Abstract: A condensed heterocyclic compound has a sepiapterin reductase inhibitory action and is particularly useful for treatment of a pain. The condensed heterocyclic compound represented by Formula (I) below (R1 represents a hydrocarbon group or the like; R2 and R3 represent a hydrogen atom or the like; R4, X, and Y represent defined substituents), a tautomer or a pharmaceutically acceptable salt of the compound, or a solvate of any of these.

Abstract: A maintenance assistance system that outputs an alarm for a notification of a maintenance request for a management target machine to a predetermined outputting apparatus is provided. The maintenance assistance system generates an evaluation value on the basis of an operation data database, estimates required items to be used for maintenance and a quantity of the required items in regard to a failure item whose occurrence is predicted on the basis of a required item database when an abnormality decision is made in regard to the management target machine on the basis of the evaluation value, estimates, on the basis of the evaluation value and a failure case database, a grace period before a failure occurs in regard to the failure item whose occurrence is predicted, estimates a procurement period required for procurement of the required items from a parts inventory database, and outputs the alarm to the outputting apparatus when the procurement period has no leeway with respect to the grace period.

Abstract: Provided is a piping system for an air conditioner installed in a vehicle that can achieve appropriate weight reduction while ensuring appropriate pressure resistance as the piping system as a whole. A circulation path that connects component devices of an air conditioner (8) in an annular shape to circulate a refrigerant (C) is formed by each pipe body extending between the component devices. At least one of the pipe bodies includes: a resin hose (2) embedded with a non-metal reinforcing material (3f) or a resin pipe (5) embedded with a non-metal reinforcing material (6f), and the resin pipe bodies (2), (5) are employed in 50% or more of a total length of each of the pipe bodies constituting the circulation path.

Abstract: A vibration generation device which can vibrate in only one axial direction is used to simultaneously load a vibration force in a plurality of axial directions onto a test piece, and to make it possible to easily modify the proportion of vibration force in each axial direction.

Abstract: Provided is a highly reliable semiconductor device capable of reducing stress generated in a semiconductor element even when a highly elastic joining material such as a Pb-free material is used in a power semiconductor having a double-sided mounting structure. The semiconductor device includes a semiconductor element including a gate electrode only on one surface, an upper electrode connected to the surface of the semiconductor element on which the gate electrode is provided, and a lower electrode connected to a surface opposite to the surface of the semiconductor element on which the gate electrode is provided.

Abstract: Provided is a piping system for an air conditioner installed in a vehicle that can achieve appropriate weight reduction while ensuring appropriate pressure resistance as the piping system as a whole. A circulation path that connects component devices of an air conditioner (8) in an annular shape to circulate a refrigerant (C) is formed by each pipe body extending between the component devices. At least one of the pipe bodies includes: a resin hose (2) embedded with a non-metal reinforcing material (3f) or a resin pipe (5) embedded with a non-metal reinforcing material (6f), and the resin pipe bodies (2), (5) are employed in 50% or more of a total length of each of the pipe bodies constituting the circulation path.

Abstract: Provided are: a technique for improving failure probability evaluation precision, even when the center and tails of an occurrence frequency distribution for stress or strength, or a physical quantity associated with stress or strength, such as load, for example, do not conform to the same probability distribution, by precisely estimating a tail probability density function; and a high-precision failure probability evaluation device.

Abstract: Provided is a highly reliable semiconductor device capable of reducing stress generated in a semiconductor element even when a highly elastic joining material such as a Pb-free material is used in a power semiconductor having a double-sided mounting structure. The semiconductor device includes a semiconductor element including a gate electrode only on one surface, an upper electrode connected to the surface of the semiconductor element on which the gate electrode is provided, and a lower electrode connected to a surface opposite to the surface of the semiconductor element on which the gate electrode is provided.

Abstract: An ejector has a nozzle, a body, a passage defining member and a drive portion. The body has a refrigerant suction port and a pressure increasing portion. A nozzle passage is defined between an inner surface of the nozzle and an outer surface of the passage defining member and has a minimum sectional area portion, a tapered portion, and an expansion portion. The minimum sectional area portion has a smallest passage sectional area. The tapered portion is located upstream of the minimum sectional area portion in a refrigerant flow direction and has a passage sectional area decreasing toward the minimum sectional area portion gradually. The expansion portion is located downstream of the minimum sectional area portion in the refrigerant flow direction and has a passage sectional area increasing gradually. The passage defining member has a groove that is recessed to increase the passage sectional area of the nozzle passage.

