Patents by Inventor Hiroshi Tachioka

Hiroshi Tachioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure sensor device
    Patent number: 7392706
    Abstract: A sensor substrate 1 having on its lower surface a surface acoustic wave element 2 for detecting pressure is mounted on a supporting substrate 6 through a sealing member 4 surrounding a sensor section 2. A sealing space S is formed by the sensor substrate 1, the supporting substrate 6, and the sealing member 4, and the surface acoustic wave element 2 for detecting pressure is sealed hermetically in the sealing space S. Reliability can be enhanced by protecting the surface acoustic wave element 2 from the external environment.
    Type: Grant
    Filed: November 26, 2004
    Date of Patent: July 1, 2008
    Assignee: Kyocera Corporation
    Inventors: Kazuhisa Momose, Kaoru Matsuo, Shinichi Shimokihara, Hisayuki Inoue, Masashi Kamada, Hiroshi Tachioka, Kouichi Maruta, Hiroshi Oka
  • Pressure sensor device with surface acoustic wave elements
    Patent number: 7353710
    Abstract: Thickness of a pressure-detecting piezoelectric substrate (2) that is thinner than that of a supporting piezoelectric substrate (3) and that has a surface acoustic wave element for pressure detection (7a) on its lower surface is mounted on the supporting piezoelectric substrate (3) having a surface acoustic wave element for reference (4a) on its upper surface. A sealing member (5) is provided between the supporting piezoelectric substrate (3) and the pressure-detecting piezoelectric substrate (1). The surface acoustic wave element for pressure detection (7a) and the surface acoustic wave element for reference (4a) can be disposed in a space (S) enclosed with the pressure-detecting piezoelectric substrate (1) and the sealing member (5). It is possible to provide a small-sized pressure sensor device (1) that can perform temperature compensation and that has high reliability.
    Type: Grant
    Filed: November 26, 2004
    Date of Patent: April 8, 2008
    Assignee: Kyocera Corporation
    Inventors: Akira Oikawa, Kaoru Matsuo, Hiroshi Tachioka
  • Pressure sensor device
    Publication number: 20070107522
    Abstract: Thickness of a pressure-detecting piezoelectric substrate (2) that is thinner than that of a supporting piezoelectric substrate (3) and that has a surface acoustic wave element for pressure detection (7a) on its lower surface is mounted on the supporting piezoelectric substrate (3) having a surface acoustic wave element for reference (4a) on its upper surface. A sealing member (5) is provided between the supporting piezoelectric substrate (3) and the pressure-detecting piezoelectric substrate (1). The surface acoustic wave element for pressure detection (7a) and the surface acoustic wave element for reference (4a) can be disposed in a space (S) enclosed with the pressure-detecting piezoelectric substrate (1) and the sealing member (5). It is possible to provide a small-sized pressure sensor device (1) that can perform temperature compensation and that has high reliability.
    Type: Application
    Filed: November 26, 2004
    Publication date: May 17, 2007
    Inventors: Akira Oikawa, Kaoru Matsuo, Hiroshi Tachioka