Patents by Inventor Hiroshi Yamauchi

Hiroshi Yamauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6504229
    Abstract: A semiconductor device comprises a first insulating film, a wiring layer and a second insulating film formed in this order on a semiconductor substrate, the second insulating film being provided with one or more through holes formed onto the wiring layer, wherein the wiring layer is electrically isolated by the first insulating film and the second insulating film at a region other than a region where the through holes are formed, and a ratio between a total of a bottom area of the through holes formed onto the wiring layer and a top surface area of the wiring layer is 1:300 to 10,000.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: January 7, 2003
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiroshi Yamauchi, Masayuki Satoh
  • Publication number: 20020191262
    Abstract: A feature of this invention is to realize a VSB modulation with a simple configuration.
    Type: Application
    Filed: June 12, 2002
    Publication date: December 19, 2002
    Inventors: Yuichi Yamada, Shinichi Nakagawa, Hidenori Taga, Takanori Inoue, Eiichi Shibano, Hiroshi Yamauchi
  • Publication number: 20020105323
    Abstract: Disclosed herein is a magnetic head wear-rate measuring apparatus for measuring the rate of head wear in noncontact form and with high accuracy. A magnetic sensor is disposed so as to be opposed to a magnetic head and serves as a part of oscillating elements of an oscillator circuit. A magnetic resistance of a magnetic circuit at a rotational position where the magnetic head faces the magnetic sensor, changes according to the degree of extension of the magnetic head from the surface of a drum, and the change in magnetic resistance acts as a variation in oscillating frequency. The change in frequency is converted into a counter output. A counter is supplied with a pulse Pd of a measured oscillating frequency and correspondingly produces a pulse (counter output) Px having a pulse width up to the counting of a predetermined number of pulses. Thereafter, the counter output Px is supplied to a second counter where the number of reference clocks lying within the pulse width is counted.
    Type: Application
    Filed: October 25, 2001
    Publication date: August 8, 2002
    Applicant: SONY CORPORATION
    Inventors: Seiichi Sakai, Hiroshi Yamauchi
  • Patent number: 6414885
    Abstract: A memory space controller controls a part of normal regions of memory space as a redundancy region for relieving faulty regions. The memory space controller relocates the faulty regions to the part of the normal regions at a final address side of a memory space, thereby forming a continuous memory space. The memory space controller includes at least a faulty address storing table unit, a replace address storing table unit, a first address agreement/disagreement detecting circuit, and an address data selecting circuit.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: July 2, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toshiyuki Nagamatsu, Hiroshi Yamauchi
  • Publication number: 20020055486
    Abstract: An ophthalmic pharmaceutical composition comprising trehalose as an effective ingredient and a pharmaceutically-acceptable carrier. The pharmaceutical composition is a safe, long-term continuously-administrable, therapeutic and/or prophylactic agent for the ophthalmologic clinical symptoms and signs in Sjögren syndrome.
    Type: Application
    Filed: August 30, 2001
    Publication date: May 9, 2002
    Applicant: KABUSHIKI KAISHA HAYASHIBARA SEIBUTSU KAGAKU KENKYUJO
    Inventors: Toshihiko Matsuo, Masashi Kurimoto, Hiroshi Yamauchi
  • Publication number: 20020038814
    Abstract: By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material
    Type: Application
    Filed: April 24, 2001
    Publication date: April 4, 2002
    Inventors: Toshinori Mimura, Hiroaki Onishi, Hiroshi Yamauchi, Toshiaki Yamauchi, Jun Shirai, Yoshiyuki Nagai, Muneyoshi Fujiwara
  • Publication number: 20020036898
    Abstract: A cylindrical or sheet-like thermoplastic film is decompressed and used to cover a board to protect the board and components.
    Type: Application
    Filed: March 28, 2001
    Publication date: March 28, 2002
    Inventors: Hidenori Miyakawa, Yoshio Maruyama, Hiroshi Yamauchi, Mikiya Nakata, Takashi Akiguchi, Yoshinori Wada, Kazuhiro Mori
  • Publication number: 20020031903
    Abstract: A component mounting apparatus has an ultrasonic vibration generating apparatus which supplies ultrasonic vibration making a lead-free solder with no lead which is provided between an electronic component and a circuit board melted to the electronic component. The lead-free solder is melted by the ultrasonic vibration and then connects the electronic component on the circuit board. Accordingly, the ultrasonic vibration generating apparatus can heat only the lead-free solder partially, the electronic component and the circuit board can be joined without applying thermal influence to a whole of the electronic component and circuit board.
