Patents by Inventor Hiroshi Tsukamoto

Hiroshi Tsukamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11456091
    Abstract: A multi-core cable includes a heat detection line including a twisted pair wire composed of a pair of heat detecting wires being twisted together, each of which includes a first conductor and a first insulator covering a periphery of the first conductor, a plurality of electric wires spirally twisted around the heat detection line, each of which includes a second conductor and a second insulator covering a periphery of the second conductor, and a sheath covering the heat detection line and the plurality of electric wires together. A melting point of the first insulator is lower than a melting point of the second insulator. The second conductor has a shape in a cross-section perpendicular to a cable longitudinal direction in which a width along a circumferential direction is gradually increased from a radially inward portion to a radially outward portion.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: September 27, 2022
    Assignee: HITACHI METALS, LTD.
    Inventors: Detian Huang, Yoshinori Tsukamoto, Masashi Moriyama, Takahiro Sugiyama, Hiroshi Ishikawa, Hideki Nonen
  • Patent number: 11397196
    Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: July 26, 2022
    Assignee: DENSO CORPORATION
    Inventors: Akito Sasaki, Ryosuke Sakai, Hiroaki Miwa, Takeshi Tsukamoto, Hiroshi Nomura, Takuma Esaka, Tatsuaki Sugito
  • Patent number: 10848897
    Abstract: An acoustic processing device performs acoustic processing in a space having a first listening position and a second listening position apart from the first listening position. The acoustic processing device includes a first input unit, a first output unit, and a signal processing circuit. The first input unit receives a first sound source signal to be reproduced at the first listening position. The first sound source signal includes a first left-channel signal and a first right-channel signal. The first output unit outputs the first sound source signal to a first speaker group including a first speaker disposed near a place of a head of a listener at the first listening position. The signal processing circuit draws out a first common signal common to both the first left-channel signal and the first right-channel signal and outputs the first common signal to the first speaker.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: November 24, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasuhiro Koyama, Takashi Nakanishi, Hiroshi Tsukamoto
  • Patent number: 10818620
    Abstract: In a method of manufacturing a semiconductor device, a semiconductor chip has first and second pads, a passivation film formed such that respective parts of the first and second pads are exposed, a first surface-metal-layer provided on the part of the first pad and a part of the passivation film, and a second surface-metal-layer provided on the part of the second pad and another part of the passivation film. Respective wires are electrically connected to the first and second surface-metal-layers. The semiconductor chip and the respective wires are then sealed with a resin.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: October 27, 2020
    Assignee: Renesas Electronics Corporation
    Inventors: Hiromi Shigihara, Hiroshi Tsukamoto, Akira Yajima
  • Publication number: 20200015029
    Abstract: An acoustic processing device performs acoustic processing in a space having a first listening position and a second listening position apart from the first listening position. The acoustic processing device includes a first input unit, a first output unit, and a signal processing circuit. The first input unit receives a first sound source signal to be reproduced at the first listening position. The first sound source signal includes a first left-channel signal and a first right-channel signal. The first output unit outputs the first sound source signal to a first speaker group including a first speaker disposed near a place of a head of a listener at the first listening position. The signal processing circuit draws out a first common signal common to both the first left-channel signal and the first right-channel signal and outputs the first common signal to the first speaker.
    Type: Application
    Filed: September 20, 2019
    Publication date: January 9, 2020
    Inventors: YASUHIRO KOYAMA, TAKASHI NAKANISHI, HIROSHI TSUKAMOTO
  • Patent number: 9704805
    Abstract: To provide a semiconductor device having improved reliability by improving a coupling property between a semiconductor chip and a bonding wire. A redistribution layer is comprised of a Cu film, an Ni film, and a Pd film which have been formed successively from the side of a semiconductor substrate. The Pd film on the uppermost surface is used as an electrode pad and a bonding wire made of Cu is coupled to the upper surface of the Pd film. The thickness of the Pd film is made smaller than that of the Ni film and the thickness of the Ni film is made smaller than that of the Cu film. The Cu film, the Ni film, and the Pd film have the same pattern shape in a plan view.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: July 11, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Hisao Shigihara, Hiromi Shigihara, Akira Yajima, Hiroshi Tsukamoto
  • Publication number: 20170005048
    Abstract: In a method of manufacturing a semiconductor device, a semiconductor chip has first and second pads, a passivation film formed such that respective parts of the first and second pads are exposed, a first surface-metal-layer provided on the part of the first pad and a part of the passivation film, and a second surface-metal-layer provided on the part of the second pad and another part of the passivation film. Respective wires are electrically connected to the first and second surface-metal-layers. The semiconductor chip and the respective wires are then sealed with a resin.
