Patents by Inventor Hiroshi Yagi

Hiroshi Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070188073
    Abstract: A fluorescent lamp is configured so that a glass bulb has a phosphor film formed on its internal face, and a rare gas and an amalgam pellet are enclosed therein. The amalgam pellet contains zinc, tin, and mercury as principal components, one amalgam pellet is enclosed in the glass bulb, and the amalgam pellet has a weight of not more than 20 mg. The fluorescent lamp satisfies the relationship expressed as: 45×(1?A)?x?55x(1?A), 75A?y?85A, 45?30A?z?55?30A, and x+y+z?100, where x represents a content of zinc contained in the amalgam pellet in percent by weight, y represents a content of tin therein in percent by weight, and z represents a content of mercury therein in percent by weight. This configuration allows the fluorescent lamp to be characterized in that an amount of released mercury that is necessary for the first lighting of the fluorescent lamp is secured, and that the phosphor film is less prone to being peeled due to the amalgam.
    Type: Application
    Filed: June 22, 2005
    Publication date: August 16, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroshi Yagi, Yoshio Manabe, Tsuyoshi Terada
  • Publication number: 20070190302
    Abstract: A hydrogen-purification membrane comprises a Pd alloy film joined to one surface of a porous support substrate. Each pore in the porous support substrate is such that between the thickness T of the porous support substrate, the opening diameter D1 of the pore on the side joined to the Pd alloy film and the opening diameter D2 of the pore on the opposite side, there are relations represented by 1.0?D1/T?5.0 and 1.0?D2/T?5.0, and between the opening diameter D1 of the pore on the side joined to the Pd alloy film, the opening diameter D2 of the pore on the opposite side and the opening diameter D3 of the narrowest portion of the pore there are relations represented by D3/D1<0.8, D3/D2<0.9 and D3<250 ?m. Furthermore, the total opening area of the pores on the side joined to the Pd alloy film accounts for 20 to 80% of the area of the porous support substrate.
    Type: Application
    Filed: October 18, 2005
    Publication date: August 16, 2007
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Takanori Maeda, Hiroshi Yagi, Asako Harayama
  • Patent number: 7252189
    Abstract: A method and device for aligning orientation of laminated planer electrodes in laminated electronic parts when the parts are conveyed on a transport passage of a parts feeder. A magnetic field generation unit is disposed beside and outside of the parts feeder for applying magnetic field lines extending in horizontal or vertical direction. Orientation of the electrodes is in conformance with the direction of the magnetic field lines.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: August 7, 2007
    Assignee: TDK Corporation
    Inventor: Hiroshi Yagi
  • Publication number: 20070175764
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Application
    Filed: April 9, 2007
    Publication date: August 2, 2007
    Applicant: DAI NIPPON INSATSU KABUSHIKI KAISHA
    Inventors: Hiroshi YAGI, Takanori MAEDA, Yoshinori OOTA, Yasuhiro UCHIDA
  • Publication number: 20070163175
    Abstract: A structure of a microreactor includes a joined body having a pair of substrates joined together, a flow path formed by a microchannel portion formed on a joining surface of at least one of the substrates, and a catalyst carrying member disposed in the flow path. In the production of such a microreactor, the catalyst carrying member is produced separately from formation of the joined body and the catalyst carrying member is disposed in the flow path at the time of forming the joined body.
    Type: Application
    Filed: February 25, 2005
    Publication date: July 19, 2007
    Applicants: Dai Nippon Printing Co., Ltd., The Furukawa Electric Co., Ltd, Furukawa-Sky Aluminum Corp.
    Inventors: Takeshi Kihara, Hiroshi Yagi, Koichi Suzuki, Yoshiaki Ogiwara, Junji Ninomiya, Kazunori Ishikawa
  • Patent number: 7241396
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Grant
    Filed: April 12, 2006
    Date of Patent: July 10, 2007
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Patent number: 7226806
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: June 5, 2007
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20070120229
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable byawet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Application
    Filed: January 25, 2007
    Publication date: May 31, 2007
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20070080319
    Abstract: A corrosion inhibitor for magnesium and/or magnesium alloy containing, as an effective component, a least one kind of compound selected from the group consisting of a compound of the formula (1) and a compound of the formula (2) and salts thereof, and a process for producing components or parts made of magnesium and/or magnesium alloy using the corrosion inhibitor wherein R1 is a hydrogen atom, or C1-4 alkyl, R2 is a hydrogen atom, C1-4 alkyl, mercapto or hydroxy, R3 is a hydrogen atom, C1-4 alkyl or hydroxy, A is —N? or —C(R4)?, R4 is a hydrogen atom or amino.
    Type: Application
    Filed: November 10, 2003
    Publication date: April 12, 2007
    Inventors: Kazunori Fukumura, Yuhua Yu, Masaya Kajimoto, Hiroshi Hama, Takashi Hamauzu, Hiroshi Yagi
  • Publication number: 20070067681
    Abstract: There is provided a maintenance system including a maintenance server that provides maintenance information and an image processing device that has at least one of copy, print, facsimile and scan functions and which, upon detection of a maintenance event upon which a maintenance process to be carried out with respect to the image processing device, accesses the maintenance server, acquires from the maintenance server maintenance information indicating a maintenance process corresponding to the detected maintenance event, and displays the acquired maintenance information on a display.
