Patents by Inventor Hiroshi Soyama

Hiroshi Soyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10927031
    Abstract: A cutter edge is pressed against a brittle-material substrate so that a protruding portion of the cutter edge is positioned between a first edge of the brittle-material substrate and a side portion of the cutter edge and that a side portion of the cutter edge is positioned between the protruding portion of the cutter edge and a second edge of the brittle-material substrate. A scribe line is formed by a scratch between a first position closer to the first edge of the first and second edges and a second position closer to the second edge of the first and second edges. After the formation of the scribe line, a crack is extended in a thickness direction from the second position toward the first position along the scribe line, thus forming a crack line.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: February 23, 2021
    Inventor: Hiroshi Soyama
  • Publication number: 20200189957
    Abstract: A cutter edge is pressed against a brittle-material substrate so that a protruding portion of the cutter edge is positioned between a first edge of the brittle-material substrate and a side portion of the cutter edge and that a side portion of the cutter edge is positioned between the protruding portion of the cutter edge and a second edge of the brittle-material substrate. A scribe line is formed by a scratch between a first position closer to the first edge of the first and second edges and a second position closer to the second edge of the first and second edges. After the formation of the scribe line, a crack is extended in a thickness direction from the second position toward the first position along the scribe line, thus forming a crack line.
    Type: Application
    Filed: February 24, 2020
    Publication date: June 18, 2020
    Inventor: Hiroshi SOYAMA
  • Patent number: 10351461
    Abstract: A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: July 16, 2019
    Assignee: MITSUBOSHI DIAMOND INDUSTRlAL CO., LTD.
    Inventor: Hiroshi Soyama
  • Publication number: 20170183250
    Abstract: A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.
    Type: Application
    Filed: March 31, 2015
    Publication date: June 29, 2017
    Inventor: Hiroshi SOYAMA
  • Publication number: 20170113960
    Abstract: A cutter edge is pressed against a brittle-material substrate so that a protruding portion of the cutter edge is positioned between a first edge of the brittle-material substrate and a side portion of the cutter edge and that a side portion of the cutter edge is positioned between the protruding portion of the cutter edge and a second edge of the brittle-material substrate. A scribe line is formed by a scratch between a first position closer to the first edge of the first and second edges and a second position closer to the second edge of the first and second edges. After the formation of the scribe line, a crack is extended in a thickness direction from the second position toward the first position along the scribe line, thus forming a crack line.
    Type: Application
    Filed: March 12, 2015
    Publication date: April 27, 2017
    Inventor: Hiroshi SOYAMA
  • Patent number: 8881633
    Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: November 11, 2014
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Haruo Wakayama, Tetsuji Shiozawa, Takashi Sekijima, Noriyuki Ogasawara, Hiroshi Soyama
  • Patent number: 8707842
    Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: April 29, 2014
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Haruo Wakayama, Tetsuji Shiozawa, Takashi Sekijima, Noriyuki Ogasawara, Hiroshi Soyama
  • Publication number: 20110138986
    Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.
    Type: Application
    Filed: February 23, 2011
    Publication date: June 16, 2011
    Inventors: Haruo Wakayama, Tetsuji Shiozawa, Takashi Sekijima, Noriyuki Ogasawara, Hiroshi Soyama
  • Patent number: 7851241
    Abstract: There are provided a scribing step of performing scribing in a state in which a protective material is applied on at least one surface of a brittle material substrate, and a first scribing device that performs this scribing step. Accordingly, it is possible to form a vertical crack that reaches deep inside of the substrate, while effectively removing cullets produced at the time of severing the substrate, thus performing precise severing along a scribe line.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: December 14, 2010
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Kazuya Maekawa, Hiroshi Soyama
  • Patent number: 7814819
    Abstract: A rotating shaft (23) is inserted through an axial center of a cutter wheel tip for scribing a brittle object. The rotating shaft (23) is integrally provided with the cutter wheel tip. The rotating shaft (23) is inserted into supporting holes (14) provided in side walls (11) of a tip holder (11) so as to be supported. A groove (13) is formed in an upper portion of each supporting hole (14) along an axial direction of the supporting hole (14).
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: October 19, 2010
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventor: Hiroshi Soyama
  • Patent number: 7762171
    Abstract: A rotating shaft (23) is inserted through an axial center of a cutter wheel tip for scribing a brittle object. The rotating shaft (23) is integrally provided with the cutter wheel tip. The rotating shaft (23) is inserted into supporting holes (14) provided in side walls (11) of a tip holder (11) so as to be supported. A groove (13) is formed in an upper portion of each supporting hole (14) along an axial direction of the supporting hole (14).
