Patents by Inventor Hiroshi Yamane

Hiroshi Yamane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240376300
    Abstract: A resin composition comprising a resin(S) comprising: a polyerytene other (A) having a ratio of peak integral value of 3.80 to 3.92 ppm relative to a peak integral value of 6.20 to 6.72 ppm being 0.05 to 5.0%, in 1H-NMR spectrum obtained by 1H-NMR spectrum measurement using deuterated chloroform as a solvent, and a thermoplastic resin (B), and an inorganic filler (C).
    Type: Application
    Filed: May 27, 2022
    Publication date: November 14, 2024
    Applicants: IDEMITSU KOSAN CO., LTD., UNIVERSITY OF FUKUI
    Inventors: Kenta ITO, Ken SUDO, Yohei KOORI, Hiroshi YASUDA, Hideyuki UEMATSU, Masachika YAMANE, Shuichi TANOUE, Ayaka YAMAGUCHI
  • Patent number: 12094798
    Abstract: Provided is a semiconductor device that prevents resin from leaking out from a resin insulating member at a periphery of the resin insulating member and thereby achieves an increase in reliability. The semiconductor device includes a module unit, a resin insulating member bonded to the module unit, a cooling unit coupled to the module unit with the resin insulating member interposed therebetween, and a flow blocking member disposed between the module unit and the cooling unit to surround the resin insulating member, the flow blocking member being more easily compressively deformable than the resin insulating member.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: September 17, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroshi Kobayashi, Tomohisa Yamane, Shinnosuke Soda
  • Publication number: 20240278221
    Abstract: [Problem] To provide a catalyst for hydrotreating a heavy hydrocarbon oil, the catalyst exhibiting excellent demetallization performance, desulfurization performance, and deasphaltene performance and having high strength. [Solution] A hydrotreating catalyst, which is a catalyst for hydrotreating a heavy hydrocarbon oil, the catalyst including an alumina-phosphorus oxide carrier, and a hydrogenation-active metal component supported on the carrier, in which the content of phosphorus in the carrier is 0.4 to 2.0 mass % in terms of P2O5, the carrier has a local maximum value of the differential pore volume distribution in a pore diameter range of 18 to 22 nm measured by mercury intrusion porosimetry, in the carrier, the ratio (?PV/PVT) of a volume (?PV) of pores having a pore diameter in a range deviating from a range of a pore diameter at the local maximum value±2 nm to the total pore volume (PVT) measured by mercury intrusion porosimetry is 0.
    Type: Application
    Filed: September 5, 2022
    Publication date: August 22, 2024
    Inventors: Kenji Yamane, Hiroshi Shintaku, Yusuke Matsumoto
  • Patent number: 12054243
    Abstract: A rotary-wing aircraft includes a fuselage, and an external device. The fuselage is provided with a rotary wing. The external device is mounted on the outside of the fuselage. The external device includes a mounting device, a mass variation device, and a damper. The mounting device is fixed to the fuselage and disposed so as to project in a lateral direction of the fuselage. The mass variation device is mounted on the mounting device and has mass that varies as the mass variation device is used. The damper couples the fuselage to the mounting device and supports the mounting device. The damper includes a stiffness variable mechanism configured to change stiffness of the damper in response to variation in the mass of the mass variation device.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: August 6, 2024
    Assignee: SUBARU CORPORATION
    Inventors: Katsunori Naganuma, Hiroshi Nagai, Taku Sagara, Hiroshi Fujisawa, Toshiyuki Ichiki, Ryosuke Sato, Hokuto Yamane
  • Publication number: 20240189915
    Abstract: A workpiece support includes a rotating shaft configured to support a workpiece at a leading end portion, a second support supporting the rotating shaft rotatably about a first axis and configured to move the rotating shaft along the first axis, a first support provided between the tool and the second support along the first axis and including a through hole into which a guide bushing unit is configured to be inserted and into which the leading end portion of the rotating shaft is configured to be inserted, and an attachment provided in contact with an outer surface of the leading end portion of the rotating shaft. The guide bushing unit is configured to support the workpiece when the guide bushing unit is in the through hole. At least a part of the attachment is displaceable in a direction away from the first axis.