Abstract: A power module or the like is provided in which lower inductance and miniaturization are achieved. The power module includes: main body units (11 to 13), cooling units (21 to 24) which cool the main body units (11 to 13), busbars (51, 52) connected to power terminals (1i, 1j) of the main body units (11 to 13), a casing (W) in which at least contact parts with the busbars (51, 52) are insulative, and a metal member (30) which supports the casing (W). The metal member (30) tightly contacts the casing (W), thereby forming a box with one side opened. At least the main body units (11 to 13) and the busbars (51, 52) are arranged inside the box. An insulating sealant is provided to fill the inside of the box.

Abstract: In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected.

Abstract: An ejector has a nozzle, a body, a passage defining member and a drive portion. The body has a refrigerant suction port and a pressure increasing portion. A nozzle passage is defined between an inner surface of the nozzle and an outer surface of the passage defining member and has a minimum sectional area portion, a tapered portion, and an expansion portion. The minimum sectional area portion has a smallest passage sectional area. The tapered portion is located upstream of the minimum sectional area portion in a refrigerant flow direction and has a passage sectional area decreasing toward the minimum sectional area portion gradually. The expansion portion is located downstream of the minimum sectional area portion in the refrigerant flow direction and has a passage sectional area increasing gradually. The passage defining member has a groove that is recessed to increase the passage sectional area of the nozzle passage.

Abstract: A power conversion apparatus includes: a circuit body including a switching device; a base member forming a first concave portion and a cooling surface; and a wedge inserted in the first concave portion of the base member. The first concave portion of the base member is formed by a substrate portion forming the cooling surface, a first wall disposed on the opposite side of the substrate portion from the cooling surface, and an intermediate portion interconnecting the first wall and the substrate portion. The first wall forms an insertion space for insertion of the wedge, and a heat transfer plane forming a heat dissipating surface and a heat transfer path of the circuit body. The intermediate portion is plastically deformed by inserting the wedge into the insertion space, thus causing the first wall to be displaced toward the location of the circuit body.

Abstract: In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected.

Abstract: In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. In addition, it is desirable to eliminate a gap and to reduce contact heat resistance between members in contact with each other, by suitably pressurizing a portion between the semiconductor component having the incorporated semiconductor element and the cooling device. In this case, if rigidity of a case in which the semiconductor component having the incorporated semiconductor element or the cooling device is installed is high in a pressurizing direction, the rigidity hinders a heat transfer point from being suitably pressurized.

Abstract: A power conversion apparatus includes: a circuit body including a switching device; a base member forming a first concave portion and a cooling surface; and a wedge inserted in the first concave portion of the base member. The first concave portion of the base member is formed by a substrate portion forming the cooling surface, a first wall disposed on the opposite side of the substrate portion from the cooling surface, and an intermediate portion interconnecting the first wall and the substrate portion. The first wall forms an insertion space for insertion of the wedge, and a heat transfer plane forming a heat dissipating surface and a heat transfer path of the circuit body. The intermediate portion is plastically deformed by inserting the wedge into the insertion space, thus causing the first wall to be displaced toward the location of the circuit body.

Abstract: A power module or the like is provided in which lower inductance and miniaturization are achieved. The power module includes: main body units (11 to 13), cooling units (21 to 24) which cool the main body units (11 to 13), busbars (51, 52) connected to power terminals (1i, 1j) of the main body units (11 to 13), a casing (W) in which at least contact parts with the busbars (51, 52) are insulative, and a metal member (30) which supports the casing (W). The metal member (30) tightly contacts the casing (W), thereby forming a box with one side opened. At least the main body units (11 to 13) and the busbars (51, 52) are arranged inside the box. An insulating sealant is provided to fill the inside of the box.

Abstract: A semiconductor device has a packaging structure in which a top surface of a semiconductor chip 1 is electrically connected to a conductive member 4 through a deformation absorption layer 2a and a joining layer 3a and a bottom surface thereof is electrically connected to a conductive member 5 through a deformation absorption layer 2b and a joining layer 3b. Each of the deformation absorption layers 2a and 2b includes a nano-structure layer 7 arranged at a center of a thickness direction and plate layers 6 and 8 of two layers with the nano-structure layer 7 therebetween. The nano-structure layer 7 has a structure in which a plurality of nano-structures 9 having a size of 1 ?m or less are two-dimensionally arranged and thermal stress due to a thermal deformation difference of each member forming the semiconductor device is absorbed by deformation of the nano-structures 9.

Abstract: A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.

Abstract: An electronic catalog system sends catalog address information to a mobile phone through a wireless communication, sends catalog data adaptable to address information selected by the mobile phone to a storage server, and prints and outputs catalog data stored in the storage server.