Patents by Inventor Hirosi Okayama

Hirosi Okayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board having excellent heat-radiating property
    Patent number: 6294244
    Abstract: A wiring board of the present invention is equipped with an insulating board formed of a sintered product of silicon nitride containing a silicon nitride crystal phase, and a metal circuit formed on said insulating board, wherein said sintered product of silicon nitride contains a rare earth element (RE) and magnesium in a total amount of from 4 to 30 mol % calculated as oxides and at a molar ratio (RE2O3/MgO) calculated as oxides of from 0.1 to 15, and has a relative density of not smaller than 90% and a heat conductivity of not smaller than 50 W/m·K. The wiring board is equipped with the insulating board having very excellent heat-radiating property and a large strength, and is very useful as a wiring board for, for example, power modules.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: September 25, 2001
    Assignee: Kyocera Corporation
    Inventors: Toshihiro Iwaida, Teruhisa Makino, Masanobu Ishida, Tomohide Hasegawa, Hirosi Okayama