    Type: Application
    Filed: February 20, 2024
    Publication date: June 13, 2024
    Applicant: Yamazaki Mazak Corporation
    Inventors: Jojiro KIMURA, Hiroshi YAMANE, Hiroshi KONDO, Yuta MIYASHITA
  • Publication number: 20240189913
    Abstract: A workpiece support includes a rotating shaft, a second support, a first support, and an air supplier. The rotating shaft is configured to support a workpiece at the leading end portion. The second support supports the rotating shaft rotatably about a first axis of the rotating shaft. The first support is provided between a tool and the second support along the first axis and has a through hole into which a guide bushing unit is configured to be inserted and into which the leading end portion of the rotating shaft is configured to be inserted. The guide bushing unit is configured to support the workpiece when the guide bushing unit is in the through hole. An ejection opening is provided on an inner circumferential surface of the through hole. The air supplier is configured to supply air to the first support via the ejection opening.
    Type: Application
    Filed: February 22, 2024
    Publication date: June 13, 2024
    Applicant: Yamazaki Mazak Corporation
    Inventors: Jojiro KIMURA, Hiroshi YAMANE, Hiroshi KONDO, Yuta MIYASHITA
  • Publication number: 20230191481
    Abstract: A metal powder capable of producing a dust core having a high saturation magnetic flux density, excellent rust resistance, and a low iron loss. The metal powder includes from 1.0% to 15.0% of Si, from 1.0% to 13.0% of Cr, from 10 ppm to 10000 ppm of Cl, from 100 ppm to 10000 ppm of S (sulfur), and from 0.2% to 7.0% of O (oxygen) by mass concentration, the remainder including Fe and unavoidable impurities, in which the average particle diameter of the metal powder is from 0.1 ?m to 2.0 ?m. This facilitates the production of a dust core having a high magnetic flux density, excellent rust resistance, and a low iron loss.
    Type: Application
    Filed: April 20, 2021
    Publication date: June 22, 2023
    Applicant: JFE MINERAL COMPANY, LTD.
    Inventors: Kensuke MATSUKI, Hiroshi YAMANE, Daiki FUKUDOME
  • Patent number: 7889866
    Abstract: A clock signal extractor (11) is connected to an interface of an information equipment (2) for processing an information signal, to extract a clock signal component from the information signal. A clock signal generator (12) generates a pseudo clock signal having an optional phase difference relative to the clock signal component extracted by the clock signal extractor (11). A prevention signal generator (13) generates, based on the pseudo clock signal generated by the clock signal generator (12), a leakage prevention signal having an electromagnetic wave strength stronger than electromagnetic waves leaking from the information signal. A prevention signal output unit (14) outputs the leakage prevention signal generated by the prevention signal generator (13).
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: February 15, 2011
    Assignee: Nippon Telegraph and Telephone Company
    Inventors: Masao Masugi, Masaharu Sao, Yoshiharu Akiyama, Hiroshi Yamane, Tetsuya Tominaga
  • Patent number: 7628196
    Abstract: During continuous casting of metals, a non-moving, vibrating magnetic field is applied to a molten metal in a casting mold to impose only vibration on the molten metal. This continuous casting method can produce a cast slab much less susceptible to flux entrainment, capture of bubbles and non-metal inclusions near the surface of the molten metal, and surface segregation. The magnetic field is preferably produced by arranging electromagnets in an opposing relation on both sides of the mold to lie side by side in the direction of longitudinal width of the mold, and supplying a single-phase AC current to each coil. The single-phase AC current preferably has frequency of 0.10 to 60 Hz. A static magnetic field can be applied intermittently in the direction of thickness of a cast slab. This technique can produce a cast slab substantially free from the flux entrainment and the surface segregation. Preferably, the static magnetic field is intermittently applied under setting of an on-time t1=0.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: December 8, 2009
    Assignee: JFE Steel Corporation
    Inventors: Hiroshi Yamane, Nagayasu Bessho, Yuji Miki, Shuji Takeuchi, Tadasu Kirihara
  • Patent number: 7497695
    Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC has an elongated substrate, and plural conductors are laminated on a surface of the substrate for extending along an axial direction of the substrate. The printed wiring board has an insertion opening provided at an edge surface for being inserted by a top end portion of the FPC, and plural line connecting terminals formed on an internal wall surface of the insertion opening. The top end portion of the FPC has a slider including plural elastic deformable first contacts, and a first housing for holding the plurality of contacts. The FPC is inserted into the insertion opening of the printed wiring board such that one end of the first contact presses the conductor and the other end of the first contact presses the line connecting terminal.
