Abstract: Systems including power device embedded PCBs coupled to cooling devices and methods of forming the same are disclosed. One system includes a power device embedded PCB stack, a cooling assembly including a cold plate having one or more recesses therein, and a buffer cell disposed within each of the one or more recesses. The cooling assembly is bonded to the PCB stack with a insulation substrate disposed therebetween. The cooling assembly is arranged such that the buffer cell faces the PCB stack and absorbs stress generated at an interface of the PCB stack and the cooling assembly.

Abstract: Systems including power device embedded PCBs coupled to cooling devices and methods of forming the same are disclosed. One system includes a power device embedded PCB stack, a cooling assembly including a cold plate having one or more recesses therein, and a buffer cell disposed within each of the one or more recesses. The cooling assembly is bonded to the PCB stack with a insulation substrate disposed therebetween. The cooling assembly is arranged such that the buffer cell faces the PCB stack and absorbs stress generated at an interface of the PCB stack and the cooling assembly.

Abstract: A vehicle can include a window including an interior side and an exterior side. The vehicle can include a camera located on an exterior of the vehicle. The camera can be operatively positioned to capture visual data of a blind spot of an external environment of the vehicle. The vehicle can include a dual-sided transparent display forming at least a portion of the window. The vehicle can include a processor operatively connected to the camera and the dual-sided transparent display. The processor can be configured to selectively cause the dual-sided transparent display to display exterior visual information on the exterior side. The processor can be configured to selectively cause the dual-sided transparent to display interior visual information on the interior side. The interior visual information can include the visual data of the blind spot of the vehicle.

Abstract: Printed circuit board (PCB) substrates include at least one pre-preg layer interposed between one or more electrically conductive layers, power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration, and a flat heat pipe positioned between the power device stacks within the at least one pre-preg layer, one surface of the flat heat pipe directly bonded to a first one of the power device stacks and an opposite surface of the flat heat pipe thermally coupled to a second one of the power device stacks.

Abstract: A circuit board assembly includes a printed circuit board (PCB) substrate, a cooling assembly, an intermediate layer, one or more power devices, and a plurality of conductive layers arranged within the PCB substrate. The PCB substrate has a first surface and an opposite second surface that has a first electrical pattern. The cooling assembly is thermally coupled to the second surface of the PCB substrate. The intermediate layer is sandwiched between the PCB substrate and the cooling assembly. The one or more power devices are embedded within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly. At least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.

Abstract: A power electronics module includes a glass layer with one or more vias extending through the glass layer and having an electrically and thermally conductive material disposed within the one or more vias, a power electronic device directly bonded to a first surface of the glass layer, and, a cooling structure thermally coupled to a second surface of the glass layer.

Abstract: A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.

Abstract: The semiconductor device includes a semiconductor module and a cooler. The semiconductor module includes an insulator substrate, an inner conductor film disposed on a first surface of the insulator substrate, a semiconductor element connected to the inner conductor film, a sealing body sealing the inner conductor film and the semiconductor element, and an outer conductor film disposed on a second surface of the insulator substrate and exposed from a surface of the sealing body. The cooler is disposed adjacent to the outer conductor film via a thermal interface material having fluidity. The outer conductor film has a protruding portion or a recessed portion on a surface being in contact with the thermal interface material.

Abstract: Methods, apparatuses and systems provide technology for a high frequency alternating-current (HFAC) distribution network for a vehicle that includes a plurality of HFAC zones coupled to a direct-current (DC) power source, the plurality of HFAC zones disbursed within the vehicle, where each HFAC zone includes a HFAC resonant inverter to convert DC power to HFAC power and a HFAC bus coupled to the HFAC resonant inverter, the HFAC bus to distribute the HFAC power to one or more loads. The technology includes a CLCL resonant tank circuit having two capacitors and two inductors, a push-pull circuit coupled to the CLCL resonant tank circuit, the push-pull circuit including a pair of switches, and a transformer to couple the inverter to the HFAC bus.

Abstract: A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.

