Patents by Inventor Hiroshi UMEBAYASHI

Hiroshi UMEBAYASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150637
    Abstract: There is provided a clay-like thermal conductive member having low adhesion and low hardness. A soft thermal conductive member comprising grease and thermal conductive particles, wherein the thermal conductive particles are contained in an amount of 550 to 800 parts by mass with respect to 100 parts by mass of the grease, the thermal conductive particles are composed of first thermal conductive particles having an average particle diameter of 30 to 55 ?m and second thermal conductive particles having an average particle diameter of 3 to 15 ?m, and a blending ratio of the first thermal conductive particles and the second thermal conductive particles is 7:3 to 5:5 on a mass basis, the type OO hardness is 70 or less, an adhesive strength at a temperature of 25° C. in which a circular area with a diameter of 13 mm is defined as a unit area is 10N or less, and a thermal conductivity is 0.4 W/m·K or more.
    Type: Application
    Filed: February 24, 2022
    Publication date: May 9, 2024
    Applicant: NOK CORPORATION
    Inventors: Shunichi TSUNAJIMA, Hiroshi UMEBAYASHI
  • Publication number: 20200316582
    Abstract: A liquid injection attachment is provided that includes an attachment body having an insertion opening into which a liquid injecting implement is inserted and a liquid flow outlet; a gasket mounting portion formed on the periphery on the front end side of the attachment body; and a gasket mounted to the gasket mounting portion and brought into close contact with the peripheral portion of the liquid flow outlet, wherein the gasket mounting portion has an engaging recess and/or engaging protrusions, the gasket has an engaging protrusion 19 and/or engaging recesses, and the engagement direction thereof is in a direction toward a central axis of the attachment body.
    Type: Application
    Filed: May 11, 2017
    Publication date: October 8, 2020
    Applicant: NOK CORPORATION
    Inventors: Ryo FUTASHIMA, Hiroshi UMEBAYASHI, Toru UDA
  • Patent number: 10584983
    Abstract: The present invention aims at providing a cover structure of a tactile sensor and a tactile sensor that can secure sufficient adhesion between a sensor body and a covering layer without providing an adhesive layer and have no possibility of causing a sensor to make detection error due to the covering layer formed thereon. A cover structure of a tactile sensor according to the present invention includes a sensor body 2 and a covering layer 3 made of elastic body molded on the sensor body 2. The covering layer 3 includes at least two layers of an outer layer 32 disposed as the outermost layer and an inner layer 31 disposed to come in contact with the sensor body 2 and having a higher adhesiveness and a lower hardness than those of the outer layer 32, and is integrally molded with the sensor body 2 by the cast molding.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: March 10, 2020
    Assignees: NOK CORPORATION, NIPPON MEKTRON, LTD.
    Inventors: Yuki Murota, Hiroshi Umebayashi, Toru Uda, Hidekazu Yoshihara, Taisuke Kimura, Keizo Toyama
  • Publication number: 20170343394
    Abstract: The present invention aims at providing a cover structure of a tactile sensor and a tactile sensor that can secure sufficient adhesion between a sensor body and a covering layer without providing an adhesive layer and have no possibility of causing a sensor to make detection error due to the covering layer formed thereon. A cover structure of a tactile sensor according to the present invention includes a sensor body 2 and a covering layer 3 made of elastic body molded on the sensor body 2. The covering layer 3 includes at least two layers of an outer layer 32 disposed as the outermost layer and an inner layer 31 disposed to come in contact with the sensor body 2 and having a higher adhesiveness and a lower hardness than those of the outer layer 32, and is integrally molded with the sensor body 2 by the cast molding.
    Type: Application
    Filed: January 29, 2016
    Publication date: November 30, 2017
    Applicants: NOK Corporation, Nippon Mektron, Ltd.
    Inventors: Yuki MUROTA, Hiroshi UMEBAYASHI, Toru UDA, Hidekazu YOSHIHARA, Taisuke KIMURA, Keizo TOYAMA
  • Publication number: 20160332157
    Abstract: An object of the present invention is to provide a liquid injection attachment enabling a simple liquid injection into a feed port by merely mounting the attachment onto the distal portion of a pipette or a pipette tip when liquid is injected into the feed port, as well as capable of exhibiting an excellent sealing performance without a risk to deform or damage the pipette or the pipette tip, to thereby suppress leakage of liquid during the liquid injection. The object is achieved by a liquid injection attachment removably mounted on a pipette injecting liquid into a feed port through which liquid is introduced or on a pipette tip fitted to the pipette, the attachment including a tubular attachment body having at its distal end a liquid outlet and having at its proximal end an insertion port into which a distal portion of the pipette or of the pipette tip is inserted; and a gasket formed from a rubber-like elastic body disposed around the liquid outlet of the attachment body.
    Type: Application
    Filed: April 8, 2015
    Publication date: November 17, 2016
    Applicant: NOK Corporation
    Inventors: Toru UDA, Goki OKADA, Hiroshi UMEBAYASHI, Yuki MUROTA