Abstract: A circuit module mounting structure and a method for mounting an IC chip in the circuit module applicable to electronic equipment with a slim body. To increase radiation efficiency of the heat emitted from the IC chip, a heat conducting element including a plurality of thin plates is provided between a radiation plate of a heat sink unit and a surface of the IC chip. Further, the plurality of thin plates of the heat conducting element have sufficient flexibility to absorb stresses appearing at coupling portions of the elements due to dimensional tolerances of the elements.

Abstract: An apparatus for cooling an electric component is provided on an electronic component mounted on a printed circuit board. The apparatus comprises a heat radiation member having a base contacting the electronic component such that heat can be conducted, and a plurality of heat radiation fins provided and standing integrally on the side of the base which is distant from the electronic component. The electronic component and the heat radiation member are surrounded by a duct member which lets air flow through the heat radiation fins. Top ends of the plurality of heat radiation fins which are distant from the base are connected to the duct member such that heat can be conducted. The duct member and the base are connected through a heat pipe such that heat can be conducted.

Abstract: A circuit module mounting structure and a method for mounting an IC chip in the circuit module applicable to electronic equipment with a slim body. To increase radiation efficiency of the heat emitted from the IC chip, a heat conducting element including a plurality of thin plates is provided between a radiation plate of a heat sink unit and a surface of the IC chip. Further, the plurality of thin plates of the heat conducting element have sufficient flexibility to absorb stresses appearing at coupling portions of the elements due to dimensional tolerances of the elements.

Abstract: An apparatus for cooling an electric component is provided on an electronic component mounted on a printed circuit board. The apparatus comprises a heat radiation member having a base contacting the electronic component such that heat can be conducted, and a plurality of heat radiation fins provided and standing integrally on the side of the base which is distant from the electronic component. The electronic component and the heat radiation member are surrounded by a duct member which lets air flow through the heat radiation fins. Top ends of the plurality of heat radiation fins which are distant from the base are connected to the duct member such that heat can be conducted. The duct member and the base are connected through a heat pipe such that heat can be conducted.

Abstract: The present invention is intended to improve the heat radiating performance of an electronic apparatus provided with semiconductor devices which generate heat at a high rate. An air passage (20) is formed in a case 10, and a fan (6) produces air currents in the air passage (20). Heat generated by a heat-generative part (1) mounted on a circuit board (2) is transferred to a wall (21) included in walls defining the air passage (20) by a heat transfer member (3), such as a heat pipe, and is carried outside the case 10 by cooling air flowing through the air passage (20).

Abstract: An electronic apparatus having a housing, a heat-generating component provided in the housing, and a heat sink for cooling the heat-generating component. The heat sink has two metal plates. The first metal plate has a heat receiving portion thermally connected to the heat-generating component. The second metal plate is laid on the first metal plate and thermally connected thereto.