Abstract: An endoscopic clip device including a clip, a treatment instrument body comprising a sheath, an operation wire, and a distal connection portion, a sleeve accommodated inside the sheath and accommodating the connection portion in distal portion of the wire such that portion of inner diameter of the sleeve is smaller than outer diameter of the locking portion when the connection portion is drawable from the accommodation portion. The sleeve has diameter enlargement portion on distal side of the sleeve and elastically self-openable, a diameter reduction step portion on proximal side of the enlargement portion, and a sleeve body positioned on the proximal side of the enlargement portion from the step portion and having radial rigidity higher than that of the enlargement portion, and the inner diameter of the sleeve body is smaller than the outer diameter of the locking portion when the connection portion is drawable from the accommodation portion.

Abstract: A movable member is gripped in a delamination-start configuration, and the other-end side of a rib of a delamination member is pressed towards the other-end side of a flexible plate. The flexible plate then warps and deforms about the other end side of the flexible plate, which is supported by a support member, the flexible plate deforming along the direction in which delamination progresses. In concert with the delamination action, a reinforcing plate also warps and deforms along with the flexible plate, the reinforcing plate being vacuum-chucked to an air-permeable electroconductive sheet on the flexible plate, and the reinforcing plate is sequentially delaminated from a substrate 2 along the direction in which delamination progresses.

Abstract: In a peeling starting portion preparing method of a laminate, for the laminate including a first substrate and a second substrate peelably attached via an adsorption layer, a knife is inserted with a predetermined amount from an end surface of the laminate into an interface between the first substrate and the adsorption layer so as to prepare the peeling starting portion at the interface. The knife includes a main body portion, a cutting edge portion continuous with the main body portion and tapered in a side view, and a ridge line which is a boundary between the main body portion and the cutting edge portion, and at least a part of the adsorption layer is scraped off by a ridge line portion including the ridge line.

Abstract: A movable member is gripped in a delamination-start configuration, and the other-end side of a rib of a delamination member is pressed towards the other-end side of a flexible plate. The flexible plate then warps and deforms about the other end side of the flexible plate, which is supported by a support member, the flexible plate deforming along the direction in which delamination progresses. In concert with the delamination action, a reinforcing plate also warps and deforms along with the flexible plate, the reinforcing plate being vacuum-chucked to an air-permeable electroconductive sheet on the flexible plate, and the reinforcing plate is sequentially delaminated from a substrate 2 along the direction in which delamination progresses.

Abstract: In a peeling starting portion preparing method of a laminate, for the laminate including a first substrate and a second substrate peelably attached via an adsorption layer, a knife is inserted with a predetermined amount from an end surface of the laminate into an interface between the first substrate and the adsorption layer so as to prepare the peeling starting portion at the interface. The knife includes a main body portion, a cutting edge portion continuous with the main body portion and tapered in a side view, and a ridge line which is a boundary between the main body portion and the cutting edge portion, and at least a part of the adsorption layer is scraped off by a ridge line portion including the ridge line.

Abstract: A substrate suctioning device includes a table having a suction surface suctioning a substrate, and a plurality of suction units provided on the suction surface of the table. The substrate suctioning device includes a control unit that, with setting a group of suction unit(s) among the plurality of suction units as a starting point, sequentially decompresses a plurality of remaining suction units disposed in a direction away from the group of suction unit(s) as the starting point, along the direction away from the group of suction unit(s) as the starting point.

Abstract: The present invention is related to a method for producing a resin compact containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler. The method includes a kneading and crushing process for preparing a first powder material obtained by mixing, heat-melting, kneading and crushing a first component containing the epoxy resin and the curing agent and the inorganic filler, but not containing the curing accelerator; a pulverizing process for preparing a second powder material obtained by pulverizing a second component containing the curing accelerator; a mixing process for preparing a resin composition by dispersing and mixing the first powder material and the second powder material; and a molding process for obtaining the resin compact by compression-molding the resin composition. This makes it possible to obtain a resin compact (particularly, a resin compact for encapsulation) having superior long term storage stability at room temperature, good curable property and fluidity.

Abstract: The present invention is related to a method for producing a resin compact containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler. The method includes a kneading and crushing process for preparing a first powder material obtained by mixing, heat-melting, kneading and crushing a first component containing the epoxy resin and the curing agent and the inorganic filler, but not containing the curing accelerator; a pulverizing process for preparing a second powder material obtained by pulverizing a second component containing the curing accelerator; a mixing process for preparing a resin composition by dispersing and mixing the first powder material and the second powder material; and a molding process for obtaining the resin compact by compression-molding the resin composition. This makes it possible to obtain a resin compact (particularly, a resin compact for encapsulation) having superior long term storage stability at room temperature, good curable property and fluidity.