Abstract: Systems and methods are provided for wireless power transfer in a vehicle. A wireless power transfer system can include a high-frequency alternating current (HFAC) inverter electrically coupled to the power source and a transmitter to wirelessly transmit a HFAC power signal to at least one device of a vehicle, such as sensors (e.g., LiDAR, GPS etc.) and cameras. The HFAC power signal provides wireless power and a data signal to the at least one device of a vehicle. The wireless power transfer system can eliminate the need for cabling and wires to provide power to the device. Wireless power transfer can include use or a data modulation circuit and a pulse current source to inject a pulse current to the HFAC power signal as superimposed data. System configurations can power a plurality of devices. Systems can includes a plurality of HFAC inverters and transmitters to power multiple sets of devices.

Abstract: A circuit board assembly includes a printed circuit board (PCB) substrate, a cooling assembly, an intermediate layer, one or more power devices, and a plurality of conductive layers arranged within the PCB substrate. The PCB substrate has a first surface and an opposite second surface that has a first electrical pattern. The cooling assembly is thermally coupled to the second surface of the PCB substrate. The intermediate layer is sandwiched between the PCB substrate and the cooling assembly. The one or more power devices are embedded within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly. At least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.

Abstract: An integrated power electronic assembly includes a power electronic device, a cooling assembly offset from and thermally coupled to a second edge of the power electronic device, and a thermal spreader offset from and thermally coupled to a first edge of the power electronic device. The first edge of the power electronic device is opposite the second edge of the power electronic device, and the thermal spreader is thermally coupled to the cooling assembly.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.

Abstract: A configurable, double sided, manifold micro-channel cold plate includes a one or more manifold micro-channel cold plate cells. Each cold plate cell includes a manifold body, a manifold insert, a plurality of heat sinks, and a plurality of longitudinal openings configured for fluidic communication with the fluid channels. The manifold body has fluid channels to permit flow of a fluid coolant. The manifold insert has a plurality of manifold insert fluid channels, and is configured for receipt in the one of the modular body recesses. The heat sinks are configured for receipt in the modular body recesses, and include an impingement surface configured for fluidic communication with the manifold insert fluid channels, and a heat transfer surface for thermal communication with one or more heat generating devices.

Abstract: A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.

Abstract: A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces.

Abstract: Electronics assemblies incorporating three-dimensional heat flow structures are disclosed herein. In one embodiment, an electronics assembly includes a substrate having a surface defining a plane, a heat generating component coupled to the surface of the substrate, a cooling device positioned outside of the plane defined by the surface of the substrate, and a three-dimensional heat flow structure. The three-dimensional heat flow structure includes a first portion thermally coupled to the heat generating component and a second portion extending from the first portion. At least a portion of the first portion is parallel to the plane defined by the substrate. The second portion is transverse to the plane defined by the surface of the substrate. The second portion is thermally coupled to the cooling device such that the three-dimensional heat flow structure thermally couples the heat generating component to the cooling device.

Abstract: A solder degradation information generation apparatus related to a motor drive circuit that includes a power supply, a converter, a smoothing capacitor, and an electric motor is disclosed. The solder degradation information generation apparatus includes a semiconductor element that forms an upper arm of the converter and is bonded to a substrate via a solder, the substrate being cooled by a coolant, a measuring unit configured to measure a temperature of the semiconductor element and a processing device that generates information indicating a degradation state of the solder based on a measurement result of the measuring unit that is obtained during a period in which the smoothing capacitor is charged.

Abstract: A hybrid vehicle includes a first controller configured to output a first control signal for a first inverter, a second controller configured to output a second control signal for a second inverter and a third control signal for the first inverter, and a selection circuit configured to output either of the first control signal or the third control signal to the first inverter. The third control signal is a signal for simultaneously turning on either of upper arm switching elements or lower arm switching elements of a plurality of arms of the first inverter. The second controller starts an engine by outputting the third control signal while outputting the second control signal to drive a second motor generator when abnormality occurs in the first controller.