    Type: Application
    Filed: September 19, 2006
    Publication date: March 22, 2007
    Inventors: Yuji Hikawa, Hiroshi Yagi, Yukio Tajima, Satoshi Kamiya, Kazuko Kirihara, Takahiko Suzuki, Makoto Takada, Tomokazu Yoshimura
  • Publication number: 20070057938
    Abstract: A data input means inputs boundary data of an object to a computer, a data converting means converts the boundary data into a triangle patch having a phase, an associating means divides a space into rectangular parallelepiped cells having boundary planes intersecting perpendicularly and associates the cell with a triangle to be included in the cell, a dividing/arranging means divides a triangle patch having a phase and floating in the space at cell faces and keeps all triangles arranged within and on the boundaries of cells, a ridge line integrating means integrates ridges that do not alter the phase, a cell assigning means assigns each triangle and its vertex to a cell with reference to index data of the vertex, and a labeling means sets an attribute value of each cell.
    Type: Application
    Filed: July 14, 2004
    Publication date: March 15, 2007
    Applicant: RIKEN
    Inventors: Shugo Usami, Kiwamu Kase, Yu-ichiro Terada, Hiroshi Yagi
  • Publication number: 20070039324
    Abstract: A novel fuel producing section produces synthesized gas from a feedstock and synthesizes novel fuel from the synthesized gas thus produced, and has exhaust heat recovery boilers for generating steam by recovering excess heat generated from the synthesizing processes. An exhaust heat utilizing section includes steam turbines driven with the steam generated from the exhaust heat recovery boilers. An open circulation cooling water supply section supplies cooling water for a plant, including water for cooling exhausts of the steam turbines, and includes a seawater desalination system for desalinating seawater by the evaporation method and supplying desalinated water to replenish the cooling water. The cooling water supplied from the open circulation cooling water supply section is used in condensing of the desalinated water produced by the seawater desalination system.
    Type: Application
    Filed: June 9, 2003
    Publication date: February 22, 2007
    Inventors: Taiji Inui, Tsunehisa Kawaguchi, Hiroshi Yagi, Yasuto Ando
  • Publication number: 20060254050
    Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.
    Type: Application
    Filed: July 20, 2006
    Publication date: November 16, 2006
    Applicants: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.
    Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
  • Patent number: 7128994
    Abstract: In a polymer electrolyte fuel cell wherein a plurality of unit cells are arranged in a flat manner oriented in the same direction, and the prescribed adjacent unit cells are electrically connected in series so as to connect the plurality of unit cells in series, a flat-type polymer electrolyte fuel cell is made possible by providing at least one of a through hole connecting portion, a filled via connecting portion and a bump connecting portion in an insulating portion located between the prescribed adjacent unit cells, electrically insulated from the unit cells and having a thickness approximately equal to that of the unit cell, for establishing electrical connection between the prescribed adjacent unit cells.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: October 31, 2006
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Takanori Maeda, Hiroshi Yagi
  • Publication number: 20060219364
    Abstract: In a laminating apparatus for a ceramic green sheet according to the present invention, cutting means and laminating means are positioned on a conveying path of a carrier film conveyed by conveying means. Specifically, cutting of the ceramic green sheet and lamination of sheet pieces are carried out on a single conveying path. Consequently, the reduction of production efficiency is prevented significantly. Furthermore, the position of the cutting means and the position of the laminating means are different. Therefore, even when cut scraps are generated when the ceramic green sheet is cut by the cutting means, the cut scraps are significantly prevented from entering between layers in a green sheet laminated body.
    Type: Application
    Filed: March 24, 2006
    Publication date: October 5, 2006
    Applicant: TDK CORPORATION
    Inventors: Yoshimi Yodokawa, Susumu Nakamura, Kikuo Takahashi, Makoto Takahashi, Hiroshi Yagi, Tsukasa Satoh
  • Publication number: 20060219070
    Abstract: A cutting apparatus for a ceramic green sheet according to the present invention is a cutting apparatus for a ceramic green sheet for cutting a ceramic green sheet held on a carrier film into a square-shaped sheet piece, and comprises four roller cutters, each of which is disposed so as to correspond to each edge of the sheet piece, and moving means for moving the roller cutters along the corresponding edges of the sheet piece. In this cutting apparatus, the four edges of the sheet piece are cut by the roller cutters, thus cutting failures on the ceramic green sheet are significantly prevented. Furthermore, each of the edges of the sheet piece is cut without changing the position of the cutters, thus improvement of cutting dimensional accuracy is realized, compared to the conventional apparatus in which the position of the cutter is changed when cutting each edge.
    Type: Application
    Filed: March 24, 2006
    Publication date: October 5, 2006
    Applicant: TDK CORPORATION
    Inventors: Yoshimi Yodokawa, Susumu Nakamura, Kikuo Takahashi, Makoto Takahashi, Hiroshi Yagi, Tsukasa Satoh
  • Patent number: 7112287
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: September 26, 2006
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Patent number: 7100276
    Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: September 5, 2006
    Assignees: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.
    Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
  • Publication number: 20060180574
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Application
    Filed: April 12, 2006
    Publication date: August 17, 2006
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Publication number: 20060138620
    Abstract: A resin-encapsulated package includes a semiconductor IC chip, wherein the ratio of the size of the semiconductor IC chip to the package size of the resin-encapsulated package including the semiconductor IC chip is large to miniaturize the resin-encapsulated package. The resin-encapsulated package includes a semiconductor IC chip sealed in a resin molding, and a lead member having an arrangement of a plurality of discrete terminal sections. Each terminal section has inner terminal parts to be electrically connected to terminals of the semiconductor IC chip, outer terminal parts to be connected to external circuits, and connecting parts interconnecting the inner and the outer terminal parts. The contact surfaces of the inner terminal parts and the outer terminal parts face toward opposite directions, respectively. The contact surfaces of the inner terminal parts of the terminal sections are flush with each other.
    Type: Application
    Filed: February 28, 2006
    Publication date: June 29, 2006
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventor: Hiroshi Yagi