    Type: Application
    Filed: September 13, 2016
    Publication date: January 5, 2017
    Inventors: HIROMI SHIGIHARA, HIROSHI TSUKAMOTO, AKIRA YAJIMA
  • Patent number: 9466559
    Abstract: In semiconductor integrated circuit devices for vehicle use, an aluminum pad on a semiconductor chip and an external device are coupled to each other by wire bonding using a gold wire for the convenience of mounting. Such a semiconductor integrated circuit device, however, causes a connection failure due to the interaction between aluminum and gold in use for a long time at a relatively high temperature (about 150 degrees C.). A semiconductor integrated circuit device can include a semiconductor chip as a part of the device, an electrolytic gold plated surface film (gold-based metal plated film) provided over an aluminum-based bonding pad on a semiconductor chip via a barrier metal film, and a gold bonding wire (gold-based bonding wire) for interconnection between the plated surface film and an external lead provided over a wiring board (wiring substrate).
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: October 11, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Hiromi Shigihara, Hiroshi Tsukamoto, Akira Yajima
  • Publication number: 20160240484
    Abstract: To provide a semiconductor device having improved reliability by improving a coupling property between a semiconductor chip and a bonding wire. A redistribution layer is comprised of a Cu film, an Ni film, and a Pd film which have been formed successively from the side of a semiconductor substrate. The Pd film on the uppermost surface is used as an electrode pad and a bonding wire made of Cu is coupled to the upper surface of the Pd film. The thickness of the Pd film is made smaller than that of the Ni film and the thickness of the Ni film is made smaller than that of the Cu film. The Cu film, the Ni film, and the Pd film have the same pattern shape in a plan view.
    Type: Application
    Filed: April 27, 2016
    Publication date: August 18, 2016
    Inventors: Hisao SHIGIHARA, Hiromi SHIGIHARA, Akira YAJIMA, Hiroshi TSUKAMOTO
  • Patent number: 9343395
    Abstract: To provide a semiconductor device having improved reliability by improving a coupling property between a semiconductor chip and a bonding wire. A redistribution layer is comprised of a Cu film, an Ni film, and a Pd film which have been formed successively from the side of a semiconductor substrate. The Pd film on the uppermost surface is used as an electrode pad and a bonding wire made of Cu is coupled to the upper surface of the Pd film. The thickness of the Pd film is made smaller than that of the Ni film and the thickness of the Ni film is made smaller than that of the Cu film. The Cu film, the Ni film, and the Pd film have the same pattern shape in a plan view.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: May 17, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Hisao Shigihara, Hiromi Shigihara, Akira Yajima, Hiroshi Tsukamoto
  • Publication number: 20140021618
    Abstract: To provide a semiconductor device having improved reliability by improving a coupling property between a semiconductor chip and a bonding wire. A redistribution layer is comprised of a Cu film, an Ni film, and a Pd film which have been formed successively from the side of a semiconductor substrate. The Pd film on the uppermost surface is used as an electrode pad and a bonding wire made of Cu is coupled to the upper surface of the Pd film. The thickness of the Pd film is made smaller than that of the Ni film and the thickness of the Ni film is made smaller than that of the Cu film. The Cu film, the Ni film, and the Pd film have the same pattern shape in a plan view.
    Type: Application
    Filed: June 24, 2013
    Publication date: January 23, 2014
    Inventors: Hisao SHIGIHARA, Hiromi SHIGIHARA, Akira YAJIMA, Hiroshi TSUKAMOTO
  • Publication number: 20130313708
    Abstract: In semiconductor integrated circuit devices for vehicle use, an aluminum pad on a semiconductor chip and an external device are coupled to each other by wire bonding using a gold wire for the convenience of mounting. Such a semiconductor integrated circuit device, however, causes a connection failure due to the interaction between aluminum and gold in use for a long time at a relatively high temperature (about 150 degrees C.). A semiconductor integrated circuit device can include a semiconductor chip as a part of the device, an electrolytic gold plated surface film (gold-based metal plated film) provided over an aluminum-based bonding pad on a semiconductor chip via a barrier metal film, and a gold bonding wire (gold-based bonding wire) for interconnection between the plated surface film and an external lead provided over a wiring board (wiring substrate).
    Type: Application
    Filed: July 27, 2013
    Publication date: November 28, 2013
    Applicant: Renesas Electronics Corporation
    Inventors: Hiromi SHIGIHARA, Hiroshi TSUKAMOTO, Akira YAJIMA
  • Patent number: 8592984
    Abstract: To suppress peeling of an Au pad for external coupling provided in a rewiring containing Cu as a main component. On the surface of a rewiring including a two-layer film in which a first Ni film is laminated on the top of a Cu film, a pad to which a wire is coupled is formed. The pad includes a two-layer film in which an Au film is laminated on the top of a second Ni film and formed integrally so as to cover the top surface and the side surface of the rewiring. Due to this, the area of contact between the rewiring and the pad increases, and therefore, the pad becomes difficult to be peeled off from the rewiring.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: November 26, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Hiromi Shigihara, Akira Yajima, Hisao Shigihara, Hiroshi Tsukamoto
  • Patent number: 8372617
    Abstract: The present invention provides an extremely useful and novel ?-galactoside-?2,6-sialyltransferase having an optimum reaction pH in a neutral to alkaline range, and a nucleic acid encoding the sialyltransferase. The present invention further provides a vector carrying a nucleic acid encoding the sialyltransferase, and a host cell transformed with the vector, as well as a method for producing a recombinant ?-galactoside-?2,6-sialyltransferase.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: February 12, 2013
    Assignee: Japan Tobacco Inc.
