Abstract: The first image which is a continuous image divided into pages is printed on the first surface of web by the first printer, and the start mark is printed at the head of each page. The second image which is a continuous image is printed on the second surface by the second printer in synchronization with recording synchronization pulses. In printing of the second image, obtained is a difference between the number of pulses inputted to the second printing mechanism between detections of preceding and succeeding start marks, and the number of pulses estimated to be inputted thereto in the case where expansion or shrinkage of web doesn't occur, to adjust the frequency of pulses on the basis of the difference. Therefore, the second image is printed in accordance with the first image on the web without being affected by expansion or shrinkage of web.

Abstract: The first image which is a continuous image divided into pages is printed on the first surface of web by the first printer, and the start mark is printed at the head of each page. The second image which is a continuous image is printed on the second surface by the second printer in synchronization with recording synchronization pulses. In printing of the second image, obtained is a difference between the number of pulses inputted to the second printing mechanism between detections of preceding and succeeding start marks, and the number of pulses estimated to be inputted thereto in the case where expansion or shrinkage of web doesn't occur, to adjust the frequency of pulses on the basis of the difference. Therefore, the second image is printed in accordance with the first image on the web without being affected by expansion or shrinkage of web.

Abstract: A visual examination apparatus for a semiconductor device for optically reading an image of a semiconductor device having a substantially rectangular package is disclosed, comprising:four polarized light sources which are disposed so as to confront the four side surfaces of said package;four reflection means each of which is disposed between each of said four polarized light sources and the corresponding side surface of said package, and reflects a projection image at each side surface side which is formed from polarized light emitted to said package from a polarized light source which said reflection means confronts through said package; andimage reading means for collectively picking up projection images at the respective side surface sides which are reflected from said four reflection means and an image at the flat surface side of said package.

Abstract: An apparatus and method for inspecting the appearance of a semiconductor device to easily judge the acceptability of the device with a simple structure. The apparatus comprises light-reflecting means and an optical reading mechanism. The light-reflecting means is disposed alongside of at least one side surface of the semiconductor device. The reading mechanism reads an image of the side surface reflected by the light-reflecting means and an image of the top or bottom surface of the device simultaneously. The method is initiated by placing the light-reflecting means alongside of at least one side surface of the device. Then, the optical reading mechanism reads an image of the side surface reflected by the light-reflecting means and an image of the top or bottom surface of the device simultaneously. The bending of each lead of the semiconductor device is inspected according to the images read by the reading mechanism.

Abstract: An IC lead inspecting apparatus and a method of using such apparatus to measure any pitch deviation or coplanarity error of each IC lead. The apparatus comprises at least a displacement sensor for irradiating inspection light onto both an IC setting table and leads of an IC placed on the table so as to be inspected, and detecting the reflected light therefrom to measure the heights of the leads; and scanning means for moving the displacement sensor and the IC setting table relative to each other and scanning the lead array of the IC by the inspection light, wherein reference marks are formed on a scanning line of the inspection light on the IC setting table, and a surface portion of the table is composed of a transparent material. The pitch deviation of each lead is measured on the basis of a timing change in the output signal of the displacement sensor. And the upward or downward coplanarity error of each lead is measured from a level change in the output signal of the sensor.