nozzle and supplying two fluids to a two-fluid nozzle while moving the chemical-liquid nozzle and the two-fluid nozzle radially outwardly from the center to the periphery of the substrate, wherein the distance of the chemical-liquid nozzle from a rotating axis of the substrate holder is longer than the distance of the two-fluid nozzle from the rotating axis of the substrate holder while the chemical-liquid nozzle and the two-fluid nozzle are moved radially outwardly from the rotating axis of the substrate holder.

Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

Abstract: A substrate cleaning apparatus capable of preventing a cleaning vessel from being corroded by a chemical liquid while constituting the cleaning vessel with a low-price material is provided. The substrate cleaning apparatus includes: a cleaning vessel for holding a substrate therein; a substrate holder arranged in the cleaning vessel; a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel. The inner surface of the cleaning vessel has been subjected to a hydrophilization treatment.

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

Abstract: A polishing apparatus which can remove slurry which has entered into a gap between an elastic membrane for pressing a substrate such as a wafer and a retaining ring is disclosed. The polishing apparatus includes a top ring which has an elastic membrane configured to form a pressure chamber for pressing the substrate against a polishing pad, and a retaining ring disposed around the elastic membrane and configured to press the polishing pad, a top ring rotating device configured to rotate the top ring about an axis of the top ring, and a cleaning brush configured to be brought into contact with a peripheral portion of a lower surface and an outer circumferential surface of the elastic membrane.

Abstract: A substrate cleaning apparatus capable of efficiently cleaning a substrate, such as a wafer, is provided. The substrate cleaning apparatus includes: a substrate holder for holding and rotating a substrate; a chemical liquid nozzle for supplying a chemical liquid onto the substrate; a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate. The chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle.

Abstract: A substrate cleaning apparatus capable of preventing a cleaning vessel from being corroded by a chemical liquid while constituting the cleaning vessel with a low-price material is provided. The substrate cleaning apparatus includes: a cleaning vessel for holding a substrate therein; a substrate holder arranged in the cleaning vessel; a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel. The inner surface of the cleaning vessel has been subjected to a hydrophilization treatment.

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

Abstract: A liquid supply apparatus is to supply a polishing liquid from a polishing supply source onto a polishing surface of a polishing table at a predetermined flow rate. The liquid supply apparatus according to the present invention includes at least one supply tube for retaining the liquid supplied from the liquid supply source, an electropneumatic regulator for supplying a pressurized gas from a gas source to the supply tube, and a pipe having no narrow portion for controlling a flow rate of the liquid. The supply tube is vertically disposed. The pressurized gas supply mechanism is operable to supply the pressurized gas to the supply tube so as to supply the liquid, filling the supply tube, to the polishing surface of the polishing table via the pipe and a polishing liquid supply pipe.

Abstract: A liquid supply apparatus is to supply a polishing liquid from a polishing supply source onto a polishing surface of a polishing table at a predetermined flow rate. The liquid supply apparatus according to the present invention includes at least one supply tube for retaining the liquid supplied from the liquid supply source, an electropneumatic regulator for supplying a pressurized gas from a gas source to the supply tube, and a pipe having no narrow portion for controlling a flow rate of the liquid. The supply tube is vertically disposed. The pressurized gas supply mechanism is operable to supply the pressurized gas to the supply tube so as to supply the liquid, filling the supply tube, to the polishing surface of the polishing table via the pipe and a polishing liquid supply pipe.

Abstract: A pure water reusing system recovers water discharged from apparatuses in which pure water is used, and regenerates the water to produce pure water. The pure water reusing system has a recovering and regenerating apparatus for recovering water discharged from the apparatuses and regenerating the water by removing impurities from the water to produce pure water, and a regenerated pure water supply line for supplying the regenerated pure water to at least one of the apparatuses. The same process is conducted in the apparatuses in which pure water is used.

Abstract: A polishing liquid supply apparatus supplies a polishing liquid to a polishing unit. The polishing liquid supply apparatus includes a supply tank for storing a polishing liquid having a predetermined concentration, and a polishing liquid pipe for delivering the polishing liquid from the supply tank to a polishing liquid supply nozzle in the polishing unit. The polishing liquid supply apparatus further includes an additive tank for storing an additive having a predetermined concentration, and an additive supply pipe for adding the additive supplied from the additive tank to the polishing liquid stored in the supply tank or to the polishing liquid in a polishing liquid passage including the polishing liquid pipe.