Abstract: A wiring board comprising: a conductor layer comprising Fe and Cu; and at least one of a radiator, a connection terminal, a cover and a circuit component, connected to the conductor layer through a joining member, which is obtained by coating a copper paste comprising a copper powder, an organic vehicle and an Fe2O3 particle as a conductor layer on a ceramic green sheet and firing it.

Abstract: A wiring substrate comprised of a substrate main body made of glass-ceramic, a pad formed on a surface of the substrate main body and a conductor pin provided in an upright position on the pad. The pad is comprised of a ceramic that is the same as the ceramic constituting the glass-ceramic, Fe converted into Fe2O3 and Cu. The Fe2O3 comprises 1 to 28 parts by weight with respect to 100 parts by weight of the Cu.

Abstract: A dielectric material comprising: a glass powder constituted of a glass comprising Si, B and an alkali metal element, the glass being amorphous in sintering at a temperature of 1,050° C. or lower; and a ceramic filler comprising at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and an alkali metal element, wherein when a total sum of Si converted into SiO2, B converted into B2O3 and the alkali metal element converted into A2O, wherein A represents an alkali metal element, all of which are contained in the glass, is 100 mole %, the content of the alkali metal element converted into A2O, which is contained in the glass, is 0.5 mole % or less; and when a total sum of at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and the alkali metal element converted into A2O, all of which are contained in the ceramic filler, is 100 mole %, a content of the alkali metal element converted into A2O, which is contained in the ceramic filler, is 0.5 mole % or less.

Abstract: A wiring board comprising: a conductor layer comprising Fe and Cu; and at least one of a radiator, a connection terminal, a cover and a circuit component, connected to the conductor layer through a joining member, which is obtained by coating a copper paste comprising a copper powder, an organic vehicle and an Fe2O3 particle as a conductor layer on a ceramic green sheet and firing it.

Abstract: A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an Fe2O3 particle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.

Abstract: A paste for filling a throughhole, comprises: an epoxy resin; a curing agent; and a metal filler, wherein the metal filler is a powder comprising a base metal, and the curing agent is an imidazole compound represented by the following formula (1): wherein R1 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyalkyl group having 1 to 10 carbon atoms or an alkyloxy group having 1 to 10 carbon atoms.

Abstract: A wiring board obtained by coating a copper paste on a ceramic green sheet and firing it to form a conductor layer and an insulating layer, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: an SiO2 particle having an average particle size of 50 nm or less; and a ceramic particle having an average particle size of 100 nm or less and non-vitrifiable after sintering.

Abstract: A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an Fe2O3 particle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.

Abstract: This invention provides a high-frequency heating apparatus for heating by using magnetron including an inverter power supply as a magnetron-driving power supply, a cooling fan, and an air guide. The cooling fan is inclined against the vertical direction of the power supply and fitted to the air guide. This structure increases the cooling effect of the power supply. Additionally, the power supply includes temperature sensors provided on semiconductor elements and a controller for controlling the power supply and an operation of the heating apparatus according to the result of the sensors. These sensors avoid breaking down of the power supply caused by overheating.

Abstract: A dielectric material comprising: a glass powder constituted of a glass comprising Si, B and an alkali metal element, the glass being amorphous in sintering at a temperature of 1,050° C. or lower; and a ceramic filler comprising at least one member of SiO2, Al2O3 and 3Al2O3.2Si2, and an alkali metal element, wherein when a total sum of Si converted into SiO2, B converted into B2O3 and the alkali metal element converted into A2O, wherein A represents an alkali metal element, all of which are contained in the glass, is 100 mole %, the content of the alkali metal element converted into A2O, which is contained in the glass, is 0.5 mole % or less; and when a total sum of at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and the alkali metal element converted into A2O, all of which are contained in the ceramic filler, is 100 mole %, a content of the alkali metal element converted into A2O, which is contained in the ceramic filler, is 0.5 mole % or less.

Abstract: This invention provides a high-frequency heating apparatus for heating by using magnetron including an inverter power supply as a magnetron-driving power supply, a cooling fan, and an air guide. The cooling fan is inclined against the vertical direction of the power supply and fitted to the air guide. This structure increases the cooling effect of the power supply. Additionally, the power supply includes temperature sensors provided on semiconductor elements and control means for controlling the power supply and an operation of the heating apparatus according to the result of sensors. These sensors avoid breaking down of the power supply caused of overheating.

Abstract: A paste for filling a throughhole, comprises: an epoxy resin; a curing agent; and a metal filler, wherein the metal filler is a powder comprising a base metal, and the curing agent is an imidazole compound represented by the following formula (1): 1

Abstract: A paste for filling through-holes of a printed wiring board contains 100 parts by weight of an epoxy resin composition containing 90 to 99.5 parts by weight of an epoxy resin and 0.5 to 10 parts by weight of a curing agent; and (B) 500 to 1000 parts by weight of a metallic filler having an average particle size of 0.5 to 20 &mgr;m. The paste has a viscosity of not higher than 20,000 poise at 25° C. and a volatile content of not more than 1.0% when heated in a filling step. The paste exhibits such shrink-resistance properties that when a first cured resin obtained by heating in a filling step is re-heated and cooled in a solder reflow step to obtain a second cured resin, the shrinkage percentage of the first cured resin to the second cured resin in the longitudinal direction of the through-hole is not greater than 0.1%.

Abstract: The present invention provides a method for producing a calcium phosphate coating film on the surface of a substrate, even a substrate which has poor heat resistance. The method comprises the steps of soaking a substrate in a first solution containing phosphate ions, inter alia, aqueous solutions of a basic phosphate salt such as Na.sub.3 PO.sub.4 or Na.sub.2 HPO.sub.4 ; removing the substrate and drying it; and soaking the substrate in a second solution (aqueous solution) containing calcium ions, to thereby obtain a coating film comprising hydroxyapatite or a mixture containing hydroxyapatite and a hydroxyapatite precursor. The substrate removed from the second solution may be soaked in a third solution (aqueous solution) containing an apatite component at a substantially saturated or supersaturated concentration, to thereby form a hydroxyapatite coating film. There may be used substrates formed of metals, ceramics, organic polymer materials, etc.

Abstract: The main body of the image-forming machine is provided with an image-forming unit and a conveying unit disposed opposite to the image-forming unit. The conveying unit supports a mounting and detaching unit so that it is selectively movable to a set position or a non-set position. A locking means is provided between the mounting and detaching unit and the main body of the image-forming machine. When the mounting and detaching unit is held at the non-set position, the lock means is cancelled, and the conveying unit can be drawn from the main body of the image-forming machine. As a result, a large space is created beneath the image-forming unit, and jamming can be easily disposed of.