Abstract: A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.

Abstract: A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.

Abstract: An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.

Abstract: A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two end portions, upright portions each extending from one of the end portions in the thickness direction of an insulating substrate, bent portions each extending continuously with one of the upright portions, and an extension extending continuously with the bent portions. A section of the extension is embedded in the housing.

Abstract: A motor-driven compressor includes a compressor unit, a motor unit including a motor, and an inverter unit that drives the motor. The compressor unit, the motor unit, and the inverter unit are lined up in an axial direction of the motor. The motor-driven compressor further includes a housing that accommodates the compressor unit and the motor unit. The inverter unit includes an inverter module. The inverter module includes U-phase, V-phase, and W-phase semiconductor elements that respectively configure U-phase, V-phase, and W-phase arms and a substrate on which the semiconductor elements are bare-chip-mounted. The substrate includes a heat dissipation surface that is thermally connected to the housing. The semiconductor elements are arranged along a contour of the housing.

Abstract: A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two end portions, upright portions each extending from one of the end portions in the thickness direction of an insulating substrate, bent portions each extending continuously with one of the upright portions, and an extension extending continuously with the bent portions. A section of the extension is embedded in the housing.

Abstract: An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.

Abstract: A frequency band compression method, using Time Compression, for use with a frequency division multiplex (FDM) signal carrying voice signal. On the transmission end, the multiplexed signal is divided into a plurality of time segments, each segment having a certain duration, then deleting a part of the each segment and time-expanding the remaining part of the segment by a sawtooth variable delay, thus lowering the frequency of the signal to a predetermined ratio. On the receive end, the signal segments are compressed by a corresponding variable delay, thus making the received frequency higher and reproducing the original multiplexed voice signals.