Patents by Inventor Hiroshi Yonemasu

Hiroshi Yonemasu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of using a contamination shield during the manufacture of EPROM semiconductor package windows
    Patent number: 5231036
    Abstract: A protective shield is provided on the UV transparent window of a ceramic lid for a EPROM integrated circuit package so as to prevent accumulation of foreign particulate matter thereon during the manufacture of the package.
    Type: Grant
    Filed: August 3, 1992
    Date of Patent: July 27, 1993
    Assignee: Kyocera America, Inc.
    Inventors: Nobuaki Miyauchi, Hiroshi Yonemasu, Bakji Cho
  • Use of a contamination shield during the manufacture of semiconductor packages
    Patent number: 5196919
    Abstract: A protective shield is provided on the UV transparent window of a ceramic lid for a EPROM integrated circuit package so as to prevent accumulation of foreign particulate matter thereon during the manufacture of the package.
    Type: Grant
    Filed: December 7, 1990
    Date of Patent: March 23, 1993
    Assignee: Kyocera America, Inc.
    Inventors: Nobuaki Miyauchi, Hiroshi Yonemasu, Bakji Cho
  • Partially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuit
    Patent number: 5137767
    Abstract: A partially coated assembly structure and a method for making a ceramic lid for a hermetically sealed package for an EPROM circuit are disclosed. The assembly structure includes, in combination, a ceramic lid, a UV transparent lens, and two fixtures for supporting the lens in the lid. The two fixtures are coated with a non-lens wetting film in predetermined areas where contact is made between the fixtures and the lens, and between the fixtures and the lid. The UV transparent lens is hermetically sealed to the ceramic lid by firing the assembly structure. The assembly structure prevents the lens from attracting foreign particulate matter during firing, thereby leaving the surfaces of the lens clean. The method provides a ceramic lid having a UV transparent lens hermetically sealed thereto, which finds wide use in integrated circuit packages for high-density EPROM's because of the untainted surfaces of the lens.
    Type: Grant
    Filed: August 29, 1990
    Date of Patent: August 11, 1992
    Assignee: Kyocera America, Inc.
    Inventors: Nobuaki Miyauchi, Hiroshi Yonemasu, Bakji Cho, Chong-Il Park