Abstract: There is provided an optical fiber module including a reel having a flange on one side of both sides thereof, a first optical fiber being wound around the reel, a first adhesive being applied to a roll of the first optical fiber so that lines of the first optical fiber are fixed to each other and the roll of the first optical fiber is fixed to the flange of the reel, and a first sheet member being fixed to the roll of the first optical fiber with the first adhesive.

Abstract: There is provided an optical fiber module including a reel having a flange on one side of both sides thereof, a first optical fiber being wound around the reel, a first adhesive being applied to a roll of the first optical fiber so that lines of the first optical fiber are fixed to each other and the roll of the first optical fiber is fixed to the flange of the reel, and a first sheet member being fixed to the roll of the first optical fiber with the first adhesive.

Abstract: An electronic device is provided that includes a first component generating heat, a second component to be heated, a heating part configured to heat the second component, and a case containing the first component, the second component, and the heating part. The second component is heated with the heating part and the heat generated by the first component.

Abstract: An electronic device is provided that includes a first component generating heat, a second component to be heated, a heating part configured to heat the second component, and a case containing the first component, the second component, and the heating part. The second component is heated with the heating part and the heat generated by the first component.

Abstract: An SFP module mounting structure whereby the region of a printed wiring board for mounting SFP modules is enlarged and thus the SFP modules can be mounted with high density. A swing mechanism constituted by the coupling between a holder and a base allows the holder to be swung in directions toward and away from the printed wiring board. Thus, when mounting an SFP module, the SFP module can be inserted into the holder with the holder kept in an obliquely raised state relative to the printed wiring board. Also, when detaching the SFP module, the SFP module can be pulled out of the holder with the holder obliquely raised from the printed wiring board.

Abstract: In an SFP module mounting structure where an SFP module connected to a connector mounted on a printed board is held by a holder, the holder has both side faces which hold the SFP module on the both sides, a flap which is provided on an upper edge of the both side faces so as to make the SFP module insertable and extractable in an oblique upper direction as well as to prevent the SFP module from being disengaged upward and a bottom face which supports the both side faces on the printed board. The connector may be provided with an electrode which is connected to the SFP module when the SFP module is inserted into the holder from the oblique upper direction and which has a returning elastic force enabling the SFP module to move pivotally down to a state that is parallel to the printed board.

Abstract: A telecommunication apparatus includes a shelf and a plurality of packages. Optical fibers are laid around a rear surface of the shelf in a direction of Z2. Each of the optical fibers is dragged in a direction of X1 into a corresponding cartridge from a rear surface thereof. The cartridge is provided near an upper side of the rear surface as an excessive length treating portion. Then the optical fiber is drawn out of an upper surface of the cartridge so as to enter a space formed in the upper shelf from the rear surface thereof. After that, the optical fiber is extended and connected to an optical plug provided on a front portion of the package.