Patents by Inventor Hiroshi Tomochika

Hiroshi Tomochika has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and process and leadframe for making the same
    Patent number: 5821611
    Abstract: A semiconductor device which comprises a first lead having a tip formed with an island, a semiconductor chip unit mounted on the island of the first lead by means of a solder layer and having a plurality of electrode bumps projecting away from the island, and a plurality of additional leads each of which has a tip electrically connected to the electrode bumps via respective solder deposits. The additional leads include at least second and third leads. The tips of the second and third leads are at least partially wider than the semiconductor chip.
    Type: Grant
    Filed: November 6, 1995
    Date of Patent: October 13, 1998
    Assignee: Rohm Co. Ltd.
    Inventors: Hitoshi Kubota, Masao Yamamoto, Komei Sudo, Daisuke Kitawaki, Takayuki Hamasaki, Masayoshi Akiyama, Hironobu Kawauchi, Masaru Nagano, Hiroshi Imai, Mitsunori Baba, Masaru Shoji, Hiroshi Tomochika