Abstract: A method of producing a raw material solution for a film-forming according to a Mist CVD method including a temperature at which a solute containing a metallic element is mixed with a solvent and stirred is 30° C. or higher, and a method of film-forming according to the Mist CVD method using a raw material solution produced by the method of producing the raw material solution.

Abstract: A deep groove ball bearing includes an outer ring, an inner ring, a plurality of balls, and a seal member. An axial cross-sectional width is smaller than a radial cross-sectional height, a thickness of the inner ring is greater than a thickness of the outer ring, and a pitch diameter of the ball is larger than a median diameter between an inner diameter of the inner ring and an outer diameter of the outer ring A radial dimension between an outer diameter of a shoulder portion of the inner ring and an inner diameter of the seal member is greater than the thickness of the outer ring. As a result, width and weight can be reduced, a load capacity can be secured, grease leakage can be prevented, and a service lifespan can be extended.

Abstract: According to one embodiment, a damaged region determination system of the embodiment includes a plurality of sensors, a position locator, and a determiner. The plurality of sensors detects elastic waves generated in a target object related to a railway which is a determination target of a damaged region. The position locator locates positions of sources of a plurality of elastic waves based on the plurality of elastic waves detected by each of the plurality of sensors. The determiner determines the damaged region in the target object based on the positions of the sources of the plurality of elastic waves.

Abstract: A method for manufacturing a semiconductor device including a plurality of semiconductor chips includes steps of placing, on a first semiconductor chip, a second semiconductor chip, such that a plurality of bumps is located between the first semiconductor chip and the second semiconductor chip, determining a distance between the first semiconductor chip and the second semiconductor chip, and determining whether or not the distance is within a predetermined range and stopping placement of additional chips if the distance is determined to be outside the predetermined range.

Abstract: A method for manufacturing a semiconductor device including a plurality of semiconductor chips includes steps of placing, on a first semiconductor chip, a second semiconductor chip, such that a plurality of bumps is located between the first semiconductor chip and the second semiconductor chip, determining a distance between the first semiconductor chip and the second semiconductor chip, and determining whether or not the distance is within a predetermined range and stopping placement of additional chips if the distance is determined to be outside the predetermined range.

Abstract: In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.

Abstract: In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.

Abstract: In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.

Abstract: A semiconductor device, includes: a wiring substrate, a stacked body mounted on the wiring substrate, an underfill layer filled into gaps between respective semiconductor chips of the stacked body; and a molding body made up of a molding resin covered and formed at outside of the stacked body and so on. The underfill layer is made up of a cured product of a resin material containing an amine-based curing agent, and the cured product has a Tg of 65° C. or more and 100° C. or less.

Abstract: In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.

Abstract: A semiconductor device, includes: a wiring substrate, a stacked body mounted on the wiring substrate, an underfill layer filled into gaps between respective semiconductor chips of the stacked body; and a molding body made up of a molding resin covered and formed at outside of the stacked body and so on. The underfill layer is made up of a cured product of a resin material containing an amine-based curing agent, and the cured product has a Tg of 65° C. or more and 100° C. or less.

Abstract: In one embodiment, a semiconductor device includes a circuit substrate, and first and second semiconductor chips mounted on it. The first semiconductor chip and the second semiconductor chip are flip-chip connected, and an underfill resin is filled between them. The underfill resin has a fillet portion. A thickness T1 of the first semiconductor chip and a thickness T2 of the second semiconductor chip satisfy a relationship of T1/(T1+T2)?0.6.

Abstract: In a boat having a seat, a steering wheel, and an outboard motor, an outboard motor steering system is provided, where the steering wheel is installed near the seat a steering angle sensor installed near the steering wheel for outputting a signal indicative of a steering angle of the steering wheel. The steering system also includes a swivel shaft connected to a propeller to turn the propeller relative to the boat, and an electric motor connected to the swivel shaft for rotating the swivel shaft in response to the detected steering angle. The steering system also includes a manipulation load regulation mechanism, such as a hydraulic damper, to produce an added load for increasing a manipulation load of the steering wheel, thereby enabling reduced operator load by using the electric motor to steer the outboard motor, while improving the operator's feel of steering wheel manipulation.