    Type: Application
    Filed: August 29, 2001
    Publication date: March 14, 2002
    Inventors: Hiroshi Yamauchi, Masanori Yasutake, Youichi Nakamura, Junji Ikeda
  • Publication number: 20020021561
    Abstract: Three or more, or two or more types of electronic components are formed on one substrate, and these electronic components form an aggregated planar surface on a surface of the substrate to attain the above object.
    Type: Application
    Filed: June 28, 2001
    Publication date: February 21, 2002
    Inventors: Hiroshi Yamauchi, Minoru Yamamoto
  • Publication number: 20010045667
    Abstract: A semiconductor device comprises a first insulating film, a wiring layer and a second insulating film formed in this order on a semiconductor substrate, the second insulating film being provided with one or more through holes formed onto the wiring layer, wherein the wiring layer is electrically isolated by the first insulating film and the second insulating film at a region other than a region where the through holes are formed, and a ratio between a total of a bottom area of the through holes formed onto the wiring layer and a top surface area of the wiring layer is 1:300 to 10,000.
    Type: Application
    Filed: April 18, 2001
    Publication date: November 29, 2001
    Inventors: Hiroshi Yamauchi, Masayuki Satoh
  • Publication number: 20010005013
    Abstract: A memory space controller controls a part of normal regions of memory space as a redundancy region for relieving faulty regions. The memory space controller relocates the faulty regions to the part of the normal regions at a final address side of a memory space, thereby forming a continuous memory space. The memory space controller includes at least a faulty address storing table unit, a replace address storing table unit, a first address agreement/disagreement detecting circuit, and an address data selecting circuit.
    Type: Application
    Filed: December 19, 2000
    Publication date: June 28, 2001
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Toshiyuki Nagamatsu, Hiroshi Yamauchi
  • Patent number: 5977515
    Abstract: An underwater laser processing system has a laser torch; a laser torch driving mechanism for changing a laser emission position of the laser torch; and a chamber with one end opened to an external environment, which contains the laser torch; wherein a partitioning wall for preventing permeation of water is provided between a free end of the chamber and the laser torch. The system is used for detecting a sensitized portion and repairing it at one time using a sensitization detecting arrangement. Moreover, it is used for forming an alloying layer by melting a sprayed coating film, and for forming a new surface layer by emitting a laser beam through a solution containing a metal component.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: November 2, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Keiichi Uraki, Toshitaka Satsuta, Akira Onuma, Mitsuo Nakamura, Tsutomu Onuma, Toshimi Matsumoto, Yasumasa Tamai, Hiroshi Yamauchi, Eisaku Hayashi, Ren Morinaka
  • Patent number: 5955876
    Abstract: A board positioning method includes the steps of selecting one of a plurality of positioning sections or stations for positioning a particular type of board located in a specified position. The method allows positioning different types of boards in specified positional relationships by locating only a positioning section corresponding to the board to be positioned, so that the positioning section faces the board located in the specified position. The positioning section is moved into the specified location by means of a support member. Thereby, positioning various types of the boards in a specified common position is possible without the need to make adjustments to a single positioning station.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: September 21, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Yamauchi, Shoriki Narita, Hideo Hongo
  • Patent number: 5931282
    Abstract: A component carrier assembly includes component holders each for holding a component therein and connected to one another in a form of a tape carrier. Each holder is provided with a cavity to accommodate the component, a closure for shutting an opening of the cavity, and a device for securing the lid structure in a closed position. An apparatus for feeding the component carrier includes a device for transferring the component carrier, a device for forcibly opening a closure of a component holder transferred to a predetermined position, and a device for forcibly closing the closure of the component holder after a component is removed from the cavity.
