Patents by Inventor Hiroshi Yoshimochi

Hiroshi Yoshimochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cleaning agent for semiconductor provided with metal wiring
    Patent number: 9476019
    Abstract: A cleaning agent for a microelectronic device provided with metal wiring, which has an excellent ability to remove polishing particle residues derived from a polishing agent and an excellent ability to remove metallic residues on an insulating film, and has excellent anticorrosiveness to the metal wiring. The cleaning agent is used at a step subsequent to chemical mechanical polishing in a manufacturing process of a microelectronic device in which a metal wiring, e.g., copper or tungsten, is formed.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 25, 2016
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Mutsumi Nakanishi, Hiroshi Yoshimochi, Yukichi Koji
  • CLEANING AGENT FOR SEMICONDUCTOR PROVIDED WITH METAL WIRING
    Publication number: 20150259632
    Abstract: A cleaning agent for a microelectronic device provided with metal wiring, which has an excellent ability to remove polishing particle residues derived from a polishing agent and an excellent ability to remove metallic residues on an insulating film, and has excellent anticorrosiveness to the metal wiring. The cleaning agent is used at a step subsequent to chemical mechanical polishing in a manufacturing process of a microelectronic device in which a metal wiring, e.g., copper or tungsten, is formed.
    Type: Application
    Filed: May 29, 2015
    Publication date: September 17, 2015
    Inventors: Mutsumi NAKANISHI, Hiroshi YOSHIMOCHI, Yukichi KOJI
  • Cleaning agent for semiconductor provided with metal wiring
    Patent number: 9045717
    Abstract: A cleaning agent for a microelectronic device provided with metal wiring, which has an excellent ability to remove polishing particle residues derived from a polishing agent and an excellent ability to remove metallic residues on an insulating film, and has excellent anticorrosiveness to the metal wiring. The cleaning agent is used at a step subsequent to chemical mechanical polishing in a manufacturing process of a microelectronic device in which a metal wiring, e.g., copper or tungsten, is formed.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: June 2, 2015
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Mutsumi Nakanishi, Hiroshi Yoshimochi, Yukichi Koji
  • CLEANING AGENT FOR SEMICONDUCTOR PROVIDED WITH METAL WIRING
    Publication number: 20130203643
    Abstract: A cleaning agent for a microelectronic device provided with metal wiring, which has an excellent ability to remove polishing particle residues derived from a polishing agent and an excellent ability to remove metallic residues on an insulating film, and has excellent anticorrosiveness to the metal wiring. The cleaning agent is used at a step subsequent to chemical mechanical polishing in a manufacturing process of a microelectronic device in which a metal wiring, e.g., copper or tungsten, is formed.
    Type: Application
    Filed: January 28, 2011
    Publication date: August 8, 2013
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Mutsumi Nakanishi, Hiroshi Yoshimochi, Yukichi Koji