Abstract: In an engine speed control system for an outboard motor, overrev prevention control is implemented which determines whether the engine overrevs by comparing the detected engine speed and a desired speed and responds to a determination that the engine overrevs (in which case the cause of the engine speed increase is probably reduced load caused by sucking in of air and/or exhaust gas by the propeller) by driving an electric throttle motor in the direction of reducing the throttle opening, thereby lowering the engine speed to the desired speed. Owing to this configuration, the problem of decline in thrust owing to intake of air and/or exhaust gas by the propeller can be quickly overcome irrespective of operator skill, thereby improving power performance and steerability.

Abstract: In an outboard motor control system equipped with an electric throttle motor for moving the throttle valve of the engine mounted on the outboard motor, an electric shift motor for operating the shift mechanism to establish one from the in-gear, neutral and reverse shift positions, and a low-speed cruising switch for inputting the instruction to implement a low-speed cruising for causing the boat to cruise at a low speed, when the instruction is inputted, a throttle control is effected by controlling the operation of the motor to a set throttle opening and shift control is effected by controlling the operation of the motor to establish the in-gear position and neutral position alternatively, thereby enabling to cruise over a wide range of speeds including very slow, without requiring troublesome manual operations.

Abstract: In an outboard motor adapted for mounting on a boat and equipped with an internal combustion engine, an electric motor, a battery for supplying voltage to the engine and electric motor, and a controller for controlling the operation of the electric motor, the controller is disposed near the battery. In other words, the controller is not installed on the outboard motor side where the engine and the like are present but on the boat side where the battery is installed. As a result, the effect of the vibration and heat of the engine on the controller is minimized so that the controller can utilize simpler structural features for vibration and heat resistance and is also advantageous in terms of cost.

Abstract: An outboard motor engine speed control system includes two outboard motors, sensors which detect a travel speed of the boat and the engine speeds of the outboard motors, and a controller which controls the engine speeds of the outboard motors to be synchronized with a highest one of the detected engine speeds when the boat travel speed is equal to or higher than a predetermined value, while controlling the engine speeds of the outboard motors to be synchronized with a lowest one of the detected engine speeds when the boat travel speed is lower the predetermined value. The operations involved in engine speed control of the outboard motors mounted on the boat are thereby simplified and the feel of operation is enhanced.

Abstract: A steering system of an outboard motor is provided that is mounted on a stern of a boat and having an internal combustion engine at its upper portion and a propeller with a rudder at its lower portion that is powered by the engine to propel the boat. The steering system includes a cowl enclosing the engine and a hydraulic cylinder connected to the outboard motor at one end and to the boat at other end to swivel the outboard motor relative to the boat to steer the cowl, the propeller, and the engine about a vertical axis. The hydraulic cylinder is located inside a vertical plane of a profile of the outboard motor when viewed along the vertical axis such that the hydraulic cylinder never projects outside the profile in any steered position of the motor.

Abstract: In an outboard motor adapted for mounting on a boat and equipped with an internal combustion engine, an electric motor, a battery for supplying voltage to the engine and electric motor, and a controller for controlling the operation of the electric motor, the controller is disposed near the battery. In other words, the controller is not installed on the outboard motor side where the engine and the like are present but on the boat side where the battery is installed. As a result, the effect of the vibration and heat of the engine on the controller is minimized so that the controller can utilize simpler structural features for vibration and heat resistance and is also advantageous in terms of cost.

Abstract: In an engine speed control system for an outboard motor having a throttle valve that regulates air to be sucked and an actuator connected to the throttle valve to move it in an opening direction or in a closing direction, the actuator is driven to move the throttle valve in the closing direction such that the engine speed drops, if it is discriminated that a detected engine speed exceeds a predetermined speed (set to a speed at which the engine can assumably continue to run until the boat has returned to port), when a trouble has occurred in the engine. Thus, the system can lower the engine speed so as to allow the boat to return to port, without causing the engine to vibrate, when a trouble has occurred in the engine.