Abstract: A substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal display is polished to a flat mirror finish, and then cleaning a polished substrate that is cleaned to a high degree of cleanliness. A polishing section having at least one polishing unit for performs primary polishing and secondary polishing of the substrate by pressing the substrate against a polishing surface. A cleaning section cleans the substrate which has been polished to remove particles attached to the substrate by a scrubbing cleaning. Metal ions are removed from the substrate by supplying an etching liquid.

Abstract: A substrate cleaning apparatus is provided which comprises a box in which a substrate is cleaned with a cleaning liquid, and an exhaust system for exhausting the box, wherein the box is provided in its upper wall with an air intake opening and the exhaust system is fluidly connected to the box at a lower wall of the box so that air is introduced into the box through the air intake opening, flows down in the box passing around the substrate and finally exit the box through the exhaust system. A door is provided to close the air intake opening when an inside air pressure in the box becomes greater than an outside air pressure outside the box.

Abstract: The present invention provides a substrate cleaning apparatus which allows an end face and/or a bevel face of a substrate to be scrub-cleaned in a simple and effective manner. The apparatus comprises a plurality of rotatable substrate rotating rollers 12 and 14 for gripping the periphery of a substrate and rotating the substrate, a cleaning roller 48 capable of rotating and having a cleaning member 52 which is to be brought into contact with an end face and/or a bevel face of the substrate so as to apply scrub-cleaning to the end face and/or the bevel face, and a power transmission mechanism 64 for transmitting a rotating force of the substrate rotating roller 14 to the cleaning roller 48 so as to rotate the cleaning roller 48.