    Inventors: Takeshi Yamamoto, Yoshimitsu Takakura, Toshiki Mine, Yoko Hamada, Hitomi Kajiwara, Masako Ichikawa, Hiroshi Tsukamoto
  • Patent number: 8343727
    Abstract: The present invention provides a method of binding a protein to a carrier in such a way that the protein is not impaired in its function but can be allowed to act more efficiently than when it is bound directly. The method of the present invention for binding a protein to a carrier comprises: preparing a biotin-bound carrier; preparing a fusion protein having the protein bound to a tamavidin; and binding the protein to the carrier via tamavidin-biotin bonds.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: January 1, 2013
    Assignee: Japan Tobacco Inc.
    Inventors: Yoshimitsu Takakura, Masako Ichikawa, Satoru Usami, Takeshi Yamamoto, Hiroshi Tsukamoto, Hitomi Kajiwara, Naomi Oka
  • Publication number: 20120282659
    Abstract: The present invention provides an extremely useful and novel ?-galactoside-?2,6-sialyltransferase having an optimum reaction pH in a neutral to alkaline range, and a nucleic acid encoding the sialyltransferase. The present invention further provides a vector carrying a nucleic acid encoding the sialyltransferase, and a host cell transformed with the vector, as well as a method for producing a recombinant ?-galactoside-?2,6-sialyltransferase.
    Type: Application
    Filed: April 25, 2012
    Publication date: November 8, 2012
    Inventors: Takeshi Yamamoto, Yoshimitsu Takakura, Toshiki Mine, Yoko Hamada, Hitomi Kajiwara, Masako Ichikawa, Hiroshi Tsukamoto
  • Publication number: 20120184016
    Abstract: The present invention provides a novel protein having neuraminidase activity and/or ?-galactoside-?2,6-sialyltransferase activity and a nucleic acid encoding the protein. The present invention further provides a vector containing a nucleic acid encoding the protein, a host cell transformed with the vector, together with a method for producing a recombinant ?-galactoside-?2,6-sialyltransferase. The present invention also provides an antibody specifically recognizing the protein.
    Type: Application
    Filed: June 11, 2010
    Publication date: July 19, 2012
    Inventors: Toshiki Mine, Takeshi Yamamoto, Hitomi Kajiwara, Hiroshi Tsukamoto
  • Patent number: 8210830
    Abstract: A channel is formed as an asymmetric diffuser-shaped channel having a narrow channel on a diffuser inlet side and a wide channel on a diffuser outlet side. The narrow channel is communicated with a variable volume chamber which is provided therein with a piezoelectric element. Vibration generated by actuation of the piezoelectric element causes a pressure variation of a fluid in the variable volume chamber to generate a nozzle flow which in turn causes a smooth flow of the fluid from the wide channel to the narrow channel.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: July 3, 2012
    Assignee: Kyushu Institute of Technology
    Inventors: Koji Miyazaki, Seiichi Tanaka, Hiroyuki Shimooka, Hiroshi Tsukamoto
  • Patent number: 8198881
    Abstract: A chopper type DC-DC converter includes a voltage converting circuit, a comparative wave generating circuit, a comparator group, and a switch control circuit. The voltage converting circuit converts a first voltage into a second voltage. The comparative wave generating circuit generates first and second comparative waves such that the voltage range of the first comparative wave is different from the voltage range of the second comparative wave. The comparator group generates a first comparison result signal indicating a result of comparison between the first comparative wave and an error signal indicating an error between the second voltage and target voltage and a second comparison result signal indicating a result of comparison between the second comparative wave and the error signal. The switch control circuit controls the voltage converting circuit based on the first and second comparison signals. The comparative wave generating circuit includes first and second comparative wave generating circuits.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: June 12, 2012
    Assignee: Renesas Electronics Corporation
    Inventor: Hiroshi Tsukamoto
  • Patent number: 8187853
    Abstract: The present invention provides an extremely useful and novel ?-galactoside-?2,6-sialyltransferase having an optimum reaction pH in a neutral to alkaline range, and a nucleic acid encoding the sialyltransferase. The present invention further provides a vector carrying a nucleic acid encoding the sialyltransferase, and a host cell transformed with the vector, as well as a method for producing a recombinant ?-galactoside-?2,6-sialyltransferase.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: May 29, 2012
    Assignee: Japan Tobacco Inc.
    Inventors: Takeshi Yamamoto, Yoshimitsu Takakura, Toshiki Mine, Yoko Hamada, Hitomi Kajiwara, Masako Ichikawa, Hiroshi Tsukamoto