    Type: Grant
    Filed: February 20, 2008
    Date of Patent: March 3, 2009
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Shinji Uchida, Hiroshi Yamane, Akihito Funakoshi, Kazuto Miura
  • Publication number: 20090013205
    Abstract: A clock signal extractor (11) is connected to an interface of an information equipment (2) for processing an information signal, to extract a clock signal component from the information signal. A clock signal generator (12) generates a pseudo clock signal having an optional phase difference relative to the clock signal component extracted by the clock signal extractor (11). A prevention signal generator (13) generates, based on the pseudo clock signal generated by the clock signal generator (12), a leakage prevention signal having an electromagnetic wave strength stronger than electromagnetic waves leaking from the information signal. A prevention signal output unit (14) outputs the leakage prevention signal generated by the prevention signal generator (13).
    Type: Application
    Filed: May 24, 2005
    Publication date: January 8, 2009
    Inventors: Masao Masugi, Masaharu Sao, Yoshiharu Akiyama, Hiroshi Yamane, Tetsuya Tominaga
  • Publication number: 20080153319
    Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC has an elongated substrate, and plural conductors are laminated on a surface of the substrate for extending along an axial direction of the substrate. The printed wiring board has an insertion opening provided at an edge surface for being inserted by a top end portion of the FPC, and plural line connecting terminals formed on an internal wall surface of the insertion opening. The top end portion of the FPC has a slider including plural elastic deformable first contacts, and a first housing for holding the plurality of contacts. The FPC is inserted into the insertion opening of the printed wiring board such that one end of the first contact presses the conductor and the other end of the first contact presses the line connecting terminal.
    Type: Application
    Filed: February 20, 2008
    Publication date: June 26, 2008
    Applicant: J.S.T. Mfg. Co., Ltd.
    Inventors: Shinji Uchida, Hiroshi Yamane, Akihito Funakoshi, Kazuto Miura
  • Patent number: 7371074
    Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC has an elongated substrate, and plural conductors are laminated on a surface of the substrate for extending along an axial direction of the substrate. The printed wiring board has an insertion opening provided at an edge surface for being inserted by a top end portion of the FPC, and plural line connecting terminals formed on an internal wall surface of the insertion opening. The top end portion of the FPC has a slider including plural elastic deformable first contacts, and a first housing for holding the plurality of contacts. The FPC is inserted into the insertion opening of the printed wiring board such that one end of the first contact presses the conductor and the other end of the first contact presses the line connecting terminal.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: May 13, 2008
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Shinji Uchida, Hiroshi Yamane, Akihito Funakoshi, Kazuto Miura
  • Patent number: 7301104
    Abstract: A double-sided flexible printed circuit comprises: an electrically insulating base; a first copper layer having a first conductive pattern; a second copper layer having a second conductive pattern, the second conductive pattern disposed offset from the first conductive pattern; and electrically insulating coverlays. A first area opposing a first contact point of first contacts that press upon the first conductive patterns, is reinforced by copper foil extending from the second conductive patterns, and a second area opposing a second contact point of second contacts that press upon the second conductive patterns, is reinforced by copper foil extending from the first conductive patterns.
