Patents by Inventor Hiroshi Takabayashi

Hiroshi Takabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5042919
    Abstract: There is disclosed a method of connecting an external circuit, including the steps of disposing between an electrode for connecting the external circuit connected with an electrode for driving a liquid crystal panel and an external circuit electrode connected with the external circuit, a film comprising an insulating resin containing conductive particles dispersed therein, and applying a pulse voltage to a heat tool under the pressure-applied state.
    Type: Grant
    Filed: January 11, 1990
    Date of Patent: August 27, 1991
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shigeki Yabu, Hiroshi Takabayashi
  • Patent number: 5019201
    Abstract: There is disclosed a method of connecting an external circuit, comprising including the steps of disposing between an electrode for connecting the external circuit connected with an electrode for driving a liquid crystal panel and an external circuit electrode connected with the external circuit, a film comprising an insulating resin containing conductive particles dispersed therein, and applying a pulse voltage to a heat tool under the pressure-applied state.
    Type: Grant
    Filed: February 21, 1990
    Date of Patent: May 28, 1991
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shigeki Yabu, Hiroshi Takabayashi
  • Patent number: 4964700
    Abstract: A connection structure between a liquid crystal panel and an external circuit. The connection structure comprise an external circuit connection electrode connected to a drive electrode for a liquid crystal panel with a ferroelectric liquid crystal and arranged on a substrate of the liquid crystal panel, an external circuit electrode connected to an external circuit and arranged on a substrate of the external circuit, and a thermosetting component arranged between the external circuit connection electrode and the external circuit electrode and composed of a thermosetting resin containing dispersed conductor particles.
    Type: Grant
    Filed: December 8, 1989
    Date of Patent: October 23, 1990
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hiroshi Takabayashi