Abstract: A conductive film includes a substrate, a resin layer provided on a main surface of the substrate, and a conductive part filled in a groove pattern formed in the resin layer. The resin layer is obtained using a composition containing a release agent containing silicon, and a resin, the resin layer includes a surface-segregated release agent layer and a main body portion provided on the substrate side of the surface-segregated release agent layer, the surface-segregated release agent layer has a first surface and a second surface. The thickness of the resin layer is 5100 nm or less, and when the resin layer is subjected to TOF-SIMS in the thickness direction of the resin layer, a ratio R (=100×A2/A1) using the intensities A1 (at the first surface) and A2 (at the second surface) of silicon-containing secondary ions from the release agent is 25% or less.

Abstract: A conductive film includes a film-shaped base material and a structure provided on one or each of two main surfaces of the base material. The structure includes a first resin layer provided at a position farthest from the main surface of the base material, an intermediate layer provided between the first resin layer and the base material, a pattern including a linear trench formed along the main surface of the base material, and a conductive part filled in the pattern. A bottom portion of the trench is positioned closer to the base material than an interface between the first resin layer and the intermediate layer.

Abstract: A wiring body including a substrate, and a conductor pattern provided on the substrate and including an electroconductive line, the electroconductive line extending on the substrate in an extending direction, in which, in a cross-sectional view of the electroconductive line taken along a direction orthogonal to the extending direction, a width of the electroconductive line increases toward one side away from the substrate in a height direction, and a curved surface curving so as to protrude to the one side in the height direction is formed on a surface of the electroconductive line on a side opposite to the substrate.

Abstract: A wiring body includes a substrate, a mesh-like conductor layer provided on the substrate, and a resin layer covering the conductor layer, in which the resin layer includes a first resin layer and a second resin layer in order from the substrate side, and the conductor layer passes through the first resin layer.

Abstract: A wiring body includes a substrate, and a conductor layer provided on the substrate and including an electroconductive line extending in a predetermined extending direction, in which in a cross-sectional view taken along a direction orthogonal to the extending direction, the electroconductive line includes a tapered portion in which a width of the electroconductive line increases toward one side away from the substrate in a height direction, and an expanded portion disposed on the one side with respect to the tapered portion and having the width greater than a width of the tapered portion, and the expanded portion protrudes outward in a width direction and includes a curved portion.

Abstract: A conductive film includes a base material, and a conductive part provided over a main surface of the base material. The conductive part includes a main body part including a first metal, and a blackened layer configured to cover at least a surface of the main body part opposite to the base material, the blackened layer includes the first metal and a second metal different from the first metal, and the blackened layer has a crystalline structure with a space group of Pm-3m.

Abstract: A wiring body includes an electrode and a terminal, in which the electrode and the terminal each have a conductor pattern including a plurality of openings, and the terminal has, on the conductor pattern, a conductor layer extending in a planar shape so as to cover at least a part of the conductor pattern.

Abstract: A wiring body includes a base board, a ground pattern provided on the base board, and a conductor portion including a first conductor pattern and a second conductor pattern containing metal. The ground pattern is a conductor pattern extending so as to form a planar surface. The second conductor pattern is a mesh-like conductor pattern connected to the first conductor pattern. The conductor portion is able to be arranged in a bent state.

Abstract: A wiring body includes a first resin layer having a first main surface and a second main surface and having a through hole passing from the first main surface to the second main surface, an electroconductive layer disposed in the through hole, and a first adhesive layer covering the first resin layer and the electroconductive layer from the first main surface side.

Abstract: A conductive film includes a base material 1, a first resin layer 10 provided on the base material 1, a second resin layer 20 provided on the first resin layer 10 and having a trench 25 opening to a surface opposite to the first resin layer 10, and a conductive layer 30 provided in the trench 25. The first resin layer 10 contains a first resin portion 12 and a plurality of first inorganic particles 11. At least a part of the plurality of first inorganic particles 11 partially protrude from the first resin portion 12 toward the second resin layer 20.