    Type: Grant
    Filed: January 12, 2006
    Date of Patent: November 27, 2007
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Kazuto Miura, Hiroshi Yamane, Yoshiyuki Nakai, Kenichi Toda
  • Patent number: 7210942
    Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC comprises a long substrate, a plurality of conductors laminated on the surface of the substrate and extending along an axial direction of the substrate. The printed wiring board comprises a planar main wiring board, an insertion opening, and a plurality of the through-hole terminals. Each of the conductors of the FPC abuts the through-hole terminal upon the insertion of the FPC into the insertion opening of the printed wiring board. According to the invention, a connector structure to be connected to FPC is provided inside the printed wiring board in order to mount circuit element in high density, and thus improve degree of freedom in designing wiring pattern.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: May 1, 2007
    Assignee: J. S. T. Mfg. Co., Ltd.
    Inventors: Shinji Uchida, Hiroshi Yamane, Wataru Sugihara
  • Publication number: 20070037440
    Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC has an elongated substrate, and plural conductors are laminated on a surface of the substrate for extending along an axial direction of the substrate. The printed wiring board has an insertion opening provided at an edge surface for being inserted by a top end portion of the FPC, and plural line connecting terminals formed on an internal wall surface of the insertion opening. The top end portion of the FPC has a slider including plural elastic deformable first contacts, and a first housing for holding the plurality of contacts. The FPC is inserted into the insertion opening of the printed wiring board such that one end of the first contact presses the conductor and the other end of the first contact presses the line connecting terminal.
    Type: Application
    Filed: April 23, 2004
    Publication date: February 15, 2007
    Applicant: J.S.T. MFG. CO., LTD.
    Inventors: Shinji Uchida, Hiroshi Yamane, Akihito Funakoshi, Kazuto Miura
  • Publication number: 20060281343
    Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC comprises a long substrate, a plurality of conductors laminated on the surface of the substrate and extending along an axial direction of the substrate. The printed wiring board comprises a planar main wiring board, an insertion opening, and a plurality of the through-hole terminals. Each of the conductors of the FPC abuts the through-hole terminal upon the insertion of the FPC into the insertion opening of the printed wiring board. According to the invention, a connector structure to be connected to FPC is provided inside the printed wiring board in order to mount circuit element in high density, and thus improve degree of freedom in designing wiring pattern.
    Type: Application
    Filed: April 23, 2004
    Publication date: December 14, 2006
    Inventors: Shinji Uchida, Hiroshi Yamane, Wataru Sugihara
  • Patent number: 7112079
    Abstract: A connector comprises a housing and a cover housing. The housing has a recess formed for insertion of a FPC. The housing comprises a first contact, a second contact and a third contact. The first contact and the second contact includes a first arm, a second arm, and a horizontal leg. The third contact includes a fixing arm, an elastic arm opposing the fixing arm, and a connection leg connecting said fixing arm with said elastic arm. A cam is arranged between the elastic arm of the third contact and the bottom surface of the recess of the housing for locking at a tip of the elastic arm.
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: September 26, 2006
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Kazuto Miura, Hiroshi Yamane
  • Publication number: 20060191608
    Abstract: In order to reduce the size of a laminated ceramic capacitor by reducing the thickness of a dielectric material, to increase the number of laminated dielectric layers and electrodes, and to elevate the capacity, the quantity of coarse particles of which particle diameters exceed 1 ?pm is reduced from the metal powder used in the internal electrodes. There is provided a nickel-based ultra-fine powder, wherein the average particle diameter of primary particles is 0.05 to 0.3 ?m, the number of the primary particles that have a particle diameter of 1 ?m or larger is 50 ppm or less relative to the total number of the particles, and the number of the primary particles that have a particle diameter of 0.6 times or smaller than the average particle diameter is 10% or less relative to the total number of the particles. The nickel-based ultra-fine powder is produced from nickel chloride vapor or the like using a vapor-phase hydrogen reduction method.
    Type: Application
    Filed: March 10, 2004
    Publication date: August 31, 2006
    Applicant: JFE MINERAL COMPANY LTD.
    Inventors: Hiroshi Yamane, Keiichi Yoshioka
  • Patent number: D526617
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: August 15, 2006
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Hiroshi Yamane, Junya Kajimoto