Abstract: An optical module that facilitates positioning includes an optical device and a light transmitting member having a fitting portion into which a counterpart optical member is fitted and having a lens portion that collimates light of a first wavelength emitted from the optical device or that converges parallel light of the first wavelength emitted from the counterpart optical member into converged light to be incident on the optical device. The light transmitting member is formed such that a position of a leading end surface of the fitting portion coincides with a position of an imaging plane in a direction of the optical axis. The imaging plane is a plane on which irradiated visible light is imaged. The visible light has a second wavelength that is lower than the first wavelength and is transmitted through the lens portion and reflected from the optical device onto the imaging plane.

Abstract: An optical connector, in which light propagating between both connectors is parallel light, capable of reducing splicing loss due to angular or axial displacement is provided. An optical connector includes a first connector that includes a collimating lens that collimates light emitted from a light emitting member into parallel light and a first fitting, and a second connector that includes a convergent lens that converges the parallel light emitted from the first connector toward a light incident member and a second fitting configured to be fitted to the first fitting, in which an inner circumferential surface of one of the fitting has a tapered surface that widens toward its front end, and an outer circumferential surface of the other of the fittings that comes into contact with the inner circumferential surface of one fitting has a tapered surface that narrows toward its front end.

Abstract: A method of manufacturing an optical module includes the steps of applying the invisible light onto the resin member and the optical device, observing, with use of a camera, a part of the resin member located at the optical fiber coupling plane and an image formed at the optical fiber coupling plane by the optical device active layer while applying the invisible light onto the resin member and the optical device, aligning positions of the resin member and the circuit board with respect to each other while observing the part of the resin member located at the optical fiber coupling plane and the image formed at the optical fiber coupling plane, and fixing the resin member to the circuit board while maintaining the aligned positions of the resin member and the circuit board.

Abstract: In a powder supplying device, a powder container contains powder therein and is provided at a bottom of the powder container with a gas blowout part for ejecting gas to the inside of the powder container. A powder transport unit attracts powder contained in the powder container from a suction opening and transports the powder to a powder receiving device. A first detection unit is provided in the powder container to detect a remaining powder in the powder container.

Abstract: A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination, and a gas discharge unit that discharges gas contained within the particle accommodating unit toward an exterior side of the particle accommodating unit.

Abstract: A toner supplier, including a toner container configured to contain a toner, an air discharger configured to discharge air from a bottom of the toner container to form a fluidized toner, a detector configured to detect usage information of the toner contained in the toner container, and a communicator configured to send and receive the usage information. The communicator is configured to communicate with an image forming apparatus connected to the toner supplier and a controller connected to the toner supplier.

Abstract: A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination, and a gas discharge unit that discharges gas contained within the particle accommodating unit toward an exterior side of the particle accommodating unit.

Abstract: A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination, and a gas discharge unit that discharges gas contained within the particle accommodating unit toward an exterior side of the particle accommodating unit.

Abstract: A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, and a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination.

Abstract: In a powder supplying device, a powder container contains powder therein and is provided at a bottom of the powder container with a gas blowout part for ejecting gas to the inside of the powder container. A powder transport unit attracts powder contained in the powder container from a suction opening and transports the powder to a powder receiving device. A first detection unit is provided in the powder container to detect a remaining powder in the powder container.

Abstract: A toner supplier, including a toner container configured to contain a toner, an air discharger configured to discharge air from a bottom of the toner container to form a fluidized toner, a detector configured to detect usage information of the toner contained in the toner container, and a communicator configured to send and receive the usage information. The communicator is configured to communicate with an image forming apparatus connected to the toner supplier and a controller connected to the toner supplier.

Abstract: A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, and a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination.

Abstract: A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination, and a gas discharge unit that discharges gas contained within the particle accommodating unit toward an exterior side of the particle accommodating unit.

Abstract: Disclosed is a multi-layer paper suitable as a material for preparing heat-sensitive stencil printing masters. The multi-layer paper is produced by combining a plurality of thin paper layers by paper making. The multi-layer paper has a peel strength of 10 N/m or less and may be delaminated into at least two tissue sheets.

Abstract: A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.

Abstract: A heat-sensitive stencil including a resin film on which a thin resin layer and a porous resin layer are formed in succession.

Abstract: Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.

Abstract: The present invention provides a semiconductor device comprising a frame including a die pad and a lead portion, a semiconductor element, a wire including one end connected to the semiconductor element and another end connected to the lead portion, at least one first bonding portion formed of a solder material and bonding a part of the die pad to a part of the semiconductor element, and at least one second bonding portion formed of a thermosetting resin and bonding another part of the die pad to another part of the semiconductor element.

Abstract: Disclosed is a multi-layer paper suitable as a material for preparing heat-sensitive stencil printing masters. The multi-layer paper is produced by combining a plurality of thin paper layers by paper making. The multi-layer paper has a peel strength of 10 N/m or less and may be delaminated into at least two tissue sheets.

Abstract: A heat-sensitive stencil having a thermoplastic resin film, and a porous resin layer formed thereon. The stencil has an air permeability in the range of 1.0 cm3/cm2·sec to 157 cm3/cm2·sec in a portion thereof when the thermoplastic resin film of the portion is perforated to form perforations providing an open ratio SO/SP of at least 0.2, wherein SO represents a total area of the perforations and SP represents the area of the portion. The heat-sensitive stencil is prepared by applying a coating liquid containing the resin of the porous resin layer to the thermoplastic resin film and drying the coating. The coating liquid contains a mixture of a good solvent and a poor solvent less vaporizable than the good solvent so that the porous resin layer is formed after drying.