Abstract: A conductive film including a film-like base material and a conductive layer provided on one main surface side of the base material is provided. The conductive layer includes a first metal layer containing a first metal and a second metal layer containing a second metal different from the first metal, provided in order from the base material side. The first metal layer includes grain boundaries.

Abstract: An electrically conductive film including a film-like base material, and a resin layer and an electrically conductive part provided on a main surface of the base material is disclosed. The resin layer has a pattern including a linear trench. The electrically conductive part has a portion provided in the linear trench. The resin layer has raised portions formed along the trench on both sides of the linear trench and raised in the thickness direction of the resin layer.

Abstract: A transparent conductor includes a transparent substrate, a first metal oxide layer, a metal layer containing a silver alloy, a third metal oxide layer, and a second metal oxide layer in the order presented. The first metal oxide layer is composed of a metal oxide which is different from ITO, the second metal oxide layer contains ITO, and the work function of the surface of the second metal oxide layer opposite to the metal layer side is 4.5 eV or higher.

Abstract: A transparent conductor includes a transparent substrate, a first metal oxide layer, a metal layer containing a silver alloy, a third metal oxide layer, and a second metal oxide layer in the order presented. The first metal oxide layer is composed of a metal oxide which is different from ITO, the second metal oxide layer contains ITO, and the work function of the surface of the second metal oxide layer opposite to the metal layer side is 4.5 eV or higher.

Abstract: The transparent conductor involves a first laminate part including a transparent resin substrate and a transmittance-controlling layer, and a second laminate part including the transparent resin substrate, the transmittance-controlling layer, a metal layer containing silver or a silver alloy, and a metal oxide layer in the order presented. The first laminate part and the second laminate part are adjacent to each other in a direction perpendicular to the direction of lamination of the first laminate part and the second laminate part, and the difference between the transmittance of the first laminate part in the direction of lamination, T1, and the transmittance of the second laminate part in the direction of lamination, T2, (T2?T1) is 4% or more.

Abstract: Provided is a transparent conductor including a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer laminated in the order presented, wherein the second metal oxide layer contains zinc oxide, indium oxide, titanium oxide, and tin oxide.

Abstract: A transparent conductive film for antennas, includes: a transparent resin substrate; a first metal oxide layer; a metal layer containing silver or a silver alloy; and a second metal oxide layer, stacked in this order.

Abstract: The transparent conductor includes a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer in the order presented. The first metal oxide layer contains zinc oxide, indium oxide, and titanium oxide, and the content of SnO2 in the first metal oxide layer is 40 mol % or less with respect to the total of four components of zinc oxide, indium oxide, titanium oxide, and tin oxide in terms of ZnO, In2O3, TiO2, and SnO2, respectively. The second metal oxide layer contains the four components, and the content of SnO2 in the second metal oxide layer is 12 to 40 mol % with respect to the total of the four components in terms of ZnO, In2O3, TiO2, and SnO2, respectively.

Abstract: A transparent conductor includes: a transparent resin base material; a first metal oxide layer; a metal layer including a silver alloy; and a second metal oxide layer, in this order. The first metal oxide layer contains at least one of tin oxide and niobium oxide. When the tin oxide and the niobium oxide are respectively set in terms of SnO2 and Nb2O5, a molar basis content of the total of SnO2 and Nb2O5 with respect to the total of metal oxides contained in the first metal oxide layer is greater than a molar basis content of the total of SnO2 and Nb2O5 with respect to the total of metal oxides contained in the second metal oxide layer, and the content in the first metal oxide layer is greater than or equal to 45 mol %.

Abstract: The transparent conductor includes a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer in the order presented. The first metal oxide layer contains zinc oxide, indium oxide, and titanium oxide, and the content of SnO2 in the first metal oxide layer is 40 mol % or less with respect to the total of four components of zinc oxide, indium oxide, titanium oxide, and tin oxide in terms of ZnO, In2O3, TiO2, and SnO2, respectively. The second metal oxide layer contains the four components, and the content of SnO2 in the second metal oxide layer is 12 to 40 mol % with respect to the total of the four components in terms of ZnO, In2O3, TiO2, and SnO2, respectively.