Abstract: A plasma display panel includes a front plate having a dielectric layer covering a display electrode formed on a substrate and a protective layer formed on the dielectric layer, and a rear plate facing the front plate so as to form a discharge space. The plasma display panel also includes an address electrode in a direction crossing the display electrode, barrier ribs for partitioning the discharge space, and phosphor layers. The protective layer is constructed by forming a ground film on the dielectric layer and adhering agglomerated particles to the ground film. The agglomerated particles are produced by coagulating a plurality of crystal particles made of metal oxide.

Abstract: A plasma display panel has a front substrate including a plurality of display electrode pairs, a dielectric layer, and a protective layer, and a rear substrate including a plurality of data electrodes, a barrier rib, and a phosphor layer. The front substrate and rear substrate face each other so that the display electrode pairs and the data electrodes intersect, and a hydrogen-absorbing material containing palladium is disposed inside the plasma display panel.

Abstract: The plasma display panel has a front plate that has a dielectric layer for covering a display electrode formed on a substrate and a protective layer formed on the dielectric layer, and a rear plate that is faced to the front plate so as to form discharge space, and has an address electrode in the direction crossing the display electrode, barrier ribs for partitioning the discharge space, and phosphor layers. The protective layer is formed by forming a ground film on the dielectric layer and sticking a agglomerated particle to the ground film. Here, the agglomerated particle is produced by coagulating a plurality of crystal particles made of metal oxide.

Abstract: A plasma display panel has a front substrate including a plurality of display electrode pairs, a dielectric layer, and a protective layer, and a rear substrate including a plurality of data electrodes, a barrier rib, and a phosphor layer. The front substrate and rear substrate are faced to each other so that the display electrode pairs and the data electrodes intersect, and a hydrogen-absorbing material containing palladium inside is disposed.

Abstract: A circuit substrate comprises a terminal electrode having minute dents on its mounting surface, and a conductive adhesive provided on the surface of the terminal electrode. The conductive adhesive comprises conductive particles each having sizes so as to get in the minute dent. Thus, an electrical contact or a bonding area between the circuit substrate and the mounting device is enlarged and then connection reliability in a mount body of an electronic device is improved.

Abstract: The present invention provides a piezoelectric ceramic composition that is free from lead and has a small grain size, a high coupling coefficient, a high mechanical Q, and a large frequency constant. This composition is characterized by being expressed by a formula of (LixNa1−x−yKy)z−2wMa2wNb1−wMbwO3, wherein 0.03≦x≦0.2, 0≦y≦0.2, 0.98≦z≦1, 0<w≦0.05, Ma indicates at least one element selected from the alkaline-earth metals, and Mb denotes at least one element selected from Bi, Sb, and the rare earth elements.

Abstract: The piezoelectric ceramic composition of the present invention contains, as a main component, a material having a composition represented by Formula: CaMXBi4−xTi4−X(Nb1−ATaA)XO15, where M is at least one element selected from the group consisting of Ca, Sr, and Ba; 0.0≦A≦1.0; and 0.0≦X≦0.6.

Abstract: The present invention provides a piezoelectric ceramic composition that is free from lead and has a small grain size, a high coupling coefficient, a high mechanical Q, and a large frequency constant. This composition is characterized by being expressed by a formula of (LixNa1−x−yKy)z−2wMa2wNb1−2MbwO3, wherein 0.03≦x≦0.2, 0≦y≦0.2, 0.98≦z≦1, 0<w≦0.05, Ma indicates at least one element selected from the alkaline-earth metals, and Mb denotes at least one element selected from Bi, Sb, and the rare earth elements.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: The piezoelectric ceramic composition of the present invention contains, as a main component, a material having a composition represented by Formula: CaMXBi4−xTi4−X(Nb1−ATaA)XO15, where M is at least one element selected from the group consisting of Ca, Sr, and Ba; 0.0≦A≦1.0; and 0.0≦X≦0.6.

Abstract: A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: A laminated ceramic device formed by laminating ceramics and conductive metals having a conductor section at a part of at least one of its upper and lower surfaces, in which the difference in level between the conductor section and the section other than the conductor section is smaller than the thickness of the conductor section. Consequently, even in the case of arranging the pattern conductors on both the upper and the lower surfaces of the device, a laminated ceramic device can be obtained in which pattern conductors can be arranged with high accuracy at low cost, no special care is required in the case of polishing, and the thickness accuracy and the bond strength of electrodes are high.

Abstract: A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.