    Type: Grant
    Filed: April 2, 1997
    Date of Patent: August 3, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshio Maruyama, Shinji Kadoriku, Toshiaki Yamauchi, Naomi Kuromoto, Hiroshi Yamauchi
  • Patent number: 5769236
    Abstract: A component collective includes component holders respectively holding components therein and connected to one another in the form of a tape carrier. Each of holders is provided with a cavity to accommodate the component, a lid for shutting an opening of the cavity, and a keeping device for keeping the lid at a closed position. An apparatus for feeding the component collective includes a device for transferring the component collective, a device for forcibly opening the lid means of the component holder transferred to a predetermined position, and a device for forcibly closing the lid of the component holder after a component is removed from the cavity.
    Type: Grant
    Filed: July 20, 1995
    Date of Patent: June 23, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshio Maruyama, Shinji Kadoriku, Toshiaki Yamauchi, Shoriki Narita, Naomi Kuromoto, Hiroshi Yamauchi
  • Patent number: 5648729
    Abstract: A board positioning method includes the steps of selecting one of a plurality of positioning sections or stations for positioning a particular type of board located in a specified position. The method allows positioning different types of boards in specified positional relationships by locating only a positioning section corresponding to the board to be positioned, so that the positioning section faces the board located in the specified position. The positioning section is moved into the specified location by means of a support member. Thereby, positioning various types of the boards in a specified common position is possible without the need to make adjustments to a single positioning station.
    Type: Grant
    Filed: May 5, 1995
    Date of Patent: July 15, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Yamauchi, Shoriki Narita, Hideo Hongo
  • Patent number: 5519330
    Abstract: A corrosion degree measuring method capable of field measurement for intergranular corrosion, particularly the sensitization degree, of the plant's structural materials in a narrow space. The metal electrode made of a material being measured and the counter electrode to the metal electrode are immersed in an electrolytic solution. A voltage is applied to the metal electrode in the anodic direction so as to raise the potential of the metal electrode up to the passive state potential and to keep the metal electrode at the passive state potential. The passive state potential is used as a reference potential, and a pulse-like potential signal is applied to the metal electrode in the cathodic direction. At the time of the application of the pulse potential signal, a current between the metal electrode and the counter electrode is measured, and the corrosion degree of the material being measured is determined from the intensity of the current.
    Type: Grant
    Filed: September 27, 1993
    Date of Patent: May 21, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Yamauchi, Masanori Sakai, Katsumi Mabuchi, Takuya Takahashi, Noriyuki Ohnaka, Shigeo Hattori
  • Patent number: 5506122
    Abstract: The present invention concerns a process for producing nucleosides by carrying out the reaction of a base donor, a saccharide residue donor and a phosphoric acid donor by the use of an enzyme preparation containing nucleoside phosphorylase, thereby forming an N-glycosidic bond between the base moiety of the base donor and the saccharide moiety of the saccharide residue donor, which comprises using, as the enzyme preparation containing nucleoside phosphorylase, a preparation derived from the cells of one or more kinds of microorganisms belonging to thermophiles of the genus Bacillus and having high nucleoside phosphorylase activity per unit cell weight.
    Type: Grant
    Filed: October 7, 1994
    Date of Patent: April 9, 1996
    Assignee: Yamasa Shoyu Kabushiki Kaisha
    Inventors: Hiroshi Yamauchi, Hideki Utsugi, Yuichiro Midorikawa
  • Patent number: 5489577
    Abstract: Disclosed is a semi-solid pharmaceutical agent containing a stabilized proteinaceous bioactive substance prepared by successively mixing an oligosaccharide and an aqueous solution of a proteinaceous bioactive substance, and kneading the resultant solids with an oil or fat base. The pharmaceutical handles with ease because it is readily administered to the body through percutaneous and permucosal route which are safer and less in pain administration routes than other conventional administrations.
    Type: Grant
    Filed: June 28, 1994
    Date of Patent: February 6, 1996
    Assignee: Kabushiki Kaisha Hayashibara Seibutsu Kagaku Kenkyujo
    Inventors: Masao Ikeda, Tomoki Tatefuji, Hiroshi Yamauchi
  • Patent number: D436967
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: January 30, 2001
    Assignee: Sony Corporation
    Inventors: Shigeya Yasui, Takashi Fujita, Hiroshi Yamauchi