Patents by Inventor Hiroshi Suenari

Hiroshi Suenari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8686088
    Abstract: Polypropylene resin compositions are suited for injection molding and are capable of giving molded articles having excellent mechanical properties, reduced tendency to cause flow marks or weld marks, low gloss, and superior scratch resistance. A polypropylene resin composition includes: an amount of a resin composition (F) including a polypropylene (A), an ethylene-?-olef in copolymer or an ethylene-?-olefin-diene copolymer (B-I) having MFR of less than 0.4 g/10 min, an ethylene-?-olefin copolymer (B-2) having MFR of 0.5 to less than 20 g/10 min, and an inorganic filler (C); and specific amounts relative to the resin composition (F) of a modified polypropylene (D) and a surface modifier (E).
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: April 1, 2014
    Assignee: Prime Polymer Co., Ltd.
    Inventors: Yoshio Sugimoto, Hiroshi Suenari, Ikunori Sakai, Frank E. Jones, Toru Fukada