Patents by Inventor Hiroshi Yada

Hiroshi Yada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8480843
    Abstract: A process for protecting a surface of a metal layer or a metal oxide layer including providing a protective film containing a base material and a pressure-sensitive adhesive layer formed thereon, wherein the surface of the pressure-sensitive adhesive layer has a contact angle with methylene iodide as measured just after contact, ?1, of 70° or smaller and a change in contact angle with methylene iodide through 30-second standing, ??, of 8% or less.
    Type: Grant
    Filed: May 18, 2007
    Date of Patent: July 9, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Tsuyoshi Inoue, Kazuhito Okumura, Hiroshi Yada
  • Publication number: 20080020228
    Abstract: A protective film contains a base material and a pressure-sensitive adhesive layer formed thereon, wherein the surface of the pressure-sensitive adhesive layer has a contact angle with methylene iodide as measured just after contact, ?1, of 70° or smaller and a change in contact angle with methylene iodide through 30-second standing, ??, of 8% or less.
    Type: Application
    Filed: July 24, 2007
    Publication date: January 24, 2008
    Inventors: Tsuyoshi INOUE, Kazuhito Okumura, Hiroshi Yada
  • Publication number: 20070215275
    Abstract: A process for protecting a surface of a metal layer or a metal oxide layer including providing a protective film containing a base material and a pressure-sensitive adhesive layer formed thereon, wherein the surface of the pressure-sensitive adhesive layer has a contact angle with methylene iodide as measured just after contact, ?1, of 70° or smaller and a change in contact angle with methylene iodide through 30-second standing, ??, of 8% or less.
    Type: Application
    Filed: May 18, 2007
    Publication date: September 20, 2007
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tsuyoshi Inoue, Kazuhito Okumura, Hiroshi Yada
  • Publication number: 20040001949
    Abstract: A protective film contains a base material and a pressure-sensitive adhesive layer formed thereon, wherein the surface of the pressure-sensitive adhesive layer has a contact angle with methylene iodide as measured just after contact, &thgr;1, of 70° or smaller and a change in contact angle with methylene iodide through 30-second standing, &Dgr;&thgr;, of 8% or less.
    Type: Application
    Filed: June 4, 2003
    Publication date: January 1, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tsuyoshi Inoue, Kazuhito Okumura, Hiroshi Yada
  • Patent number: 6211268
    Abstract: A polyoxymethylene resin composition comprising: (A) 100 parts by weight of a polyoxymethylene copolymer; (B) 0.01 to 7 parts by weight of an amine-substituted triazine compound; and (C) 0.01 to 5 parts by weight of (C-1) polyethylene glycol having an average molecular weight of 10,000 or more and/or (C-2) modified polyolefin wax having an acidic group with an acid value of 0.5 to 60 mg-KOH/g. According to the present invention, there can be provided a polyoxymethylene resin molded product which has low shrink anisotropy, excellent thermal stability and dimensional stability.
    Type: Grant
    Filed: May 7, 1999
    Date of Patent: April 3, 2001
    Assignee: Mitsubishi Gas Chemical Co Inc
    Inventors: Takatoshi Matsumura, Chiharu Nishizawa, Hiroshi Mimura, Hiroshi Yada, Kazuo Kurashige
  • Patent number: 5529504
    Abstract: A microconnection device and a method of forming such a device include providing an array of electrically interconnected conductors within through holes of an insulative flexible film. Preferably, each conductor has a microbump. Since the conductors are interconnected, the microbumps define a cluster for contact with a single contact, such as an input/output pad of a semiconductor device. In the preferred embodiment, the flexible film includes a cavity at the central region of the cluster, thereby enhancing the flexibility of the film. By applying a load force within the central region of the cluster, the flexible film is caused to bend in a manner to achieve load compliance and a lateral scrub for removing contaminants, oxides and the like at the interface of the microbumps and the contact. A top bump that is misaligned with the microbumps may be formed to ensure proper localization of the load force within the central region. Preferably, the flexible film includes an array of microconnection devices.
    Type: Grant
    Filed: April 18, 1995
    Date of Patent: June 25, 1996
    Assignee: Hewlett-Packard Company
    Inventors: Michael Greenstein, Masakuzu Sugimoto, Hiroshi Yada
  • Patent number: 5191006
    Abstract: An oxymethylene copolymer composition which comprises an intimate mixture containing:(A) 100 parts by weight of an oxymethylene copolymer,(B) 0.01 to 2 parts by weight of an ester composed of a polyhydric alcohol having 2 to 10 carbon atoms and a higher fatty acid having 22 to 32 carbon atoms, and(C) 0.01 to 3 parts by weight of an alkaline earth metal salt of a fatty acid having 12 to 35 carbon atoms.
    Type: Grant
    Filed: June 24, 1991
    Date of Patent: March 2, 1993
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Isamu Matsumoto, Zenpei Mizutani, Hiroshi Yada, Yoshihito Hara
  • Patent number: 5187218
    Abstract: An acetal resin composition comprising:(A) 100 parts by weight of an acetal resin,(B) 0.01 to 5 parts by weight of a terminal-etherified polyalkylene glycol of the formula (I)R.sup.1 --O--(--R.sup.2 --O--).sub.m --R.sup.3wherein R.sup.1 is a hydrogen atom, an aliphatic hydrocarbon group having 1 to 7 carbon atoms, an aryl group or an aralkyl group, R.sup.2 is an alkylene group having 2 to 3 carbon atoms, R.sup.3 is an aliphatic hydrocarbon group having 1 to 7 carbon atoms, an aryl group or an aralkyl group, and m is a number of at least 20, and(C) 0.01 to 2 parts by weight of an ester from a polyhydric alcohol having 2 to 10 carbon atoms and a higher fatty acid having 22 to 32 carbon atoms. This acetal resin composition has highly improved mold releasability when injection-molded without any substantial impairment of mechanicla properties and thermal stability inherent to an acetal resin and gives precision molded articles having little molding strain.
