Patents by Inventor Hiroshi Yakabe

Hiroshi Yakabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11345180
    Abstract: A display medium including a display layer for authenticity identification, wherein the display layer contains a droplet-cured product, and the droplet-cured product contains a resin having cholesteric regularity. The droplet-cured product preferably contains a cured product of a liquid crystal material containing a cholesteric liquid crystal compound. The display layer is preferably a cured product of a coating material containing the droplet-cured product. The display layer may contain plural types of droplet-cured products exhibiting different color tones as the droplet-cured product. The display layer may further contain a metal particle.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: May 31, 2022
    Assignee: ZEON CORPORATION
    Inventor: Hiroshi Yakabe
  • Patent number: 10620352
    Abstract: A circularly polarized light separating film including a resin layer containing a polymer of a polymerizable liquid crystal compound, wherein the polymerizable liquid crystal compound contains a main-chain mesogen and a side-chain mesogen bonded to the main-chain mesogen in a molecule of the polymerizable liquid crystal compound, and the polymer has cholesteric regularity.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: April 14, 2020
    Assignee: ZEON CORPORATION
    Inventor: Hiroshi Yakabe
  • Publication number: 20130169912
    Abstract: A multilayer film including: a substrate consisting of a resin that contains a polymer having an alicyclic structure, the substrate having a thickness of not more than 45 ?m; and a resin layer provided on at least one surface of the substrate, the resin layer being formed by curing by irradiation of an active energy ray, wherein: a ratio of the substrate thickness relative to the total of the substrate thickness and the resin thickness is not less than 0.6 and not more than 0.95, and in a temperature range of not less than 30° C. and not more than 90° C., a linear expansion coefficient of the multilayer film is smaller than a linear expansion coefficient of the substrate by 5 ppm/° C. or more.
    Type: Application
    Filed: August 19, 2011
    Publication date: July 4, 2013
    Applicant: ZEON CORPORATION
    Inventors: Hitoshi Ooishi, Hiroshi Yakabe