Abstract: There is provided a vacuum film deposition apparatus which forms a film on a substrate by a vacuum film deposition technique, include: substrate holding means for holding the substrate; a deposition preventing member for preventing film deposition at undesired positions within the apparatus; and contacting means for bringing the substrate or the substrate holding means and the deposition preventing member into contact with each other.

Abstract: A vacuum film deposition apparatus in which a film is formed on a substrate by a vacuum film deposition process includes a holder which has a substrate supporting surface which is in a curved shape and is brought into contact with the substrate. A substrate holder for holding the substrate includes a base having the substrate supporting surface. The apparatus and the substrate holder further include a contact detection mechanism which detects a state of contact between the substrate and the substrate supporting surface, a load applying mechanism which is provided outside the substrate supporting surface and supports the substrate by applying a load to end faces of the substrate and a control unit which controls the load the load applying mechanism applies to the substrate based on output from the contact detection mechanism.

Abstract: A substrate holder includes a holding unit which holds a substrate, a temperature measurement unit which is provided at a surface on a substrate side of the holding unit and is brought into contact with the substrate to measure a temperature of the substrate and a signal output unit which outputs temperature measurement signals from the temperature measurement unit. A vacuum film deposition apparatus has at least one vacuum film deposition unit including the substrate holder a vacuum chamber, a holder support portion provided within the vacuum chamber, connected to a connection portion of the substrate holder and supporting the substrate holder, a film deposition device forming a film by vacuum film deposition on the substrate held in the substrate holder and a signal receiving unit connected to the signal output unit and receiving the temperature measurement signals.

Abstract: The vacuum evaporation apparatus includes a vacuum chamber, a substrate holder which is disposed in the vacuum chamber and holds a substrate, and an evaporation source which is disposed in the vacuum chamber and evaporates a film-forming material. The substrate holder has a substrate holding portion which is made of a first material having a heat conductivity of at least 100 W/m·K and a specific gravity of up to 4.0×103 kg/m3 and a vapor deposition area-regulating member which is made of a second material that is different from the first material and has a melting point of at least 1300° C. This apparatus is capable of preventing a film-forming material from being deposited on the substrate holder surface while keeping the temperature within the substrate holder uniform.

Abstract: There is provided a vacuum film deposition apparatus which forms a film on a substrate by a vacuum film deposition technique, include: substrate holding means for holding the substrate; a deposition preventing member for preventing film deposition at undesired positions within the apparatus; and contacting means for bringing the substrate or the substrate holding means and the deposition preventing member into contact with each other.

Abstract: There is disclosed a method for producing an alkoxytitanium complex of formula (I), ##STR1## wherein Cp is a group having cyclopentadiene-type anion skeleton, A represents a carbon atom or silicon atom, R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which optionally may be substituted and the like, and R.sup.7 each independently represents an alkyl group having 1 to 10 carbon atoms which may be substituted and the like.