    Type: Grant
    Filed: August 5, 1991
    Date of Patent: February 16, 1993
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Isamu Masumoto, Zenpei Mizutani, Hiroshi Yada, Yoshihito Hara
  • Patent number: 4740747
    Abstract: A method of and apparatus for measuring the degree of transformation of the structure of an object. An object is placed between a transmission coil and a receiving coil. An A.C. current or a pulse current or a combination of the A.C. current and the pulse current are supplied to the transmission coil, and the degree of transformation is detected by means of an electric signal obtained through the receiving coil.
    Type: Grant
    Filed: February 11, 1985
    Date of Patent: April 26, 1988
    Assignee: Nippon Steel Corporation
    Inventors: Katsuhiro Kawashima, Masaaki Hatta, Hiroshi Yada
  • Patent number: 4537644
    Abstract: A high-tension high-toughness steel excellent in resistance to delayed fracture which consists essentially of 0.15 to 0.50% of C, up to 1.50% of Si, 0.20 to 1.50% of Mn, up to 2.00% of Cr, 0.0005 to 0.0030% of B, 0.005 to 0.10% of acid-soluble Al, up to 0.010% of P, up to 0.0020% of N, 0.010 to 0.050% of Ti and the balance iron and inevitable impurities, and has a tempered martensitic structure obtained by quenching and tempering.
    Type: Grant
    Filed: September 21, 1982
    Date of Patent: August 27, 1985
    Assignee: Nippon Steel Corporation
    Inventors: Jiro Tominaga, Hiroshi Yada, Mitsuo Honda
  • Patent number: 4466842
    Abstract: A novel hot-rolled ferritic steel composed of 70% or more of equiaxed ferrite grains having an ultra-fine grain size of 4 .mu.m or less. This steel is produced by a hot working at approximately the Ar.sub.3 point and by one or more passes of the hot working having a total reduction ratio of at least 75%. When a plurality of passes is carried out, the time between passes is less than one second. Due to hot working, dynamic transformation of austenite and/or dynamic recrystallization of ferrite takes place. The total reduction ratio may be at least 35% for a high purity steel.
    Type: Grant
    Filed: April 1, 1983
    Date of Patent: August 21, 1984
    Assignee: Nippon Steel Corporation
    Inventors: Hiroshi Yada, Yoshikazu Matsumura, Koe Nakajima
  • Patent number: 4300862
    Abstract: An end milling tool has a main body formed at its front end with a long main cutting end edge extending generally radially from the outer periphery of the main body approximately to the center of the main body and with a short auxiliary cutting end edge extending from a different location on the outer periphery generally radially inwardly to a position spaced from the center. An outer peripheral cutting edge is formed at an outer peripheral portion of the main body and is continuous with each of the main and auxiliary cutting edges. The main cutting end edge projects axially of the main body beyond the auxiliary cutting end edge to prevent the auxiliary cutting end edge from breaking or chipping.
    Type: Grant
    Filed: September 5, 1979
    Date of Patent: November 17, 1981
    Assignee: Dijet Industrial Co., Ltd.
    Inventor: Hiroshi Yada
  • Patent number: 3960612
    Abstract: A low temperature high strength tough steel is provided by effecting a series of heat treatments at predetermined temperatures.The steel comprises C, Si, Mn, Ni, Mo, Nb, N, Al, and if necessary, V, Ti, Cr, Ca or Ce in predetermined amounts with the rest iron and unavoidable impurities.
    Type: Grant
    Filed: August 7, 1974
    Date of Patent: June 1, 1976
    Assignee: Nippon Steel Corporation
    Inventors: Katsuo Kaku, Hirofumi Yoshimura, Hiroshi Yada, Naoomi Yamada
  • Patent number: 3949186
    Abstract: A hollow precision-machined body, such as a circular waveguide for transmission of millimeter wavelengths, is welded to a metallic body with minimum distortion of the precision body, by directing a concentrated beam of heat-producing energy such as an electron beam or a laser beam or a plasma across and peripherally about the interface between the precision and metallic bodies to produce a bead whose width at the contact area is related to the clearance between the bead and the inner surface of the precision tube and the maximum allowable strain at the inner face of the precision tube. Alternately, the energy beam is directed along the interface and around the periphery thereof to produce a bead whose depth of penetration is related to the thickness of the precision body and the maximum permissible strain at the inner surface of the precision body.
    Type: Grant
    Filed: September 27, 1974
    Date of Patent: April 6, 1976
    Assignees: Nippon Steel Corporation, The Furukawa Electric Co., Ltd.
    Inventors: Masatoki Nakayama, Saburo Shikoh, Hiroshi Nohgata, Yasuo Kimiya, Hiroshi Yada, Sin-ichi Nisida, Mikio Ogai