    Type: Grant
    Filed: May 4, 2007
    Date of Patent: July 27, 2010
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventor: Hiroshi Soyama
  • Publication number: 20100116117
    Abstract: A rotating shaft (23) is inserted through an axial center of a cutter wheel tip for scribing a brittle object. The rotating shaft (23) is integrally provided with the cutter wheel tip. The rotating shaft (23) is inserted into supporting holes (14) provided in side walls (11) of a tip holder (11) so as to be supported. A groove (13) is formed in an upper portion of each supporting hole (14) along an axial direction of the supporting hole (14).
    Type: Application
    Filed: January 14, 2010
    Publication date: May 13, 2010
    Inventor: Hiroshi SOYAMA
  • Publication number: 20080022834
    Abstract: A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 ?m.
    Type: Application
    Filed: July 15, 2005
    Publication date: January 31, 2008
    Inventors: Haruo Wakayama, Tetsuji Shiozawa, Takashi Sekijima, Noriyuki Ogasawara, Hiroshi Soyama
  • Publication number: 20070204739
    Abstract: A rotating shaft (23) is inserted through an axial center of a cutter wheel tip for scribing a brittle object. The rotating shaft (23) is integrally provided with the cutter wheel tip. The rotating shaft (23) is inserted into supporting holes (14) provided in side walls (11) of a tip holder (11) so as to be supported. A groove (13) is formed in an upper portion of each supporting hole (14) along an axial direction of the supporting hole (14).
    Type: Application
    Filed: May 4, 2007
    Publication date: September 6, 2007
    Inventor: Hiroshi Soyama
  • Patent number: 7234383
    Abstract: A rotating shaft (23) is inserted through an axial center of a cutter wheel tip for scribing a brittle object. The rotating shaft (23) is integrally provided with the cutter wheel tip. The rotating shaft (23) is inserted into supporting holes (14) provided in side walls (11) of a tip holder (11) so as to be supported. A groove (13) is formed in an upper portion of each supporting hole (14) along an axial direction of the supporting hole (14).
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: June 26, 2007
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventor: Hiroshi Soyama
  • Publication number: 20050245051
    Abstract: There are provided a scribing step of performing scribing in a state in which a protective material is applied on at least one surface of a brittle material substrate, and a first scribing device that performs this scribing step. Accordingly, it is possible to form a vertical crack that reaches deep inside of the substrate, while effectively removing cullets produced at the time of severing the substrate, thus performing precise severing along a scribe line.
    Type: Application
    Filed: April 1, 2003
    Publication date: November 3, 2005
    Applicant: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Kazuya Maekawa, Hiroshi Soyama
  • Publication number: 20050098014
    Abstract: A rotating shaft (23) is inserted through an axial center of a cutter wheel chip for scribing a brittle object. The rotating shaft (23) is integrally provided with the cutter wheel chip. The rotating shaft (23) is inserted into supporting holes (14) provided in side walls (11) of a chip holder (11) so as to be supported. A groove (13) is formed in an upper portion of each supporting hole (14) along an axial direction of the supporting hole (14).
    Type: Application
    Filed: December 5, 2001
    Publication date: May 12, 2005
    Inventor: Hiroshi Soyama
  • Publication number: 20040123717
    Abstract: A cutter wheel 1 is formed with an insertion through-hole 6 at the center of the wheel, along with a blade-edge ridge 2 that is displaced to one side face from a center 5 between between wheel side faces 3 and 4. The larger the extent of displacement of the blade-edge ridge 2, that is, the greater the distance from the center 5 until the blade-edge ridge 2, or in other words, the smaller the distance between the left-side face 3 and the blade-edge ridge 2, the closer scribing can be performed to the convex portion and thin film X of the devices during scribing.
    Type: Application
    Filed: October 2, 2003
    Publication date: July 1, 2004
    Inventors: Kazuya Maekawa, Hiroshi Soyama
  • Patent number: 6629484
    Abstract: A cutter wheel for forming scribe lines on a brittle plate has a disk with two side planes. The disk has an edge formed at the outer periphery of the disk and a shaft hole formed at the center of the disk for inserting a rotational shaft. Further, at least one groove is formed to extend from a surface of one of the side planes along the shaft hole.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: October 7, 2003
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Hiroshi Soyama, Kazuya Maekawa
  • Publication number: 20020033087
    Abstract: A cutter wheel for forming scribe lines on a brittle plate has a disk with two side planes. The disk has an edge formed at the outer periphery of the disk and a shaft hole formed at the center of the disk for inserting a rotational shaft. Further, at least one groove is formed to extend from a surface of one of the side planes along the shaft hole.
    Type: Application
    Filed: August 2, 2001
    Publication date: March 21, 2002
    Inventors: Hiroshi Soyama, Kazuya Maekawa